Abstract: A device for testing overall anchorage performance of a basalt fiber reinforced plastic (BFRP) anchor cable includes an anchor cable anchoring system and a data acquisition system. The anchor cable anchoring system includes a test bed, BFRP arranged over the test bed, and a distributed optical fiber bonded to a surface of the BFRP, the test bed being provided with an anchoring section at one end and an outer anchoring section at the other end, the anchoring section anchors one end of the BFRP, and the outer anchoring section anchors the other end of the BFRP. The data acquisition system includes a modem and a grating connected to two ends of the distributed optical fiber in series, and a center hole jack and a dynamometer arranged between the outer anchoring section and an end of the test bed, and the BFRP penetrates the center hole jack and the dynamometer.

Abstract: A display module includes a circuit board, an integrated chip, and a pixel chipset. The integrated chip is electrically connected to the circuit board, and the integrated chip includes a first chiplet and a plurality of display pixel drive circuits integrated into the first chiplet. The pixel chipset includes a plurality of light-emitting chips. In addition, at least one pixel chipset is disposed on a surface of a side that is of an integrated chip and that is away from the circuit board, a light-emitting chip disposed on the integrated chip is electrically connected to a display pixel drive circuit in the integrated chip, and the display pixel drive circuit is configured to drive the light-emitting chip to emit light.

Abstract: A rapid construction device for a prestressed basalt fiber anchor rod, includes a sleeve drill rod and a drill bit; the sleeve drill rod includes an inner and an outer cylinders; a middle of the drill bit is connected to a lower end of the inner cylinder, an edge of the drill is connected to a lower end of the outer cylinder, a constraint hole is defined in the middle of the drill bit for allowing a basalt fiber reinforced plastic (BFRP) penetrating therethrough, a magnetic baffle is arranged at a lower end of the constraint hole to shield the constraint hole, and a plurality of through holes are defined in the drill bit; and the BFRP is pushed to push off the magnetic baffle to lower the BFRP to a set position, and then a space between the inner and outer cylinders is grouted.

Abstract: A display module includes a circuit board, an integrated chip, and a pixel chipset. The integrated chip is electrically connected to the circuit board, and the integrated chip includes a first chiplet and a plurality of display pixel drive circuits integrated into the first chiplet. The pixel chipset includes a plurality of light-emitting chips. In addition, at least one pixel chipset is disposed on a surface of a side that is of an integrated chip and that is away from the circuit board, a light-emitting chip disposed on the integrated chip is electrically connected to a display pixel drive circuit in the integrated chip, and the display pixel drive circuit is configured to drive the light-emitting chip to emit light.

Abstract: An integral tension test system for a large-tonnage basalt fiber anchor cable includes: a plurality of basalt fiber anchoring bars each comprising a basalt fiber reinforced plastic (BFRP) bundle, a steel strand, a first and a second steel casing pipes, the BFRP bundle including a plurality of BFRPs, and a grating array temperature, stress and vibration sensing optical cables bonded in the BFRP; a vibration table and a reaction frame arranged thereon, wherein the first steel casing pipe of the basalt fiber anchoring bar is located in the reaction frame, the steel strand penetrates one end of the reaction frame to be connected to a center hole jack, and the second steel casing pipe of each basalt fiber anchor cable is located outside the reaction frame to be anchored; and a data acquisition module connected to all of the grating array temperature, stress and vibration sensing optical cables.

Abstract: A package structure includes a second substrate. A second component is connected to the second substrate, and at least a part of the second component is connected to the second connecting rod through the second heat dissipation block, so that heat of the at least a part of the second component can be further transferred to the second connecting rod through the second heat dissipation block, and then transferred, through the second connecting rod, to the second substrate or another structure connected to the second connecting rod. In this way, the heat of the second component is transferred out, and heat conduction paths of the second component are increased.

Abstract: A rapid construction device for a prestressed basalt fiber anchor rod, includes a sleeve drill rod and a drill bit; the sleeve drill rod includes an inner and an outer cylinders; a middle of the drill bit is connected to a lower end of the inner cylinder, an edge of the drill is connected to a lower end of the outer cylinder, a constraint hole is defined in the middle of the drill bit for allowing a basalt fiber reinforced plastic (BFRP) penetrating therethrough, a magnetic baffle is arranged at a lower end of the constraint hole to shield the constraint hole, and a plurality of through holes are defined in the drill bit; and the BFRP is pushed to push off the magnetic baffle to lower the BFRP to a set position, and then a space between the inner and outer cylinders is grouted.

