Patents by Inventor Rungthiwa Methaapanon

Rungthiwa Methaapanon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carrier ring structure and chamber systems including the same
    Patent number: 10242848
    Abstract: A carrier ring for use in a chamber implemented for depositing films and chambers that use the carrier ring are provided. The carrier ring has an annular disk shape with an outer edge side and a wafer edge side. The carrier ring has a top carrier ring surface that extends between the outer edge side to the wafer edge side. The wafer edge side includes a lower carrier ring surface that is lower than the top carrier ring surface. The wafer edge side also includes a plurality of contact support structures. Each contact support structure is located at an edge of the lower carrier ring surface and has a height that is between the lower carrier ring surface and the top carrier ring surface, and the contact support structure has tapered edges and corners. A step is defined between the top carrier ring surface and the lower carrier ring surface, such that a top facing edge is disposed at a top of the step and a lower inner edge is disposed at the bottom of the step.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: March 26, 2019
    Assignee: Lam Research Corporation
    Inventors: Eli Jeon, Nick Ray Linebarger, Jr., Sirish Reddy, Alice Hollister, Rungthiwa Methaapanon
  • Carrier Ring Structure and Chamber Systems Including the Same
    Publication number: 20160172165
    Abstract: A carrier ring for use in a chamber implemented for depositing films and chambers that use the carrier ring are provided. The carrier ring has an annular disk shape with an outer edge side and a wafer edge side. The carrier ring has a top carrier ring surface that extends between the outer edge side to the wafer edge side. The wafer edge side includes a lower carrier ring surface that is lower than the top carrier ring surface. The wafer edge side also includes a plurality of contact support structures. Each contact support structure is located at an edge of the lower carrier ring surface and has a height that is between the lower carrier ring surface and the top carrier ring surface, and the contact support structure has tapered edges and corners. A step is defined between the top carrier ring surface and the lower carrier ring surface, such that a top facing edge is disposed at a top of the step and a lower inner edge is disposed at the bottom of the step.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 16, 2016
    Inventors: Eli Jeon, Nick Ray Linebarger, JR., Sirish Reddy, Alice Hollister, Rungthiwa Methaapanon