Patents by Inventor Rulon J. Larsen, III
Rulon J. Larsen, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230324436Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.Type: ApplicationFiled: March 21, 2023Publication date: October 12, 2023Applicant: University of Southern CaliforniaInventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
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Patent number: 11630127Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.Type: GrantFiled: April 3, 2020Date of Patent: April 18, 2023Assignee: University of Southern CaliforniaInventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
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Patent number: 11211228Abstract: Embodiments are directed to forming reentrant multi-layer micro-scale or millimeter scale three dimensional structures, parts, components, or devices where each layer is formed from a plurality of deposited materials and more specifically where each layer is formed from at least one metal structural material and at least one organic sacrificial material (e.g. polymer) that are co-planarized and a portion of the sacrificial material located on a plurality of layers is removed after formation of the plurality of layers via one or more plasma etching operations or one or more neutral radical etching operations.Type: GrantFiled: April 10, 2019Date of Patent: December 28, 2021Assignee: Microfabrica Inc.Inventors: Rulon J. Larsen, III, Adam L. Cohen
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Publication number: 20200292579Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.Type: ApplicationFiled: April 3, 2020Publication date: September 17, 2020Applicant: University of Southern CaliforniaInventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
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Patent number: 10641792Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.Type: GrantFiled: December 28, 2018Date of Patent: May 5, 2020Assignee: University of Southern CaliforniaInventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
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Publication number: 20190212364Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.Type: ApplicationFiled: December 28, 2018Publication date: July 11, 2019Applicant: University of Southern CaliforniaInventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
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Patent number: 10297421Abstract: Embodiments are directed to forming reentrant multi-layer micro-scale or millimeter scale three dimensional structures, parts, components, or devices where each layer is formed from a plurality of deposited materials and more specifically where each layer is formed from at least one metal structural material and at least one organic sacrificial material (e.g. polymer) that are co-planarized and a portion of the sacrificial material located on a plurality of layers is removed after formation of the plurality of layers via one or more plasma etching operations.Type: GrantFiled: July 11, 2016Date of Patent: May 21, 2019Assignee: Microfabrica Inc.Inventors: Rulon J. Larsen, III, Adam L. Cohen
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Patent number: 10215775Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.Type: GrantFiled: December 31, 2015Date of Patent: February 26, 2019Assignee: University of Southern CaliforniaInventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
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Publication number: 20180080956Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.Type: ApplicationFiled: December 31, 2015Publication date: March 22, 2018Inventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
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Patent number: 9919472Abstract: Embodiments are directed to methods of producing devices using modified multi-layer, multi-material electrochemical fabrication processes and/or using a laser cutting processes wherein individual layers or layer groups are formed and then stacked and bonded to produce prototypes or production parts. The methods can reduce the cost and lead time of prototyping when compared with previous multi-layer, multi-material electrochemical fabrication processes and can also reduce the lead time of production quantities, by allowing multiple layers of a multilayer device to be formed simultaneously, e.g. in parallel on the same wafer. Additionally, these methods may be used to extend the maximum height to which parts may practically be made. Finally, the methods allow geometries that are impossible, impractical or difficult to release (e.g. microfluidic devices such as pumps or parts with long, narrow channels) to be fabricated in multiple pieces and then joined after full or partial release.Type: GrantFiled: May 16, 2014Date of Patent: March 20, 2018Assignee: Microfabrica Inc.Inventors: Adam L. Cohen, Michael S. Lockard, Rulon J. Larsen, III, Uri Frodis, Kieun Kim, Dennis R. Smalley
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Patent number: 9671429Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that (1) partially coats the surface of the structure, (2) completely coats the surface of the structure, and/or (3) completely coats the surface of structural material of each layer from which the structure is formed including interlayer regions. These embodiments incorporate both the core material and the shell material into the structure as each layer is formed along with a sacrificial material that is removed after formation of all layers of the structure. In some embodiments the core material may be a material that would be removed with sacrificial material if it were accessible by an etchant during removal of the sacrificial material.Type: GrantFiled: September 4, 2013Date of Patent: June 6, 2017Assignee: University of Southern CaliforniaInventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
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Publication number: 20160231356Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.Type: ApplicationFiled: December 31, 2015Publication date: August 11, 2016Inventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley
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Publication number: 20140134453Abstract: Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that (1) partially coats the surface of the structure, (2) completely coats the surface of the structure, and/or (3) completely coats the surface of structural material of each layer from which the structure is formed including interlayer regions. These embodiments incorporate both the core material and the shell material into the structure as each layer is formed along with a sacrificial material that is removed after formation of all layers of the structure. In some embodiments the core material may be a material that would be removed with sacrificial material if it were accessible by an etchant during removal of the sacrificial material.Type: ApplicationFiled: September 4, 2013Publication date: May 15, 2014Applicant: Microfabrica Inc.Inventors: Ming Ting Wu, Rulon J. Larsen, III, Young Kim, Kieun Kim, Adam L. Cohen, Ananda H. Kumar, Michael S. Lockard, Dennis R. Smalley