Patents by Inventor Runhui Huang
Runhui Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240070436Abstract: A method is provided for data processing performed by a processing system. The method comprises determining a set of first tokens for first data and a set of second token for second data, each token comprising information associated with a segment of the respective data, determining pair-wise similarities between the set of first tokens and the set of second tokens, each pair comprising a first token in the set of first tokens and a second token in the set of second tokens, determining, for each first token in the set of first tokens, a maximum similarity based on the determined pair-wise similarities between the respective first token and the second tokens in the set of second tokens, and determining a first similarity between the first data and the second data by aggregating the maximum similarities corresponding to the first tokens in the set of first set of tokens.Type: ApplicationFiled: August 31, 2022Publication date: February 29, 2024Inventors: Hang XU, Lu HOU, Guansong LU, Minzhe NIU, Zhenguo LI, Runhui HUANG, Lewei YAO, Chunjing XU, Xiaodan LIANG
-
Publication number: 20220041810Abstract: A high-temperature-stable spin-on-carbon (“SOC”) material that fills topography features on a substrate while planarizing the surface in a one-step, thin layer coating process is provided. The material comprises low molecular weight polyimides or diimides that are pre-imidized in solution rather than on the wafer. The SOC layers can survive harsh CVD conditions and are also SC1 resistant, especially on TiN and SiOx surfaces.Type: ApplicationFiled: August 6, 2021Publication date: February 10, 2022Inventors: Xing-Fu Zhong, Runhui Huang, Gu Xu, Sean Simmons, Daniel Sweat, Jakub Koza
-
Patent number: 10854451Abstract: Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating process are provided. The compositions can planarize wide ranges of substrates with vias or trenches of from about 20 nm to about 220 nm wide, and up to about 700 nm deep. These extraordinary properties come from the low molecular weight of the polymers used in the materials, thermally-labile protecting groups on the polymers, and a delayed crosslinking reaction.Type: GrantFiled: June 21, 2016Date of Patent: December 1, 2020Assignee: Brewer Science, Inc.Inventors: Xing-Fu Zhong, Runhui Huang, Boyu Zhang
-
Publication number: 20160372326Abstract: Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating process are provided. The compositions can planarize wide ranges of substrates with vias or trenches of from about 20 nm to about 220 nm wide, and up to about 700 nm deep. These extraordinary properties come from the low molecular weight of the polymers used in the materials, thermally-labile protecting groups on the polymers, and a delayed crosslinking reaction.Type: ApplicationFiled: June 21, 2016Publication date: December 22, 2016Inventors: Xing-Fu Zhong, Runhui Huang, Boyu Zhang
-
Patent number: 9482951Abstract: This invention describes compositions and methods of using non-covalently crosslinked resin coatings for lithographic applications. These materials are designed to undergo, after coating, a change that provides solvent resistance and, with some materials, simultaneous aqueous-base solubility. Non-covalent interactions allow for easier removal of these coatings than of covalently crosslinked materials. These types of materials are well-suited for trench and gap fill applications, as well as for anti-reflective coatings, spin-on carbon layers, and etch masks.Type: GrantFiled: July 28, 2008Date of Patent: November 1, 2016Assignee: Brewer Science Inc.Inventors: Daniel M. Sullivan, Runhui Huang, Charles J. Neef, Jinhua Dai, Michael B. Swope
-
Patent number: 7754818Abstract: New anti-reflective or fill compositions having improved flow properties are provided. The compositions comprise a dendritic polymer dispersed or dissolved in a solvent system, and preferably a light attenuating compound, a crosslinking agent, and a catalyst. The inventive compositions can be used to protect contact or via holes from degradation during subsequent etching in the dual damascene process. The inventive compositions can also be applied to substrates (e.g., silicon wafers) to form anti-reflective coating layers having high etch rates which minimize or prevent reflection during subsequent photoresist exposure and developing.Type: GrantFiled: January 11, 2005Date of Patent: July 13, 2010Assignee: Brewer Science Inc.Inventors: Chelladurai Devadoss, Mandar Bhave, Runhui Huang
-
Patent number: 7745540Abstract: New anti-reflective or fill compositions having improved flow properties are provided. The compositions comprise a dendritic polymer dispersed or dissolved in a solvent system, and preferably a light attenuating compound, a crosslinking agent, and a catalyst. The inventive compositions can be used to protect contact or via holes from degradation during subsequent etching in the dual damascene process. The inventive compositions can also be applied to substrates (e.g., silicon wafers) to form anti-reflective coating layers having high etch rates which minimize or prevent reflection during subsequent photoresist exposure and developing.Type: GrantFiled: September 7, 2007Date of Patent: June 29, 2010Assignee: Brewer Science Inc.Inventors: Chelladurai Devadoss, Mandar Bhave, Runhui Huang
-
