Patents by Inventor Ruijie Huang

Ruijie Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250096189
    Abstract: An integrated circuit (IC) solder ball mounting apparatus comprises a ball storage unit for storing solder balls, a ball buffer unit configured to receive the solder balls from the ball storage unit in response to one or more pressure-actuated actions, and a gate valve configured to allow the solder balls to transfer to a ball mounting brush configured to place the solder balls onto area array contact structures formed on a wafer containing the integrated circuit.
    Type: Application
    Filed: October 31, 2023
    Publication date: March 20, 2025
    Inventors: Chen Chao, Bo Jiang, Wei Li, Jie Chen, Ruijie Huang, Liang Zheng, Qi Ming Bao, Bin Liu
  • Patent number: D881793
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: April 21, 2020
    Inventor: Ruijie Huang
  • Patent number: D931187
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: September 21, 2021
    Inventor: Ruijie Huang