Patents by Inventor Rui Wu

Rui Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11310922
    Abstract: A board-to-board connecting structure which adds no significant thickness to a single printed circuit board includes a first circuit board and a second circuit board. The first circuit board includes first circuit substrate, adhesive layer, and second circuit substrate. The first circuit substrate includes first base layer, first inner wiring layer with first pad, and first outer wiring layer defining a receiving space. The second circuit substrate includes insulating layer and two second outer wiring layers. A conductive via in the second circuit substrate connects the two second outer wiring layers. The second circuit board includes second base layer and also two third outer wiring layers each with a second pad. The second circuit board is laterally disposed in the receiving space and one second pad connects to the conductive via and the other to the first pad.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: April 19, 2022
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Rui-Wu Liu, Man-Zhi Peng
  • Publication number: 20220087020
    Abstract: Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.
    Type: Application
    Filed: November 29, 2021
    Publication date: March 17, 2022
    Inventors: MAN-ZHI PENG, RUI-WU LIU, MING-JAAN HO
  • Publication number: 20220061167
    Abstract: A board-to-board connecting structure which adds no significant thickness to a single printed circuit board includes a first circuit board and a second circuit board. The first circuit board includes first circuit substrate, adhesive layer, and second circuit substrate. The first circuit substrate includes first base layer, first inner wiring layer with first pad, and first outer wiring layer defining a receiving space. The second circuit substrate includes insulating layer and two second outer wiring layers. A conductive via in the second circuit substrate connects the two second outer wiring layers. The second circuit board includes second base layer and also two third outer wiring layers each with a second pad. The second circuit board is laterally disposed in the receiving space and one second pad connects to the conductive via and the other to the first pad.
    Type: Application
    Filed: September 22, 2020
    Publication date: February 24, 2022
    Inventors: RUI-WU LIU, MAN-ZHI PENG
  • Patent number: 11252818
    Abstract: A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: February 15, 2022
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Rui-Wu Liu, Ming-Jaan Ho, Lei Zhou, Man-Zhi Peng
  • Patent number: 11223231
    Abstract: The present disclosure relates to a charging system and a charging method for an automatic force detection robot for a gas pipeline. The charging system includes a primary charging unit disposed outside the gas pipeline and a secondary charging unit disposed in the gas pipeline, wherein the primary charging unit includes a primary magnetic core and a primary coil wound on the primary magnetic core, the secondary charging unit includes a secondary magnetic core and a secondary coil wound on the secondary magnetic core, the primary magnetic core and the secondary magnetic core form a closed magnetic field line, the primary coil is connected to a power supply, and the secondary coil is connected to a battery of the robot.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: January 11, 2022
    Inventors: Shunli Gao, Xiaxi Li, Zandong Han, Jiabao Zhang, Linlin Xing, Qingyu Wang, Shengguo Li, Yao Liu, Rui Wu, Na Ni
  • Patent number: 11221745
    Abstract: A content displaying method according to an embodiment includes: displaying windows allocated to users on a touch panel; displaying pieces of content input from the users on the windows; and displaying thumbnails on the windows, wherein the displaying of the thumbnails includes displaying pieces of content displayed on all windows in the thumbnails.
    Type: Grant
    Filed: January 2, 2017
    Date of Patent: January 11, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Fulong Wang, Rui Wu, Yingying Jiang, Zhenbo Luo, Li Zhang
  • Patent number: 11205644
    Abstract: An electronic package is provided, including: a first substrate having a first insulating portion; a first electronic component disposed on the first substrate; a second substrate having a second insulating portion and stacked on the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate. The first insulating portion of the first substrate differs in rigidity from the second insulating portion of the second substrate. As such, during a high temperature process, one of the first substrate and the second substrate pulls at the other to bend toward the same direction, thereby reducing warpage deviation of the overall electronic package. The present invention further provides a method for fabricating the electronic package.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: December 21, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chi-Rui Wu, Fu-Tang Huang, Chia-Cheng Chen, Chun-Hsien Lin, Hsuan-Hao Mi, Yu-Cheng Pai
  • Publication number: 20210389561
    Abstract: A four-piece infrared single wavelength lens system includes, in order from the object side to the image side: a first lens element with a positive refractive power, a stop, a second lens element with a refractive power, a third lens element with a positive refractive power, a fourth lens element with a negative refractive power, wherein a focal length of the first lens element and the second lens element combined is f12, a focal length of the third lens element and the fourth lens element combined is f34, and they satisfy the relation: 0.2<f12/f34<1.4. Such a system has a wide field of view, large stop, short length and less distortion.
