Abstract: The invention relates to a carrier frame for a load in the form of a rucksack or equivalent comprising a hip frame which is more rigid in the vertical direction than in the horizontal direction and a pair of chest frames. The hip frame is designed to be applied around the user's hips in order to transfer loads to the carrier's hip region. The chest frames extend from the hip frame upwards in front of the user's body and are fully or partially in contact with the user's chest area, below the user's collar bone but above the user's waist. The chest frames are each provided with a chest plate in order to distribute the pressure over a greater area when applied to the user's chest area and to reduce the pressure per unit area on the user's chest.

Abstract: The invention relates to a carrier frame for a load in the form of a rucksack or equivalent comprising a hip frame which is more rigid in the vertical direction than in the horizontal direction and a pair of chest frames. The hip frame is designed to be applied around the user's hips in order to transfer loads to the carrier's hip region. The chest frames extend from the hip frame upwards in front of the user's body and are fully or partially in contact with the user's chest area, below the user's collar bone but above the user's waist. The chest frames are each provided with a chest plate in order to distribute the pressure over a greater area when applied to the user's chest area and to reduce the pressure per unit area on the user's chest. The chest frames also extend above the user's shoulders essentially without being in contact with them. The chest frames also extend behind the user's head and are flexibly connected to each other at a position behind and/or above the nape of the user's neck.

Abstract: A device for integrating and indicating a parameter over, comprising: a first electrode (2), a second electrode (3), an electrolyte (5), which is in contact with the first electrode and in consuming contact with a consumption portion (6) of the second electrode, at least two indicators (I1, I2, I3), which are connected to the consumption portion (6) at a respective connecting point (P1, P2, P3). The electrolyte (5) and the consumption portion (6) are selected such that when a voltage is applied over the electrodes (2, 3), the consumption portion (6) is consumed at a predetermined rate, wherein the indicators (I1, I2, I3) are arranged to switch states in response to a consumption frontier (F1, F2) of the consumption portion reaching or passing a connecting point (P1, P2, P3) associated with the respective indicator (I1, I2, I3), wherein at least one of the indicators is a binary (on/off) indicator.

Abstract: A device for integrating and indicating a parameter over, comprising: a first electrode (2), a second electrode (3), an electrolyte (5), which is in contact with the first electrode and in consuming contact with a consumption portion (6) of the second electrode, at least two indicators (I1, I2, I3), which are connected to the consumption portion (6) at a respective connecting point (P1, P2, P3). The electrolyte (5) and the consumption portion (6) are selected such that when a voltage is applied over the electrodes (2, 3), the consumption portion (6) is consumed at a predetermined rate, wherein the indicators (I1, I2, I3) are arranged to switch states in response to a consumption frontier (F1, F2) of the consumption portion reaching or passing a connecting point (P1, P2, P3) associated with the respective indicator (I1, I2, I3), wherein at least one of the indicators is a binary (on/off) indicator.

Abstract: A module comprising one or more chips and a carrier. The invention is characterised in that the carrier (6) supports a conductive layer (7) that includes a number of conductors; in that chips (2-5; 10; 27-30) are mounted directly on conductive layer (7) of the carrier (6); in that said chips (2-5; 10, 27-30) are connected electrically directly to the conductor system (7); and in that the carrier-supported conductive layer includes terminals (8,9) in the form of solder balls or corresponding devices disposed on the same side of the carrier (6) as said chips.