Abstract: The disclosed adhesive compositions comprise (A) an isocyanate component comprising (i) an isocyanate and (ii) an isocyanate-terminated silane compound. In some embodiments, the isocyanate-terminated silane compound (ii) is the reaction product of a polyisocyanate and an isocyanate-reactive compound comprising a silane group and at least one isocyanate-reactive group selected from the group consisting of —OH, —SH, and —NHR, where R stands for an alkyl remainder having from 1 to 12 C atoms or a cycloaliphatic or aromatic remainder having between 6 and 12 C atoms. In other embodiments, the isocyanate-terminated silane compound (ii) is the reaction product of a polyisocyanate selected from the group consisting of isophorone diisocyanate, m-xylylene diisocyanate, mixtures thereof, dimers thereof, trimers thereof, prepolymers thereof, and combinations thereof and an isocyanate-reactive compound comprising a silane group and at least one isocyanate-reactive group of —NH2.

Abstract: A purification method of a recovered aluminum melt for an automobile hub includes nitrogen degassing of a gas permeable brick pouring ladle bottom layer arranged on a lower portion of a gas permeable brick pouring ladle and argon degassing of a rotor degasser arranged on an upper portion. The invention has a good degassing and deslagging effect and high purification efficiency, and achieves energy conservation and environmental protection.

Abstract: Disclosed are heterocyclic compounds or their pharmaceutically acceptable salts with ferroptosis-inducing activity, Those compounds or their pharmaceutically acceptable salts can be used to treat cancer.

Abstract: Embodiments include semiconductor processing methods to form low-K films on semiconductor substrates are described. The processing methods may include flowing one or more deposition precursors to a semiconductor processing system, wherein the one or more deposition precursors include a silicon-containing precursor. The silicon-containing precursor may include a carbon chain. The methods may include generating a deposition plasma from the one or more deposition precursors. The methods may include depositing a silicon-and-carbon-containing material on the substrate from plasma effluents of the deposition plasma. The silicon-and-carbon-containing material as-deposited may be characterized by a dielectric constant less than or about 3.0.

Abstract: Embodiments include semiconductor processing methods to form low-? films on semiconductor substrates are described. The processing methods may include flowing one or more deposition precursors to a semiconductor processing system. The one or more deposition precursors may include a silicon-containing precursor that may be a cyclic compound. The methods may include generating a deposition plasma from the one or more deposition precursors. The methods may include depositing a silicon-and-carbon-containing material on the substrate from plasma effluents of the deposition plasma. The silicon-and-carbon-containing material as-deposited may be characterized by a dielectric constant less than or about 3.0.

Abstract: Systems and methods for simulating subterranean regions having multi-scale, complex fracture geometries in a realistic simulation environment, which includes in the modeling process three-dimensional multi-scale rock discontinuities, hydraulic fractures, and heterogenous reservoir properties. Non-intrusive embedded discrete fracture modeling formulations are applied in conjunction with commercial or in-house simulators to efficiently and accurately model subsurface characteristics including three-dimensional geometries having combinations of complex hydraulic fractures and multi-scale rock discontinuities.

Abstract: Exemplary semiconductor processing methods may include providing one or more deposition precursors to a processing region of a semiconductor processing chamber. A semiconductor substrate may be positioned within the processing region. The methods may include forming a layer of low dielectric constant material on the semiconductor substrate. The methods may include purging the processing region of the one or more deposition precursors. A plasma power may be maintained at less than or about 750 W while purging the processing region. The methods may include forming an interface layer on the layer of low dielectric constant material. The methods may include forming a cap layer on the interface layer.

Abstract: A two-component solventless adhesive composition is disclosed. The composition comprises an isocyanate component comprising an isocyanate prepolymer that is the reaction product of a polyisocyanate and an isocyanate reactive component comprising at least 40 wt % of a polyester polyol, based upon the dry weight of the isocyanate reactive component, a polyol component having an average functionality between 2.5 and 4.5 and an average molecular weight between 250 and 1,000, and comprising at least 30 wt % of a polyether polyol, based upon the dry weight of the polyol component, and an adhesion promoter. A method for forming laminates comprising the disclosed adhesive compositions is also disclosed.

Abstract: A solvent-based two-component adhesive composition is disclosed. The adhesive composition comprises an isocyanate component and a polyol component. One or both of the isocyanate component and polyol component comprises at least one butylene oxide-based polyol. The at least one butylene oxide-based polyol can be selected from the group consisting of a polybutylene oxide polyols, polybutylene oxide-propylene oxide copolymer polyols, polybutylene oxide-polyethylene oxide copolymer polyols, and combinations of two or more thereof. A method for forming a laminate is also disclosed. The method comprises forming an adhesive composition, the composition comprising at least one polyol comprising at least one butylene oxide-based polyol, applying a layer of the adhesive composition to a surface of a film, bringing the layer into contact with a surface of another film to form a laminate, and curing the adhesive composition. A laminate formed by this method is also disclosed.

Abstract: Water-based adhesive composition are disclosed, the compositions comprising an acrylic dispersion, an epoxy-terminated polyester incorporated into the acrylic dispersion, and a water-dispersible isocyanate. Methods for laminating a first substrate to a second substrate are also disclosed, the methods comprising (a) providing an acrylic dispersion, (b) providing an epoxy-terminated polyester, (c) mixing the acrylic dispersion and the epoxy-terminated polyester, (d) mixing the mixture of (c) with a water-dispersible isocyanate to form an adhesive composition, (e) coating the adhesive composition of (d) on a surface of the first substrate, (f) drying the adhesive compositions on the first substrate to remove water, and (g) bringing the adhesive composition on the surface of the first substrate into contact with a surface of a second substrate, thereby laminating the first substrate to the second substrate.

