Patents by Inventor Run HONG

Run HONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device comprising a can housing a semiconductor die which is embedded by an encapsulant
    Patent number: 11817418
    Abstract: A semiconductor device includes a conductive can include a flat portion and at least one peripheral rim portion extending from an edge of the flat portion, a semiconductor die comprising a first main face and a second main face opposite to the first main face, a first contact pad disposed on the first main face and a second contact pad disposed on the second main face, wherein the first contact pad is electrically connected to the flat portion of the can, an electrical interconnector connected with the second contact pad, and an encapsulant disposed under the semiconductor die so as to surround the electrical interconnector, wherein an external surface of the electrical interconnector is recessed from an external surface of the encapsulant.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: November 14, 2023
    Assignee: Infineon Technologies AG
    Inventors: Wei Lee Lim, Run Hong Toh, Peng Liang Yeap
  • FORWARDING DOMAIN ALLOCATION METHOD AND APPARATUS, STORAGE MEDIUM, AND ELECTRONIC DEVICE
    Publication number: 20220131719
    Abstract: Provided are a forwarding domain allocation method and device, a storage medium, and an electronic device. The method may includes: acquiring target messages from different input ports, the number of the acquired target messages being greater than or equal to the number of input ports; acquiring identifier information carried in the target message; and on the basis of the identifier information carried in the target message, allocating a forwarding domain to the target message.
    Type: Application
    Filed: November 18, 2019
    Publication date: April 28, 2022
    Inventors: Haiqing XU, Run HONG, Jie ZHOU, Guoliang ZHAO, Wengang WANG
  • Semiconductor Device Comprising a Can Housing a Semiconductor Die which is Embedded by an Encapsulant
    Publication number: 20210159204
    Abstract: A semiconductor device includes a conductive can include a flat portion and at least one peripheral rim portion extending from an edge of the flat portion, a semiconductor die comprising a first main face and a second main face opposite to the first main face, a first contact pad disposed on the first main face and a second contact pad disposed on the second main face, wherein the first contact pad is electrically connected to the flat portion of the can, an electrical interconnector connected with the second contact pad, and an encapsulant disposed under the semiconductor die so as to surround the electrical interconnector, wherein an external surface of the electrical interconnector is recessed from an external surface of the encapsulant.
    Type: Application
    Filed: November 24, 2020
    Publication date: May 27, 2021
    Inventors: Wei Lee Lim, Run Hong Toh, Peng Liang Yeap