Patents by Inventor Ruihua Ding

Ruihua Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10404021
    Abstract: Connector receptacles and connector inserts that may be reliable, may readily manufactured, and may provide high signal quality for high speed signals with minimized signal noise, distortion losses, radiation, and interference. An example may provide a reliable connector receptacle by including a plurality of contacts, where each contact includes a first bend angling a contacting portion away from a tongue and a second bend angling a contacting portion towards the tongue, where the second bend is between the first bend and a front of the connector receptacle. Another example may provide a connector receptacle that may be readily manufactured by providing a tongue having tapered lead-ins for receiving contacting portions of contacts during assembly. Another example may provide a connector receptacle that provides isolation among signals by arranging through-hole portions of signal contacts in lines that are separated from each other by intervening through-hole portions of ground contacts.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: September 3, 2019
    Assignee: Apple Inc.
    Inventors: James M. Jeon, Mahmoud R. Amini, Ruihua Ding, Alex Le Roux
  • Patent number: 10076024
    Abstract: This disclosure relates generally to an electronic assembly and method having a first electrical connection point and a second electrical connection point and a differential interconnect coupling the first electrical connection point to the second electrical connection point, the differential interconnect including first and second transmission traces including a interior edges and a exterior edges opposite the interior edges, the second interior edge facing the first interior edge, and stub traces, each stub trace coupled to one of the first and second transmission traces and projecting from one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge. A substantially equal number of stub traces project from the first exterior edge and the second exterior edge. At least twice as many stub traces project from the first and second exterior edges as project from the first and second interior edges.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: September 11, 2018
    Assignee: Intel Corporation
    Inventors: Ruihua Ding, Min Wang, Mo Liu
  • Publication number: 20180090884
    Abstract: Connector receptacles and connector inserts that may be reliable, may readily manufactured, and may provide high signal quality for high speed signals with minimized signal noise, distortion losses, radiation, and interference. An example may provide a reliable connector receptacle by including a plurality of contacts, where each contact includes a first bend angling a contacting portion away from a tongue and a second bend angling a contacting portion towards the tongue, where the second bend is between the first bend and a front of the connector receptacle. Another example may provide a connector receptacle that may be readily manufactured by providing a tongue having tapered lead-ins for receiving contacting portions of contacts during assembly. Another example may provide a connector receptacle that provides isolation among signals by arranging through-hole portions of signal contacts in lines that are separated from each other by intervening through-hole portions of ground contacts.
    Type: Application
    Filed: September 23, 2016
    Publication date: March 29, 2018
    Applicant: Apple Inc.
    Inventors: James M. Jeon, Mahmoud R. Amini, Ruihua Ding, Alex Le Roux
  • Patent number: 9780497
    Abstract: Combined connector receptacles, examples of which comprise tongues configured to be aligned to openings in a device enclosure; EMI shield contact rails, a central ground plane, a connector receptacle shield to provide isolation between the individual connector receptacles to reduce signal noise; and organizers and other structures arranged to reduce or eliminate damage to through-hole contact portions during their insertion into corresponding openings in a printed circuit board.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: October 3, 2017
    Assignee: Apple Inc.
    Inventors: James M. Jeon, Mahmoud R. Amini, David H. Narajowski, Ruihua Ding, Christopher J. Stringer, Matthew P. Casebolt
  • Publication number: 20170033425
    Abstract: This disclosure relates generally to an electronic assembly and method having a first electrical connection point and a second electrical connection point and a differential interconnect coupling the first electrical connection point to the second electrical connection point, the differential interconnect including first and second transmission traces including a interior edges and a exterior edges opposite the interior edges, the second interior edge facing the first interior edge, and stub traces, each stub trace coupled to one of the first and second transmission traces and projecting from one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge. A substantially equal number of stub traces project from the first exterior edge and the second exterior edge. At least twice as many stub traces project from the first and second exterior edges as project from the first and second interior edges.
    Type: Application
    Filed: June 28, 2016
    Publication date: February 2, 2017
    Inventors: Ruihua Ding, Min Wang, Mo Liu
  • Patent number: 9386690
    Abstract: This disclosure relates generally to an electronic assembly and method having a first electrical connection point and a second electrical connection point and a differential interconnect coupling the first electrical connection point to the second electrical connection point, the differential interconnect including first and second transmission traces including a interior edges and a exterior edges opposite the interior edges, the second interior edge facing the first interior edge, and stub traces, each stub trace coupled to one of the first and second transmission traces and projecting from one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge. A substantially equal number of stub traces project from the first exterior edge and the second exterior edge. At least twice as many stub traces project from the first and second exterior edges as project from the first and second interior edges.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: July 5, 2016
    Assignee: Intel Corporation
    Inventors: Ruihua Ding, Min Wang, Mo Liu
  • Publication number: 20150280778
    Abstract: This disclosure relates generally to an electronic assembly and method having a first electrical connection point and a second electrical connection point and a differential interconnect coupling the first electrical connection point to the second electrical connection point, the differential interconnect including first and second transmission traces including a interior edges and a exterior edges opposite the interior edges, the second interior edge facing the first interior edge, and stub traces, each stub trace coupled to one of the first and second transmission traces and projecting from one of the first interior edge, the first exterior edge, the second interior edge, and the second exterior edge. A substantially equal number of stub traces project from the first exterior edge and the second exterior edge. At least twice as many stub traces project from the first and second exterior edges as project from the first and second interior edges.
    Type: Application
    Filed: March 27, 2014
    Publication date: October 1, 2015
    Inventors: Ruihua Ding, Min Wang, Mo Liu
  • Publication number: 20150191688
    Abstract: The present invention generally relates to nanowires and, in particular, to multiwell plates comprising nanowires, including systems and methods of making the same. Such multiwell plates can, in some cases, be used in automated equipment or high-throughput applications. For example, a plurality of cells may be placed in at least some of the wells of the multiwell plate, and one or more nanowires may be inserted into at least some of the cells within the wells of the multiwell plate. In some cases, one or more of the nanowires may have coated thereon a biological effector. The cells in each of the wells may be identical or different, and/or the biological effector may the same or different. Such multiwell plates may be used, for example, to test a biological effector against a variety of cell types, or to test a variety of biological effectors against a one or more cell types, or the like.
    Type: Application
    Filed: March 15, 2013
    Publication date: July 9, 2015
    Inventors: Hongkun Park, Alexander K. Shalek, Ruihua Ding, Joseph Park
  • Patent number: 8013784
    Abstract: A radar apparatus comprises a substrate having first and second sides, an antenna including radiative elements disposed on the first side of the substrate, a Butler matrix supported by the substrate having input and output ports, where each output port of the Butler matrix is electrically connected to a group of radiative elements, and input connections between a radio-frequency (RF) circuit and the input ports of the Butler matrix. The RF circuit may be supported by the second side of the substrate.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: September 6, 2011
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Alexandros Margomenos, Ruihua Ding
  • Publication number: 20100225539
    Abstract: Examples of the present invention include a radar apparatus comprising a substrate, an antenna disposed on a first side of the substrate, a Butler matrix supported by same the substrate, output ports of the Butler matrix being electrically connected with a group of radiative elements; and input ports configured to be in communication with a radio frequency (RF) circuit. The RF circuit may be supported proximate or adjacent the substrate.
    Type: Application
    Filed: March 3, 2009
    Publication date: September 9, 2010
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Alexandros Margomenos, Ruihua Ding