Abstract: A wafer cleaning apparatus and a wafer transfer device. The wafer transfer device includes a machine bracket, a drive mechanism, a retractable bracket, and a plurality of wafer support brackets. The drive mechanism and the retractable bracket are arranged at the machine bracket. An end of the retractable bracket is fixedly connected to the machine bracket. The second end of the retractable bracket is movably arranged at the machine bracket and arranged along the movement direction of the second end. The drive mechanism is connected to the retractable bracket and is configured to drive the second end to move to cause the retractable bracket to retract. The plurality of wafer support brackets are arranged at the retractable bracket. The distance between any two neighboring wafer support brackets changes as the retractable bracket extends and retracts.

Abstract: The present disclosure provides a wafer cleaning apparatus and a wafer transfer device. The wafer transfer device includes a machine bracket, a drive mechanism, a retractable bracket, and a plurality of wafer support brackets. The drive mechanism and the retractable bracket are arranged at the machine bracket. An end of the retractable bracket is fixedly connected to the machine bracket. The second end of the retractable bracket is movably arranged at the machine bracket and arranged along the movement direction of the second end. The drive mechanism is connected to the retractable bracket and is configured to drive the second end to move to cause the retractable bracket to retract. The plurality of wafer support brackets are arranged at the retractable bracket. The distance between any two neighboring wafer support brackets changes as the retractable bracket extends and retracts.

Abstract: The present disclosure provides a wafer chuck in semiconductor cleaning equipment, including a chuck base, a jetting assembly arranged on the chuck base, and a plurality of wafer lifting shafts arranged on the chuck base. The chuck base includes a carrier surface for supporting the wafer. The gas outlet of the jetting assembly is located in the center area of the carrier surface and configured to jet gas between the carrier surface and the wafer. The plurality of wafer lifting shafts are distributed around the gas outlet of the jetting assembly along the circumference of the carrier surface. Each wafer lifting shaft of the plurality of wafer lifting shafts is movable relative to the chuck base, and each wafer lifting shaft includes an inclined platform. The inclined platform includes an inclined extension surface. The inclined extension surface is configured to carry the wafer at the edge of the wafer.

Abstract: A device for holding and rotating a plate shaped article comprises a group of fixed pins and a group of pivot pins arranged along the circumference of the movable base in a manner that each pivot pin opposites a fixed pin, and also comprises magnetic bodies positioned within and outside two opposing sides of the pivot pins. Each of the pivot pins can be driven to rotate around its pivot back and forth under the magnetic repulsive force between two adjacent magnetic bodies, so as to release or clamp the plate shaped article. The present invention has advantages of simple structure, convenient and reliable action control, controllable clamping force and good compatibility with various processing chambers.

Abstract: A device for holding and rotating a plate shaped article comprises a group of fixed pins and a group of pivot pins arranged along the circumference of the movable base in a manner that each pivot pin opposites a fixed pin, and also comprises magnetic bodies positioned within and outside two opposing sides of the pivot pins. Each of the pivot pins can be driven to rotate around its pivot back and forth under the magnetic repulsive force between two adjacent magnetic bodies, so as to release or clamp the plate shaped article. The present invention has advantages of simple structure, convenient and reliable action control, controllable clamping force and good compatibility with various processing chambers.

Abstract: A device for holding disk-shaped articles and a method thereof are provided. The device comprises a rotatable chuck body and at least two groups of clamping elements arranged at the edge of the chuck body. Each of the clamping elements is mounted to a pivot with the chuck body respectively by means of the rotation of the clamping element with respect to the chuck body. A radial compression spring is connected between the bottom of the clamping element and the chuck body to provide a clamping force for the clamping element. The clamping elements in the same group are provided with magnets with the same polarity, while the clamping elements in different groups are provided with magnets with the opposite polarity. Two sets of electromagnets are arranged on the chuck body and spaced apart evenly.

Abstract: The present invention provides an apparatus for manufacturing semiconductor wafer comprising at least two manipulators, at least one set of chemical gas/liquid distribution unit and an air circulating and filtering unit. The air circulating and filtering unit is separated into three regions, including the front region, the middle region, and the side region, which are controlled by respective control electric motors to achieve uniform air flow and uniform pressure in the respective regions. The cleaning degree in the internal of the apparatus can be improved by the regional control of the air circulating and filtering unit; the wafer transport efficiency can be enhanced by the double-armed manipulators having multiple degrees of freedom; and the product yield per unit area can be increased by the chemical gas/liquid distribution unit providing stable and uniform gas/liquid flow and pressure.

Abstract: The present invention discloses a device for holding disk-shaped articles and a method thereof. The device comprises a rotatable chuck body and at least two groups of clamping elements arranged at the edge of the chuck body. Each of the clamping elements is mounted to a pivot with the chuck body respectively by means of the rotation of the clamping element with respect to the chuck body. A radial compression spring is connected between the bottom of the clamping element and the chuck body to provide a clamping force for the clamping element. The clamping elements in the same group are provided with magnets with the same polarity, while the clamping elements in different groups are provided with magnets with the opposite polarity. Two sets of electromagnets are arranged on the chuck body and spaced apart evenly.

Abstract: The present invention provides an apparatus for manufacturing semiconductor wafer comprising at least two manipulators, at least one set of chemical gas/liquid distribution unit and an air circulating and filtering unit. The air circulating and filtering unit is separated into three regions, including the front region, the middle region, and the side region, which are controlled by respective control electric motors to achieve uniform air flow and uniform pressure in the respective regions. The cleaning degree in the internal of the apparatus can be improved by the regional control of the air circulating and filtering unit; the wafer transport efficiency can be enhanced by the double-armed manipulators having multiple degrees of freedom; and the product yield per unit area can be increased by the chemical gas/liquid distribution unit providing stable and uniform gas/liquid flow and pressure.