Abstract: A semiconductor device includes a substrate, a semiconductor die mounted on and electrically connected to the substrate, and first and second encapsulants that are different from each other. The first encapsulant covers the die and at least part of the substrate. The second encapsulant covers the first encapsulant and a portion of the substrate that is not covered by the first encapsulant.

Abstract: The invention relates to a laminate structure (30) for a chip card (31), comprising a base layer (35), a chip module (32) accommodated at least partially in the base layer, and at least one cover layer (39) that covers the base layer, wherein an intermediate space (61) formed between the chip module and the cover layer as well as between the chip module and the base layer is filled with an adhesive material, wherein the adhesive material generates adhesive forces with respect to the wetted surfaces of the base layer and of the cover layer and generates adhesive forces with respect to the wetted surfaces of the chip module as well.