Abstract: Semiconductor devices and multiply-accumulate operation devices are disclosed. In one example, a semiconductor device includes synapses in which a nonvolatile variable resistance element taking a first resistance value and a second resistance value lower than the first resistance value and a fixed resistance element having a resistance value higher than the second resistance value are connected in series. An output line outputs a sum of currents flowing through the plurality of synapses.

Abstract: The present invention is a solid-state imaging device including: a semiconductor support substrate; a wiring layer formed on the semiconductor support substrate and including a predetermined metal wiring pattern; a photoelectric conversion layer provided on the wiring layer and including a plurality of photoelectric conversion elements that are formed in an array to generate charges by photoelectric conversion based on light incident on an incident surface; and a reflective structure disposed corresponding to each of the plurality of photoelectric conversion elements between the predetermined metal wiring pattern and the photoelectric conversion layer, the reflective structure having predetermined electromagnetic characteristics. Among the light incident on the photoelectric conversion layer, the reflective structure condenses and reflects light transmitted through each photoelectric conversion element of the photoelectric conversion layer at and to the photoelectric conversion element.

Abstract: A handheld instrument for endoscope surgery includes a shaft, a jaw, a handle, a phased array ultrasonic sensor, and a signal wiring. The jaw is placed at one end of the shaft and has a holding function. The handle is placed at the other end of the shaft and includes an operation mechanism for operating the jaw. The phased array ultrasonic sensor is mounted on the jaw and has an imaging function. The signal wiring is provided to the shaft and connects the ultrasonic sensor and the handle.

Abstract: [Object] To provide an ultrasonic apparatus having a high transmission strength, high reception sensitivity, reliability, and excellent mass productivity. [Solving Means] An ultrasonic apparatus according to the present technology includes an ultrasonic wave transmitting element and an ultrasonic wave receiving element. The ultrasonic wave transmitting element is arranged on a first surface side of the ultrasonic apparatus and has a structure in which a piezoelectric material layer is sandwiched by an upper electrode and a lower electrode. The ultrasonic wave receiving element is arranged between a second surface opposite to the first surface side of the ultrasonic apparatus and the ultrasonic wave transmitting element and has a MEMS structure.

Abstract: An organic photoelectric conversion element, an imaging device, and an optical sensor, which can detect a plurality of wavelength regions by a single element structure, are provided. The photoelectric conversion element is formed by providing an organic photoelectric conversion portion including two or more types of organic semiconductor materials having different spectral sensitivities between the first and the second electrodes. Wavelength sensitivity characteristics of the photoelectric conversion element change according to a voltage (bias voltage) applied between the first and the second electrodes. The photoelectric conversion element is mounted in the imaging device and the optical sensor.

Abstract: [Object] To provide an ultrasonic user interface device capable of accurately obtaining movement information of a body part. [Solving Means] An ultrasonic user interface device includes a transmission unit and a reception unit. The transmission unit transmits an ultrasonic wave toward an internal tissue of an arm part or a leg part of a user. The plurality of reception units is arranged so as to surround the arm part or the leg part in a circumferential direction of the arm part or the leg part to which the ultrasonic wave is transmitted and that receives, for obtaining movement information of at least a part of the limbs of the user, at least one of an ultrasonic wave obtained when the ultrasonic wave is transmitted through the internal tissue or an ultrasonic wave obtained when the ultrasonic wave is reflected on the internal tissue.

Abstract: An organic photoelectric conversion element, an imaging device, and an optical sensor, which can detect a plurality of wavelength regions by a single element structure, are provided. The photoelectric conversion element is formed by providing an organic photoelectric conversion portion including two or more types of organic semiconductor materials having different spectral sensitivities between the first and the second electrodes. Wavelength sensitivity characteristics of the photoelectric conversion element change according to a voltage (bias voltage) applied between the first and the second electrodes. The photoelectric conversion element is mounted in the imaging device and the optical sensor.

Abstract: [Problem] Provided are a semiconductor device and a multiply-accumulate operation device that enable integration at a higher density by further reducing a mounting area per synapse. [Solution] A semiconductor device including: a plurality of synapses in which a nonvolatile variable resistance element taking a first resistance value and a second resistance value lower than the first resistance value and a fixed resistance element having a resistance value higher than the second resistance value are connected in series; and an output line that outputs a sum of currents flowing through the plurality of synapses. [Selected Drawing] FIG.

Abstract: An ultrasonic array oscillator according to the present technology includes ultrasonic oscillators and semiconductor chips. The ultrasonic oscillators form an array. The semiconductor chips are bonded to the respective ultrasonic oscillators to form impedance matching circuits.

Abstract: [Object] To provide an ultrasonic transducer, a diagnostic ultrasonic probe, a surgical instrument, a sheet-type ultrasonic probe, and an electronic apparatus by which both of favorable reflection characteristics and suppression of reverberation at low cost can be achieved. [Solving Means] An ultrasonic transducer for ultrasonic imaging according to the present technology includes a piezoelectric layer, an acoustic attenuation layer, and an acoustic reflection layer. The piezoelectric layer is formed of a piezoelectric material and generates ultrasonic waves. The acoustic attenuation layer is formed of an acoustic attenuation material having an acoustic impedance lower than that of the piezoelectric material. The acoustic reflection layer is arranged on a side of the acoustic attenuation layer and which is formed of an acoustic reflection material having an acoustic impedance higher than that of the acoustic attenuation material, the side being opposite to the piezoelectric layer.

