Abstract: The present invention relates to an optical assembly comprising a first optical circuit and a second optical circuit. The invention further relates to an optical device in which the first and second optical circuit are fixedly connected to each other. In addition, the present invention relates to a method for manufacturing the optical device. According to the invention, flexible waveguide ends of waveguides on the second optical circuit are used that extend upwards from the second optical circuit to optically couple to waveguides on the first optical circuit.

Abstract: The present invention relates to an optical assembly comprising a first optical circuit and a second optical circuit. The invention further relates to an optical device in which the first and second optical circuit are fixedly connected to each other. In addition, the present invention relates to a method for manufacturing the optical device. According to the invention, flexible waveguide ends of waveguides on the second optical circuit are used that extend upwards from the second optical circuit to optically couple to waveguides on the first optical circuit.

Abstract: A structure for a photonic integrated circuit, comprising: a substrate; a first portion of n-type semiconductor material on a first surface area of the substrate, a second portion of n-type semiconductor material on a second surface area of the substrate; a waveguide; and an element between the first portion and the second portion. The waveguide is on and in contact with the element. The element is configured to reduce electric current flow from the first portion to the second portion during propagation of light via the waveguide.

Abstract: A waveguide structure (IOO) for a photonic integrated circuit, comprising: a substrate; an active region (102) comprising a diode junction, the active region comprising: a light emission portion (102a) to emit light in a first direction and a second direction perpendicular the first direction; and a light absorption portion (102b) to absorb light emitted from the light emission portion (102a) in the second direction; a first contact corresponding to the light emission portion (102a); and a second contact corresponding to the light absorption portion (102b).

Abstract: Improved passive optical coupling to photonic integrated circuit (PIC) chips is provided. An interposer unit (108) having one or more flexible optical waveguide members (112, 114, 116) is employed. The flexible optical waveguide members are coupled to the PIC chip (118) via their tips. The PIC chip includes alignment features to facilitate lateral, vertical and longitudinal passive alignment of the flexible optical waveguide members to on-chip optical waveguides of the PIC.

Abstract: Improved passive optical coupling to photonic integrated circuit (PIC) chips is provided. An interposer unit (108) having one or more flexible optical waveguide members (112, 114, 116) is employed. The flexible optical waveguide members are coupled to the PIC chip (118) via their tips. The PIC chip includes alignment features to facilitate lateral, vertical and longitudinal passive alignment of the flexible optical waveguide members to on-chip optical waveguides of the PIC.