Abstract: A power amplifier includes at least three amplifiers which receive a first signal, a second signal, and a third signal, respectively. Each of the amplifiers output an amplified signal that includes an amplified version of their respective received signal. The power amplifier further includes a circulator that includes an input port, an output port, and an isolated port. The input port is connected to the output of the first amplifier and the output of the second amplifier and is configured to receive the first amplified signal and the second amplified signal and provide the first amplified signal and the second amplified signal to a load via the output port. The isolated port is connected to the output of the third amplifier and is configured to receive the third amplified signal and provide the third amplified signal to the load via the output port.

Abstract: An electronic element includes a substrate, a first input pad on a first surface of the substrate, at least one chip on the first surface of the substrate, and a first output pad on the first surface of the substrate. The first input pad, the at least one chip, and the first output pad are sequentially connected. The first input pad and the first output pad are in direct physical contact with the first surface of the substrate. A surface of the first input pad facing away from the substrate and a surface of the first output pad facing away from the substrate constitute a partial area of an outer surface of the electronic element.

Abstract: Embodiment of the disclosure relate to power splitter comprising a first separation block comprising an input and a first output, the first separation block being configured to receive an input signal via the input and forward the input signal. The power splitter further comprises a second output and a first non-linear impedance connected to the first separation block. The first non-linear impedance is configured to reflect a reflection signal of the input signal to the first output and forward a forward signal of the input signal to the second output, wherein a power ratio between the reflection signal and the forward signal is based on a configuration of the first non-linear impedance.

Abstract: Embodiments of this application disclose an electronic component and an electronic device, to achieve a three-dimensional stacked structure, reduce an area, and improve heat dissipation. In embodiments of this application, the electronic component includes an upper cover plate, a lower cover plate, and an enclosure frame. The upper cover plate carries a first circuit. The lower cover plate carries a second circuit. The enclosure frame is separately connected to the upper cover plate and the lower cover plate. An interconnection circuit is disposed in the enclosure frame, and the interconnection circuit is configured to implement interconnection between the first circuit and the second circuit. The first circuit and the second circuit overlap in a vertical direction without interfering with each other.

Abstract: An electronic element, a circuit board with an electronic element, and an electronic device are provided. The electronic element includes a substrate and a first input pad, at least one chip, and a first output pad that are disposed on a first surface of the substrate, where the first input pad, the at least one chip, and the first output pad are sequentially connected, the first input pad and the first output pad are directly disposed on the first surface of the substrate, and a surface of the first input pad facing away from the substrate and a surface of the first output pad facing away from the substrate constitute a partial area of an outer surface of the electronic element.