Abstract: The disclosed adhesive compositions comprise (A) an isocyanate component comprising an isocyanate-terminated prepolymer that is the reaction product of a polyisocyanate and an isocyanate-reactive mixture comprising a phosphate ester polyol. The disclosed adhesive compositions further comprise (B) an isocyanate-reactive component polyol component comprising a polyol. In some embodiments, methods for preparing two-component adhesives formulations are disclosed comprising preparing an isocyanate component comprising an isocyanate-terminated prepolymer by reacting a polyisocyanate with an isocyanate-reactive mixture comprising a phosphate ester polyol and preparing an isocyanate-reactive component comprising a polyol. The methods further comprise mixing the isocyanate component and the isocyanate-reactive component at a stoichiometric ratio (NCO/OH) of from about 1.0 to about 5.0. Methods for forming laminate structures, and the laminate structures themselves, are also disclosed.

Abstract: The present disclosure provides a process for forming a laminate. The process includes (A) uniformly applying an isocyanate component to a first substrate, the isocyanate component containing an isocyanate compound; (B) uniformly applying an isocyanate-reactive component to a second substrate, the isocyanate-reactive component containing an amine-terminated compound; (C) bringing the first substrate and the second substrate together, thereby mixing and reacting the isocyanate component and the isocyanate-reactive component to form an adhesive composition between the first substrate and the second substrate; (D) curing the adhesive composition to bond the first substrate and the second substrate; and (E) forming the laminate.

Abstract: Disclosed are curable adhesive compositions comprising hydroxyl functional polymers and silane functionalized resins. Such adhesive compositions are capable of providing unexpected properties for various uses and end products. The adhesive may be used for woodworking, automotive, textile, appliances, electronics, bookbinding, and packaging. Suitable substrates can be metal, polymer film, plastics, wood, glass, ceramic, paper, and concrete.

Abstract: Disclosed are silane functionalized rosins having multiple functionalities. Such silane functionalized rosins are curable and thus capable of providing unexpected properties for various uses and end products. Also disclosed are synthetic routes to prepare silane functionalized rosins, which are formulated with hydroxyl functional polymers to provide curable adhesive compositions. The adhesives may be used for woodworking, automotive, textile, appliances, electronics, bookbinding, and packaging. Suitable substrates can be metal, polymer film, plastics, wood, glass, ceramic, paper, and concrete.

Abstract: A two-component adhesive composition is disclosed. The adhesive composition comprises an isocyanate component comprising an isocyanate-terminated prepolymer that is the reaction product of a polyisocyanate and an isocyanate reactive component having an average molecular weight greater than 1,000 that comprises a polyester polyol that is the reaction product of a polyhydric alcohol and a polybasic acid. The NCO content of the isocyanate component is, optionally, between 3 and 9%. The isocyanate reactive component comprises a polyester polyol that accounts for 50 wt % or more of the isocyanate reactive component. The composition further comprises a polyol component comprising polyether polyols having an average molecular weight less than 1,500. The composition still further comprises an adhesion promoter. The average functionality of the adhesive composition is from 2 to 2.4. The adhesive composition provides for improved performance and processability. A method for forming a laminate is also disclosed.

Abstract: A flexible photonic skin is provided, including a functional layer, an adhesive layer used for fixing the functional layer and made of hypoallergenic polyvinyl ethyl ether, and a packaging layer made of a polyurethane semi-transparent film and adhered to the adhesive layer, which are arranged successively from the top down, wherein the functional layer consists of two electrodes located on two sides and used for acquiring electrocardiographic signals of a human body, and a polymer-based photonic integrated chip located between the two electrodes and used for acquiring body temperature, pulse, blood pressure and blood glucose signals of the human body; and, the polymer-based photonic integrated chip processes and outputs the acquired electrocardiographic signals of the human body as well as the body temperature, pulse, blood pressure and blood glucose signals of the human body.

Abstract: A laminating adhesive composition comprising a) an aqueous dispersion of thermoplastic polymer particles imbibed with an epoxy compound wherein the concentration of the epoxy compound is from 1 weight percent to 40 weight percent, based on the total weight of the solid content of the aqueous dispersion; and b) at least one water emulsifiable or water dispersible epoxy curing agent selected from polyamines, polyamides, amidoamines, carboxylic functional polyesters, anhydrides, mercaptans, polymer captans, cyclic amidines, and combinations thereof, is disclosed.

Abstract: This invention relates to adhesive compositions comprising a polyester polyol that includes residues of at least one 2, 2, 4, 4-tetraalkylcyclobutane-1, 3-diol, including, for example, 2, 2, 4, 4-tetramethylcyclobutane-1, 3-diol (TMCD). Adhesive compositions as described herein exhibit enhanced properties as compared to conventional adhesive compositions, and may be suitable for a wide variety of end use applications, including, flexible packaging, woodworking, automotive uses, and electronics.

Abstract: A two-component adhesive composition is disclosed. The adhesive composition comprises an isocyanate component comprising an isocyanate-terminated prepolymer that is the reaction product of a polyisocyanate and an isocyanate reactive component having an average molecular weight less than 1,500. The NCO content of the isocyanate component without solvent is between 9 and 18%. The composition further comprises a polyol component comprising a polyester polyol having a molecular weight greater than 1,500 that is the reaction product of a polyhydric alcohol and a polybasic acid. The composition still further comprises an adhesion promoter. The average functionality of the adhesive composition is from 2 to 2.4. The adhesive composition provides for improved performance and processability at a solid content greater than 45 wt %. A methods of forming the adhesive composition is also disclosed. A laminate formed by this method is also disclosed.