Abstract: An electronic package and a manufacturing method thereof are provided, in which a supporting structure having a supporting body is disposed on a carrying structure and is in contact with or in proximity to an electronic component, and a barrier structure is disposed on the supporting body, such that the electronic component is exposed from an opening of the barrier structure. Furthermore, a thermal conduction layer is formed on the electronic component exposed from the opening of the barrier structure, and the barrier structure blocks or surrounds the thermal conduction layer on the electronic component, thereby preventing the thermal conduction layer from overflowing.

Abstract: An electronic package and a manufacturing method thereof are provided, in which a dam is surrounding an electronic component on a carrier structure, the electronic component is encapsulated by a thermal conduction layer, and the electronic component, the dam and the thermal conduction layer are covered by a heat sink, such that the dam strongly supports the heat sink to effectively disperse the thermal stress, so as to effectively control the warpage of the heat sink to prevent the problem of delamination from occurring between the heat sink and the thermal conduction layer.

Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure, and an antenna structure is stacked on the carrier structure via conductors, where at least one through hole is formed on and penetrating through the antenna structure, and an insulating support body is formed between the carrier structure and the antenna structure, so that the insulating support body is correspondingly formed at the through hole and/or an edge of the antenna structure, and the through hole is free from being filled up by the insulating support body, such that the through hole has an air medium. The design of the through hole allows the characteristic of the dielectric constant of air being 1 to be utilized so as to reduce the signal loss and the signal offset, thereby facilitating the signal transmission of the antenna body.

Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.

Abstract: An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.

Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

Abstract: An electronic package is disclosed. An antenna board is stacked on a circuit board. A frame is formed on the circuit board. A supporter disposed between the antenna board and the circuit board is secured in the frame. In a packaging process, the frame ensures that the antenna board and the circuit board are separated at a distance that complies with a requirement, and that the antenna function of the antenna board can function normally.

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.

Abstract: A package stacked structure and a method for fabricating the same are provided. The method includes providing a wiring structure disposed with a carrier and a carrier structure provided with an electronic component. The wiring structure is bonded to the carrier structure via a plurality of conductive elements. An encapsulating layer is formed between the wiring structure and the carrier structure and encapsulates the conductive elements and the electronic component. The carrier is then removed. With the arrangement of the carrier, the structural strength of the wiring structure is improved, and warpage of the wiring structure is prevented before stacking the wiring structure onto the carrier structure.

Abstract: An electronic package and a method for fabricating the same are provided. A resist layer and a support are formed on a first substrate having a first antenna installation area. A second substrate having a second antenna installation area is laminated on the resist layer and the support. The resist layer is then removed. The support keeps the first substrate apart from the second substrate at a distance to ensure that the antenna transmission between the first antenna installation area and the second antenna installation area can function normally.

Abstract: An electronic package and a method for fabricating the same are provided. The method includes stacking an antenna board on a circuit board, and disposing between the antenna board and the circuit board a supporting body securing the antenna board and the circuit board. As such, during a packaging process, the distance between the antenna board and the circuit board is kept unchanged due to the supporting body, thus ensuring that the antenna board operates properly and improving the product yield.

Abstract: The present disclosure provides a package stack structure and a method for manufacturing the same. The method is characterized by stacking coreless circuit portions on the board of an electronic component to reduce the overall thickness of the package stack structure.