Publication number: 20090035590Abstract: This invention describes compositions and methods of using non-covalently crosslinked resin coatings for lithographic applications. These materials are designed to undergo, after coating, a change that provides solvent resistance and, with some materials, simultaneous aqueous-base solubility. Non-covalent interactions allow for easier removal of these coatings than of covalently crosslinked materials. These types of materials are well-suited for trench and gap fill applications, as well as for anti-reflective coatings, spin-on carbon layers, and etch masks.Type: ApplicationFiled: July 28, 2008Publication date: February 5, 2009Inventors: Daniel M. Sullivan, Runhui Huang, Charles J. Neef, Jinhua Dai, Michael B. Swope
-
Publication number: 20080213544Abstract: New anti-reflective or fill compositions having improved flow properties are provided. The compositions comprise a dendritic polymer dispersed or dissolved in a solvent system, and preferably a light attenuating compound, a crosslinking agent, and a catalyst. The inventive compositions can be used to protect contact or via holes from degradation during subsequent etching in the dual damascene process. The inventive compositions can also be applied to substrates (e.g., silicon wafers) to form anti-reflective coating layers having high etch rates which minimize or prevent reflection during subsequent photoresist exposure and developing.Type: ApplicationFiled: September 7, 2007Publication date: September 4, 2008Inventors: Chelladurai Devadoss, Mandar Bhave, Runhui Huang
-
Patent number: 6670425Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.Type: GrantFiled: June 5, 2001Date of Patent: December 30, 2003Assignee: Brewer Science, Inc.Inventors: Rama Puligadda, James E. Lamb, III, Tony D. Flaim, Runhui Huang, Xie Shao
-
Patent number: 6663916Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.Type: GrantFiled: June 18, 2002Date of Patent: December 16, 2003Assignee: Brewer Science, Inc.Inventors: Rama Puligadda, James E. Lamb, III, Tony D. Flaim, Runhui Huang, Xie Shao
-
Patent number: 6653411Abstract: Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., —CH2—, —CH2—O—CH2—) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values and can be formulated for both conformal and planar applications.Type: GrantFiled: October 24, 2001Date of Patent: November 25, 2003Assignee: Brewer Science, Inc.Inventors: Rama Puligadda, Runhui Huang
-
Publication number: 20030065164Abstract: Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., —CH2—, —CH2—O—CH2—) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values and can be formulated for both conformal and planar applications.Type: ApplicationFiled: October 24, 2001Publication date: April 3, 2003Applicant: BREWER SCIENCE, INC.Inventors: Rama Puligadda, Runhui Huang
-
Patent number: 6524708Abstract: Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., —CH2—, —CH2—O—CH2—) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values, improved etch rates, and can be formulated for both conformal and planar applications.Type: GrantFiled: October 10, 2001Date of Patent: February 25, 2003Assignee: Brewer Science, Inc.Inventors: Rama Puligadda, Runhui Huang
-
Patent number: 6512084Abstract: Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., —CH2—, —CH2—O—CH2—) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values, improved etch rates, and can be formulated for both conformal and planar applications.Type: GrantFiled: April 12, 2002Date of Patent: January 28, 2003Assignee: Brewer Science, Inc.Inventors: Rama Puligadda, Runhui Huang
-
Publication number: 20030004283Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.Type: ApplicationFiled: June 5, 2001Publication date: January 2, 2003Inventors: Rama Puligadda, James E. Lamb, Tony D. Flaim, Runhui Huang, Xie Shao
-
Publication number: 20020198333Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.Type: ApplicationFiled: June 18, 2002Publication date: December 26, 2002Inventors: Rama Puligadda, James E. Lamb, Tony D. Flaim, Runhui Huang, Xie Shao
-
Publication number: 20020161175Abstract: Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., —CH2—, —CH2—O—CH2—) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values, improved etch rates, and can be formulated for both conformal and planar applications.Type: ApplicationFiled: April 12, 2002Publication date: October 31, 2002Inventors: Rama Puligadda, Runhui Huang
-
Patent number: 6432611Abstract: Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., —CH2—, —CH2—O—CH2—) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values and can be formulated for both conformal and planar applications.Type: GrantFiled: October 18, 2000Date of Patent: August 13, 2002Assignee: Brewer Science, Inc.Inventors: Rama Puligadda, Runhui Huang
-
Patent number: 6403152Abstract: Improved anti-reflective coating compositions for use in integrated circuit manufacturing processes and methods of forming these compositions are provided. Broadly, the compositions are formed by heating a solution comprising a compound including specific compounds (e.g., alkoxy alkyl melamines, alkoxy alkyl benzoguanamines) under acidic conditions so as to polymerize the compounds and form polymers having an average molecular weight of at least about 1,000 Daltons. The monomers of the resulting polymers are joined to one another via linkage groups (e.g., —CH2—, —CH2—O—CH2—) which are bonded to nitrogen atoms on the respective monomers. The polymerized compound is mixed with a solvent and applied to a substrate surface after which it is baked to form an anti-reflective layer. The resulting layer has high k values and can be formulated for both conformal and planar applications.Type: GrantFiled: October 18, 2000Date of Patent: June 11, 2002Assignee: Brewer Science, Inc.Inventors: Rama Puligadda, Runhui Huang