Patents by Inventor Ruochen REN

Ruochen REN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230121507
    Abstract: Aspects concern an allocation system (100), comprising a receiving unit (114) configured to receive a delivery order having a cash flow value of cash money and configured to determine cash on hand value of a plurality of delivery drivers (DD), respectively, a subset (132, 134, 136) generator unit (116), communicatively coupled with the receiving unit (114), configured to generate at least a subset (132, 134, 136) of the plurality of delivery drivers (DD) based on the cash flow value of the delivery order and the cash on hand value of each delivery driver (DD); and a transmitter unit (118) configured to transmit the delivery order only to the delivery drivers of the subset (132, 134, 136).
    Type: Application
    Filed: March 23, 2020
    Publication date: April 20, 2023
    Inventors: Hendra Teja WIRAWAN, Keqi HUANG, Chunlei LIU, Mayank SANCHETI, Junpeng NIU, Ruochen REN
  • Publication number: 20210407796
    Abstract: Examples of the application provide a method for manufacturing a semiconductor and a multi-piece deposition device. The method for manufacturing the semiconductor includes: performing a first-round deposition process on a substrate in the multi-piece deposition device; taking out the substrate after the first-round deposition process is completed; introducing an auxiliary gas into the multi-piece deposition device, and forming plasmas from the auxiliary gas; placing a substrate to be deposited in the multi-piece deposition device; and performing a second-round deposition process on the substrate in the multi-piece deposition device. The auxiliary gas is introduced and converted into the plasmas in a time interval of waiting time between the first-round deposition process and the second-round deposition process.
    Type: Application
    Filed: September 13, 2021
    Publication date: December 30, 2021
    Inventors: Hsiang-Tung TSENG, Xiankun DUAN, Ruochen REN