Patents by Inventor Ruiquan Yang

Ruiquan Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240135069
    Abstract: The present disclosure provides a risk assessment method of water inrush in tunnels constructed in water-rich grounds. The method includes the following steps: simulating a tunnel excavation process by finite element software MIDAS GTS NX and fluid-structure interaction; according to a research method of control variables, analyzing effects of a groundwater level, an elastic modulus and advanced pipe shed grouting on the stability of surrounding rock, and improving an algorithm of a radial basis function (RBF) neural network using a Grey Relation Analysis (GRA)-based Partitioning Around Medoid (PAM) clustering algorithm to assess risks of water inrush occurring in Qingdao area.
    Type: Application
    Filed: February 21, 2023
    Publication date: April 25, 2024
    Inventors: Yongjun ZHANG, Fei LIU, Huangshuai XIA, Bin GONG, Sijia LIU, Yingming WU, Qingsong WANG, Hongzhi LIU, Ruiquan LU, Mingdong YAN, Lijun ZHANG, Xiaoming GUAN, Pingan WANG, Shuguang LI, Dengfeng YANG, Weiguo ZHANG
  • Publication number: 20240110479
    Abstract: The present disclosure provides a multi-factor quantitative analysis method for deformation of a neighborhood tunnel. The method includes the following steps: analyzing monitoring data generated at a tunnel site; simulating collapse occurring at a shallow buried section of a tunnel; determining the degree of influence of each factor on the tunnel and a stratum; and determining quantitative influence of each factor on tunnel deformation. The present disclosure can not only provide an accurate theoretical basis for the construction of the shallow buried section of the small-distance tunnel, but also guarantee safety and cost saving during tunnel construction.
    Type: Application
    Filed: February 22, 2023
    Publication date: April 4, 2024
    Inventors: Yongjun ZHANG, Fei LIU, Sijia LIU, Junyi WANG, Bin GONG, Yingming WU, Ruiquan LU, Qingsong WANG, Qinghui XU, Xiaoming GUAN, Mingdong YAN, Xiangyang NI, Pingan WANG, Shuguang LI, Lin YANG, Ning NAN, Dengfeng YANG
  • Patent number: 8633393
    Abstract: A printed circuit board (PCB) is provided. The PCB includes a first microwave board material, a second prepreg, and a third ordinary board material that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: January 21, 2014
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Ruiquan Yang, Haiqiang Sheng, Hongcai Li
  • Publication number: 20100238635
    Abstract: A printed circuit board (PCB) is provided. The PCB includes a first microwave board material, a second prepreg, and a third ordinary board material that are pressed together. The first microwave board material, the second prepreg, and the third ordinary board material are provided with an opening respectively. At least two openings have different sizes. In a region between boundaries of the at least two openings having different sizes, a borehole is provided to pass through the board material in the region. A back-drilled hole is selectively used. A radio-frequency device and a method for manufacturing a PCB are further provided. Thus, it is suitable for designing different power modules and other circuit modules on the same single board, and is compatible with the existing basic PCB manufacturing technologies, which further has a low cost, and can meet the requirements of large-power radio-frequency circuits with different frequencies.
    Type: Application
    Filed: May 27, 2010
    Publication date: September 23, 2010
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ruiquan Yang, Haiqiang Sheng, Hongcai Li