Patents by Inventor Rui-Cheng Wu

Rui-Cheng Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9575415
    Abstract: A method includes loading a wafer onto a wafer stage of a lithography system, the wafer stage comprising a heating component and a temperature sensing component. The method further includes controlling the heating component such that a temperature of the wafer stage approaches a desired point. The controlling step comprises use of a characterization curve associated with the heating component.
    Type: Grant
    Filed: May 22, 2014
    Date of Patent: February 21, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Jui Chen, Rui-Cheng Wu
  • Publication number: 20150338747
    Abstract: A method includes loading a wafer onto a wafer stage of a lithography system, the wafer stage comprising a heating component and a temperature sensing component. The method further includes controlling the heating component such that a temperature of the wafer stage approaches a desired point. The controlling step comprises use of a characterization curve associated with the heating component.
    Type: Application
    Filed: May 22, 2014
    Publication date: November 26, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Jui Chen, Rui-Cheng Wu