Abstract: An integral tension test system for a large-tonnage basalt fiber anchor cable includes: a plurality of basalt fiber anchoring bars each comprising a basalt fiber reinforced plastic (BFRP) bundle, a steel strand, a first and a second steel casing pipes, the BFRP bundle including a plurality of BFRPs, and a grating array temperature, stress and vibration sensing optical cables bonded in the BFRP; a vibration table and a reaction frame arranged thereon, wherein the first steel casing pipe of the basalt fiber anchoring bar is located in the reaction frame, the steel strand penetrates one end of the reaction frame to be connected to a center hole jack, and the second steel casing pipe of each basalt fiber anchor cable is located outside the reaction frame to be anchored; and a data acquisition module connected to all of the grating array temperature, stress and vibration sensing optical cables.

Abstract: An integrated anchoring structure of basalt fiber reinforced plastic (BFRP) bars for a reservoir bank slope includes: a plurality of BFRP anchoring bars, where each of the BFRP anchoring bars includes a plurality of BFRP bars bonded to one another, a lower steel casing pipe, an upper steel casing pipe and a steel strand bonded to an upper portion of the upper steel casing pipe and aligned with the BFRP bars, and a grating array temperature sensing optical cable, a grating array stress sensing optical cable and a grating array vibration sensing optical cable are bonded in each of the BFRP bars; a plurality of shear-resistant bricks distributed on structural planes; a pouring base arranged at a bottom of the anchoring borehole; and an anchoring section arranged at an upper portion of the pouring base.

Abstract: A device for testing overall anchorage performance of a basalt fiber reinforced plastic (BFRP) anchor cable includes an anchor cable anchoring system and a data acquisition system. The anchor cable anchoring system includes a test bed, BFRP arranged over the test bed, and a distributed optical fiber bonded to a surface of the BFRP, the test bed being provided with an anchoring section at one end and an outer anchoring section at the other end, the anchoring section anchors one end of the BFRP, and the outer anchoring section anchors the other end of the BFRP. The data acquisition system includes a modem and a grating connected to two ends of the distributed optical fiber in series, and a center hole jack and a dynamometer arranged between the outer anchoring section and an end of the test bed, and the BFRP penetrates the center hole jack and the dynamometer.

Abstract: The wireless headset includes a main control module. The main control module includes a rigid-flexible circuit board, a first substrate, a first support member, and a plurality of chips. The rigid-flexible circuit board includes a rigid board portion and a first flexible board portion and a second flexible board portion that are connected to the rigid board portion. The rigid board portion is located in the earbud portion. The first flexible board portion is located in the earbud portion and has one end connected to the rigid board portion. One end of the second flexible board portion is connected to the rigid board portion and the other end thereof extends to the ear handle portion. A plurality of layers of components are stacked on the rigid board portion of the wireless headset, so that component integration degree is high.

Abstract: A method for identifying a potential landslide hazard of a reservoir bank based on a rock mass degradation feature, includes: determining a remote sensing interpretation identification mark of a potential landslide hazard site induced by rock mass degradation of a hydro-fluctuation belt of a bank slope, and establishing a potential landslide hazard site catastrophe evolution identification model; obtaining an orthoimage of a degradation belt, performing preliminary remote sensing interpretation on the orthoimage, and delineating an area prone to landslide; obtaining an oblique real-scene three-dimensional model of the area prone to landslide by the orthoimage, generating digital elevation model (DEM) data according to the oblique real-scene three-dimensional model for remote sensing fine interpretation, and identifying and extracting the mark; and inputting the mark into the potential landslide hazard site catastrophe evolution identification model to identify a catastrophe evolution mode of the potential lan

Abstract: A device comprising a connecting plate and a circuit element is disclosed. The circuit element is electrically coupled to the connecting plate through a solder connection including a plurality of solder balls disposed between the circuit element and the connecting plate. An underfill layer is formed between the circuit element and the connecting plate and configured to provide bonding between the circuit element and the connecting plate. The solder connection includes a first solder area with a first solder ball density and a second solder area with a second solder ball density. The first solder ball density is less than the second solder ball density. The underfill layer includes a bonding material continuously disposed in the second solder area of the solder connection.

