Patents by Inventor Ruixuan HUANG

Ruixuan HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device having reduced pad peeling during tensile stress testing and a method of forming thereof
    Patent number: 9396993
    Abstract: The present disclosure relates to a method for forming a semiconductor device. The method includes forming a first aluminum pad layer on a metal layer, forming an adhesion layer on the first aluminum pad layer, etching the adhesion layer so as to form a patterned adhesion layer, and forming a second aluminum pad layer on the first aluminum pad layer and the patterned adhesion layer.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: July 19, 2016
    Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
    Inventors: Xinpeng Wang, Chenglong Zhang, Ruixuan Huang
  • DEVICE HAVING REDUCED PAD PEELING DURING TENSILE STRESS TESTING AND A METHOD OF FORMING THEREOF
    Publication number: 20140374911
    Abstract: The present disclosure relates to a method for forming a semiconductor device. The method includes forming a first aluminum pad layer on a metal layer, forming an adhesion layer on the first aluminum pad layer, etching the adhesion layer so as to form a patterned adhesion layer, and forming a second aluminum pad layer on the first aluminum pad layer and the patterned adhesion layer.
    Type: Application
    Filed: April 18, 2014
    Publication date: December 25, 2014
    Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Xinpeng WANG, Chenglong ZHANG, Ruixuan HUANG