Abstract: [Object] An object of the present technology is to provide a handheld instrument for endoscope surgery having an ultrasonic imaging function with a practicable spatial resolution. [Solving Means] A handheld instrument for endoscope surgery according to the present technology includes: a shaft; a jaw; a handle; a phased array ultrasonic sensor; and a signal wiring. The jaw is placed at one end of the shaft and has a holding function. The handle is placed at the other end of the shaft and includes an operation mechanism for operating the jaw. The phased array ultrasonic sensor is mounted on the jaw and has an imaging function. The signal wiring is provided to the shaft and connects the ultrasonic sensor and the handle.

Abstract: An organic photoelectric conversion element, an imaging device, and an optical sensor, which can detect a plurality of wavelength regions by a single element structure, are provided. The photoelectric conversion element is formed by providing an organic photoelectric conversion portion including two or more types of organic semiconductor materials having different spectral sensitivities between the first and the second electrodes. Wavelength sensitivity characteristics of the photoelectric conversion element change according to a voltage (bias voltage) applied between the first and the second electrodes. The photoelectric conversion element is mounted in the imaging device and the optical sensor.

Abstract: An organic photoelectric conversion element, an imaging device, and an optical sensor, which can detect a plurality of wavelength regions by a single element structure, are provided. The photoelectric conversion element is formed by providing an organic photoelectric conversion portion including two or more types of organic semiconductor materials having different spectral sensitivities between the first and the second electrodes. Wavelength sensitivity characteristics of the photoelectric conversion element change according to a voltage (bias voltage) applied between the first and the second electrodes. The photoelectric conversion element is mounted in the imaging device and the optical sensor.

Abstract: [Object] To provide an array-type ultrasonic vibrator, which is excellent in productivity and practicability and has a two-dimensional array structure capable of improving a focusing property of an ultrasonic beam in a slice direction, an ultrasonic probe, an ultrasonic catheter, a hand-held surgical instrument, and a medical apparatus. [Solving Means] An array-type ultrasonic vibrator according to an embodiment of the present technology includes a vibrator array and a resistor. The vibrator array is a vibrator array in which ultrasonic vibrator elements constitute a two-dimensional array including a plurality of element rows in which a plurality of ultrasonic vibrator elements are arranged in a slice direction. The resistor is electrically connected between a pair of arbitrary ultrasonic vibrator elements in the element row.

Abstract: An organic photoelectric conversion element, an imaging device, and an optical sensor, which can detect a plurality of wavelength regions by a single element structure, are provided. The photoelectric conversion element is formed by providing an organic photoelectric conversion portion including two or more types of organic semiconductor materials having different spectral sensitivities between the first and the second electrodes. Wavelength sensitivity characteristics of the photoelectric conversion element change according to a voltage (bias voltage) applied between the first and the second electrodes. The photoelectric conversion element is mounted in the imaging device and the optical sensor.

Abstract: An organic photoelectric conversion element, an imaging device, and an optical sensor, which can detect a plurality of wavelength regions by a single element structure, are provided. The photoelectric conversion element is formed by providing an organic photoelectric conversion portion including two or more types of organic semiconductor materials having different spectral sensitivities between the first and the second electrodes. Wavelength sensitivity characteristics of the photoelectric conversion element change according to a voltage (bias voltage) applied between the first and the second electrodes. The photoelectric conversion element is mounted in the imaging device and the optical sensor.

Abstract: [Object] To provide a semiconductor device including a protection circuit that exhibits satisfactory performance even in a small area, an ultrasonic image pickup device, a semiconductor device manufacturing method, and and an ultrasonic imaging system. [Solving Means] The semiconductor device according to the present technology includes an integrated circuit formed on an SOI substrate including a silicon substrate formed of crystalline silicon, a BOX layer laminated on the silicon substrate, and an SOI layer laminated on the BOX layer, the semiconductor device including: a protection circuit; and an element separation region. The protection circuit constitutes the integrated circuit and includes a semiconductor region having the same crystal orientation as the silicon substrate. The element separation region penetrates the SOI substrate and separates the protection circuit.

Abstract: [Object] To provide an ultrasonic array oscillator, a method of producing an ultrasonic array oscillator, an ultrasonic probe, and an ultrasonic diagnostic apparatus having a high impedance matching effect and excellent productivity. [Solving Means] The ultrasonic array oscillator according to the present technology includes ultrasonic oscillators (130) and semiconductor chips (140). The ultrasonic oscillators (130) form an array. The semiconductor chips (140) are bonded to the respective ultrasonic oscillators (130) to form impedance matching circuits.

Abstract: An imaging system and an electronic apparatus are provided and include an image pickup device including a plurality of pixels; a variable filter provided on a light receiving face of the image pickup device, the variable filter is configured to selectively transmit incident light; wherein the image pickup device is coupled to the variable filter via an anisotropic conductive film and a connection bump.

Abstract: Provided is a light receiving/emitting element and a light receiving/emitting apparatus that can be easily manufactured and allow high-sensitivity detection. The light receiving/emitting element is configured to include a first organic photoelectric conversion unit and a second organic photoelectric conversion unit that is disposed on the first organic photoelectric conversion unit and is different in spectral sensitivity from the first organic photoelectric conversion unit, wherein one of the first organic photoelectric conversion unit and the second organic photoelectric conversion unit acts as a light receiving unit and the other acts as a light emitting unit. The light receiving/emitting apparatus is configured to have the light receiving/emitting element mounted thereon.