Abstract: A high-reliability electronic packaging structure includes a plurality of packaging layers and mechanical support layers. An electrically functional solder joint is provided in a first area of each of the packaging layers, and any two adjacent packaging layers are coupled using electrically functional solder joints. A mechanical support layer is disposed in a second area of each of the packaging layers, and the mechanical support layer is configured to support the two adjacent packaging layers. The first area is provided on a periphery of the second area. Hence, a problem that an internal silicon chip at an upper packaging layer or a lower packaging layer fractures and fails when the upper packaging layer or the lower packaging layer is subject to a mechanical load can be resolved.

Abstract: A crack detection system and an apparatus equipped with a crack detection circuit, including a main body, and a detection control circuit and a detection coil disposed on the main body. The main body includes a top surface, a bottom surface, and a side surface coupled between the top surface and the bottom surface. The detection coil is distributed on an edge of the main body and disposed surrounding the side surface. Two ends of the detection coil are electrically coupled to the detection control circuit to form a closed-loop detection circuit. The detection circuit is configured to detect a crack in an edge region of the main body. The detection coil includes a plurality of detection sections sequentially coupled from head-to-tail, and adjacent detection sections are not collinear.

Abstract: A device comprising a connecting plate and a circuit element is disclosed. The circuit element is electrically coupled to the connecting plate through a solder connection including a plurality of solder balls disposed between the circuit element and the connecting plate. An underfill layer is formed between the circuit element and the connecting plate and configured to provide bonding between the circuit element and the connecting plate. The solder connection includes a first solder area with a first solder ball density and a second solder area with a second solder ball density. The first solder ball density is less than the second solder ball density. The underfill layer includes a bonding material continuously disposed in the second solder area of the solder connection.

Abstract: A crack detection system and an apparatus equipped with a crack detection circuit, including a main body, and a detection control circuit and a detection coil disposed on the main body. The main body includes a top surface, a bottom surface, and a side surface coupled between the top surface and the bottom surface. The detection coil is distributed on an edge of the main body and disposed surrounding the side surface. Two ends of the detection coil are electrically coupled to the detection control circuit to form a closed-loop detection circuit. The detection circuit is configured to detect a crack in an edge region of the main body. The detection coil includes a plurality of detection sections sequentially coupled from head-to-tail, and adjacent detection sections are not collinear.

Abstract: A crack detection system and an apparatus equipped with a crack detection circuit, including a main body, and a detection control circuit and a detection coil disposed on the main body. The main body includes a top surface, a bottom surface, and a side surface coupled between the top surface and the bottom surface. The detection coil is distributed on an edge of the main body and disposed surrounding the side surface. Two ends of the detection coil are electrically coupled to the detection control circuit to form a closed-loop detection circuit. The detection circuit is configured to detect a crack in an edge region of the main body. The detection coil includes a plurality of detection sections sequentially coupled from head-to-tail, and adjacent detection sections are not collinear.

Abstract: A high-reliability electronic packaging structure includes a plurality of packaging layers and mechanical support layers. An electrically functional solder joint is provided in a first area of each of the packaging layers, and any two adjacent packaging layers are coupled using electrically functional solder joints. A mechanical support layer is disposed in a second area of each of the packaging layers, and the mechanical support layer is configured to support the two adjacent packaging layers. The first area is provided on a periphery of the second area. Hence, a problem that an internal silicon chip at an upper packaging layer or a lower packaging layer fractures and fails when the upper packaging layer or the lower packaging layer is subject to a mechanical load can be resolved.

Abstract: A package for power converters in which all parts are electrically connected with one multi-layer circuit board. A sub-package with at least a power-dissipating chip, having a bare top up-facing heat-slug is electrically connected with the board by a plurality of symmetric leads. A heat spreader is directly attached onto the bare top heat-slug of the sub-packages, planar magnetic parts and top surfaces of other components with thermally conductive insulator. The heat dissipated by the sub-packages is transferred to the attached heat spreader by the bare top heat-slug, and further transferred to the ambient. The assembly features compact and inexpensive power converter package with improved electrical performance and enhanced thermal management.