Patents by Inventor Ruituo WANG

Ruituo WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12281006
    Abstract: A transducer element includes array elements. At least one array element includes a substrate and a first electrode layer, a diaphragm layer, and a second electrode layer that are sequentially stacked thereon. An array element has a working region including working sub-regions, and a peripheral region surrounding the working region; overlapping portions of the first electrode layer, the diaphragm layer and the second electrode layer form cells, and a cell is located in a working sub-region; portions of the diaphragm layer and portions of the first electrode layer that are located in the working sub-regions have cavities therebetween, and the portions of the diaphragm layer are configured to vibrate in a direction perpendicular to the substrate between the first and second electrode layers; two adjacent cavities communicate; the diaphragm layer has release holes located in the peripheral region; and a release hole communicates with at least one cavity.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: April 22, 2025
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yongchun Tao, Ruituo Wang
  • Publication number: 20220289558
    Abstract: A transducer element includes array elements. At least one array element includes a substrate and a first electrode layer, a diaphragm layer, and a second electrode layer that are sequentially stacked thereon. An array element has a working region including working sub-regions, and a peripheral region surrounding the working region; overlapping portions of the first electrode layer, the diaphragm layer and the second electrode layer form cells, and a cell is located in a working sub-region; portions of the diaphragm layer and portions of the first electrode layer that are located in the working sub-regions have cavities therebetween, and the portions of the diaphragm layer are configured to vibrate in a direction perpendicular to the substrate between the first and second electrode layers; two adjacent cavities communicate; the diaphragm layer has release holes located in the peripheral region; and a release hole communicates with at least one cavity.
    Type: Application
    Filed: January 15, 2021
    Publication date: September 15, 2022
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yongchun TAO, Ruituo WANG
  • Patent number: 11288478
    Abstract: A fingerprint identification module, a manufacturing method and driving method thereof, and a display device. The fingerprint identification module includes: a driving backplate, including a substrate, identification circuits on the substrate, the identification circuits having a first electrode pad, a second electrode pad; acoustic units including: a first electrode; a piezoelectric film layer positioned on the side, close to the driving backplate, of the first electrode; a second electrode positioned on the side, close to the driving backplate, of the piezoelectric film layer; a first lead-out terminal electrically connected with the first electrode; a second lead-out terminal electrically connected with the second electrode; cavities being in one-to-one correspondence to the acoustic units, the cavities positioned between the second electrodes and the substrate, and one side face, away from the substrate, of cavity being defined by at least one side face, close to the substrate, of the second electrode.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: March 29, 2022
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Yingming Liu, Haisheng Wang, Xiaoliang Ding, Xiufeng Li, Pengpeng Wang, Chenyang Zhang, Yaqian Ji, Peixiao Li, Jing Liu, Ruituo Wang, Lei Chen
  • Publication number: 20210081634
    Abstract: A fingerprint recognition module and a driving method thereof, and a display device. The fingerprint recognition module includes a substrate, an electrode layer located on one side of the substrate, a piezoelectric film layer located on one side, away from the substrate, of the electrode layer, and a reference electrode layer located on one side, away from the electrode layer, of the piezoelectric film layer, wherein the electrode layer includes a plurality of receiving electrodes arranged in an array and a plurality of transmitting electrodes, and the receiving electrodes and the transmitting electrodes are insulated from each other and are spaced with each other.
    Type: Application
    Filed: March 30, 2020
    Publication date: March 18, 2021
    Inventors: Yingming Liu, Haisheng Wang, Xiaoliang Ding, Pengpeng Wang, Xiufeng Li, Yuzhen Guo, Ruituo Wang
  • Publication number: 20200372231
    Abstract: A fingerprint identification module, a manufacturing method and driving method thereof, and a display device. The fingerprint identification module includes: a driving backplate, including a substrate, identification circuits on the substrate, the identification circuits having a first electrode pad, a second electrode pad; acoustic units including: a first electrode; a piezoelectric film layer positioned on the side, close to the driving backplate, of the first electrode; a second electrode positioned on the side, close to the driving backplate, of the piezoelectric film layer; a first lead-out terminal electrically connected with the first electrode; a second lead-out terminal electrically connected with the second electrode; cavities being in one-to-one correspondence to the acoustic units, the cavities positioned between the second electrodes and the substrate, and one side face, away from the substrate, of cavity being defined by at least one side face, close to the substrate, of the second electrode.
    Type: Application
    Filed: September 17, 2019
    Publication date: November 26, 2020
    Inventors: Yingming LIU, Haisheng WANG, Xiaoliang DING, Xiufeng LI, Pengpeng WANG, Chenyang ZHANG, Yaqian JI, Peixiao LI, Jing LIU, Ruituo WANG, Lei CHEN