    Type: Application
    Filed: June 14, 2020
    Publication date: December 16, 2021
    Inventor: Kun-Rui WU
  • Publication number: 20210373048
    Abstract: A probe head includes upper and lower die units, and a linear probe inserted therethrough and thereby defined with tail, body and head portions. A first bottom surface of the upper die unit and a second top surface of the lower die unit face each other, thereby defining an inner space wherein the body portion is located and includes a plurality of sections each having front width larger than or equal to back width, including a narrowest section whose upper and lower ends have a distance from the first bottom surface and the second top surface respectively. The head and tail portions are offset from each other along two horizontal axes and the body portion is thereby curved. The present invention is favorable in dynamic behavior control of the linear probe which is easy in manufacturing, lower in cost and has more variety in material.
    Type: Application
    Filed: May 25, 2021
    Publication date: December 2, 2021
    Applicant: MPI Corporation
    Inventors: TZU-YANG CHEN, CHIN-YI LIN, CHEN-RUI WU, SHENG-YU LIN, MING-TA HSU, CHIA-JU WEI
  • Publication number: 20210359546
    Abstract: The present disclosure relates to a charging system and a charging method for an automatic force detection robot for a gas pipeline. The charging system includes a primary charging unit disposed outside the gas pipeline and a secondary charging unit disposed in the gas pipeline, wherein the primary charging unit includes a primary magnetic core and a primary coil wound on the primary magnetic core, the secondary charging unit includes a secondary magnetic core and a secondary coil wound on the secondary magnetic core, the primary magnetic core and the secondary magnetic core form a closed magnetic field line, the primary coil is connected to a power supply, and the secondary coil is connected to a battery of the robot.
    Type: Application
    Filed: March 12, 2019
    Publication date: November 18, 2021
    Inventors: Shunli GAO, Xiaxi LI, Zandong HAN, Jiabao ZHANG, Linlin XING, Qingyu WANG, Shengguo LI, Yao LIU, Rui WU, Na NI
  • Publication number: 20210289628
    Abstract: A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.
    Type: Application
    Filed: June 1, 2021
    Publication date: September 16, 2021
    Inventors: Rui-Wu LIU, Ming-Jaan HO, Man-Zhi PENG
  • Publication number: 20210265894
    Abstract: The present disclosure provides a magnetic suspension bearing stator, a compressor and an air conditioner. The bearing stator includes a frame, a bearing iron core and an axial winding, the frame is provided with an accommodation recess used to position the axial winding. A position-limiting portion is disposed in the accommodation recess, and the position-limiting portion is used to keep the axial winding in the accommodation recess. The frame is provided with a first positioning portion for connecting with the bearing iron core on the outer wall surfaces of both sides of the accommodation recess. The frame is not easy to come out from the bearing core, and the axial winding is not easy to come out from the frame, so that the relative position between the axial winding and the bearing iron core is fixed.
    Type: Application
    Filed: May 13, 2021
    Publication date: August 26, 2021
    Inventors: Chao ZHANG, Fang ZHANG, Gao GONG, Jiuzhan SU, Xin LI, Ruhao DONG, Mingxing DENG, Penghui LIU, Fei WANG, Rui WU, Weijie ZHAO, Zhitao WEI, Jianhui WANG, Dunying ZHONG, Zhanqin LIU
  • Publication number: 20210235581
    Abstract: Disclosure provides an adaptor board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.
    Type: Application
    Filed: April 23, 2019
    Publication date: July 29, 2021
    Inventors: MAN-ZHI PENG, RUI-WU LIU, MING-JAAN HO
  • Publication number: 20210226552
    Abstract: A power converter device includes a first current level, a second current level, a first magnetic layer and a second magnetic layer. The first current level and the second current level are used to load a current loop which has AC current component. The current loop includes a power element module and a conductor coupled to the power element module. The power element module includes at least two electrodes. Voltage among the at least two electrodes is AC voltage. AC current magnitudes of the at least two electrodes are substantially equal and in the opposite direction. The first magnetic layer and the second magnetic layer are used to load a magnetic loop which includes AC magnetic flux component. The first magnetic layer and the second magnetic layer are disposed in two opposite sides of the first current level.
    Type: Application
    Filed: April 9, 2021
    Publication date: July 22, 2021
    Inventors: Jian-Hong ZENG, Xiao-Ni XIN, Rui WU, Min ZHOU, Hao-Yi YE
  • Publication number: 20210208366
    Abstract: A four-piece optical lens system includes, in order from the object side to the image side: a stop; a first lens element with a positive refractive power; a second lens element with a negative refractive power; a third lens element with a positive refractive power; a fourth lens element with a negative refractive power, wherein a focal length of the first lens element and the second lens element combined is f12, a focal length of the third lens element is 13, and they satisfy the relation: 0.6<f12/f3<1.6, such arrangements not only can be applied to a portable electronic product, but also has a long focal length, high pixel and low height. Moreover, the resolution can be improved evidently.
    Type: Application
    Filed: January 6, 2020
    Publication date: July 8, 2021
    Inventor: Kun-Rui WU
  • Patent number: 11051404
    Abstract: A method for connecting stacked circuit boards provides an insulation base as a hollowed annular plate and which has a first surface, a second surface, and a lateral surface. The insulating base defines stepped first grooves on the first surface, stepped second grooves on the second surface, and third grooves on the lateral surface. Insulating base is plated to deposit first pads in the first grooves, second pads in the second grooves, and wiring portions in the third grooves to connect first and second pads. Conductive ink layer is coated on first and second pads, and protective ink layer is coated on wiring portions and insulating base except for first and second pads. First and second circuit boards are provided for attachment to first and second pads respectively. A connecting structure is also provided.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: June 29, 2021
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Rui-Wu Liu, Ming-Jaan Ho, Man-Zhi Peng
  • Publication number: 20210181467
    Abstract: A three-piece infrared single wavelength lens system includes, in order from the object side to the image side: a first lens element with a negative refractive power having an object-side surface being convex near an optical axis and an image-side surface being concave near the optical axis, a stop, a second lens element with a positive refractive power having an image-side surface being convex near the optical axis, at least one of an object-side and the image-side surfaces of the second lens element being aspheric, a third lens element with a refractive power having an object-side surface being convex near the optical axis and an image-side surface being concave near the optical axis, at least one of the object-side and the image-side surfaces of the second and third lens elements being aspheric. Such a system has a wide field of view, large stop, short length and less distortion.
    Type: Application
    Filed: March 1, 2021
    Publication date: June 17, 2021
    Inventor: Kun-Rui WU
  • Patent number: 11018596
    Abstract: A power converter device includes a power element module, a conductor, and a magnetic-conductive assembly. The power element module includes at least two electrodes and a power semiconductor unit. Voltage among these electrodes is AC voltage. The power semiconductor unit includes at least one pure die, and the pure die includes plural surfaces. The surface which occupies the most area of the pure die is the pure die surface. The conductor is coupled to the power element module. A current loop forms between the power element module and the conductor. A magnetic loop forms in the magnetic-conductive assembly. The magnetic-conductive assembly includes a chamber. The current loop passes through the chamber and intersects the magnetic loop to form inductance which the current loop needs. A part of the power element module is disposed in the chamber.
    Type: Grant
    Filed: October 4, 2016
    Date of Patent: May 25, 2021
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Jian-Hong Zeng, Xiao-Ni Xin, Rui Wu, Min Zhou, Hao-Yi Ye
  • Patent number: 10998627
    Abstract: A phase adjustment circuit includes: a local frequency band phase shifter that adjusts a phase of a signal in a local signal frequency band and that outputs the adjusted signal; a frequency-converting mixer that receives the adjusted signal and another signal different from the adjusted signal, and that mixes the adjusted signal with the other signal; and a buffer amplifier that is provided between the local frequency band phase shifter and the frequency-converting mixer, and that is capable of amplifying an input power that is to be input to the frequency-converting mixer so that the input power is up to be in an input power range in which an input-output characteristic of power of the frequency-converting mixer is out of a linear region.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: May 4, 2021
    Assignees: NEC CORPORATION, TOKYO INSTITUTE OF TECHNOLOGY
    Inventors: Kenichi Okada, Keiichi Motoi, Naoki Oshima, Rui Wu, Jian Pang
  • Patent number: 10910300
    Abstract: A method for manufacturing an interposer to connect boards or elements with different pin or pad spacings comprises following steps. A mold with first and second plates is provided. The first plate defines a plurality of first units with a plurality of first holes, the second plate defines a plurality of second units with a plurality of second holes. Space between central lines of adjacent first holes is different from that of adjacent second holes. Conducting wires pass through the first holes and the second holes, and molding compound is injected into the mold to keep the conducting wires in place. A molded plate defining a plurality of plate units is thereby formed, and molded pieces constituting interposers are obtained by cutting the molded plate.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: February 2, 2021
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Man-Zhi Peng, Rui-Wu Liu, Ming-Jaan Ho