Abstract: Various embodiments disclosed herein provide for an improved method for sensing the temperature at an individual sensor location that is both small in size, and the temperature can be determined independent of the temperature of the Temperature Management Controller (TMC). The method includes determining the temperature at the temperature sensing element or circuit based on a function of two voltages measured at the temperature sensing element. In a first embodiment, the two voltages are measured at two transistors that are each being supplied with the same current. In another embodiment, the temperature sensing element includes a single transistor that is supplied with two different currents at different times, and the voltages are measured at the same current, with each of the two voltages being measured based on the two currents being supplied to the transistor.

Abstract: The present application discloses a temperature control plate and a Measurement method for the temperature control plate for cold-chain transportation. The temperature control plate for cold-chain transportation comprises a phase-change gel, a vacuum-sealing bag, a sealed plastic box, and an RFID passive temperature sensor tag. The phase-change gel is filled in the vacuum-sealing bag, and a supporting frame is embedded in the phase-change gel. The RFID passive temperature sensor tag is embedded in the phase-change gel. The vacuum-sealing bag is packed in the sealed plastic box, and the sealed plastic box is externally labeled with a tag identifier. The vacuum-sealing bag is a PET vacuum-sealing bag, and the sealed plastic box is a PET sealed plastic box.

Abstract: A heat dissipation device includes a phase-change accumulator, a water cooler, and a heat conduction cavity. The water cooler comprises a heat absorption mechanism. A top and a bottom of the heat absorption mechanism are fixedly mounted respectively to the phase-change accumulator and the heat conduction cavity. The heat conduction cavity is made of red copper and is attachable to a CPU. The heat conduction cavity is filled with water, and a ratio of a volume of the water within the heat conduction cavity to a volume of the heat conduction cavity is 0.2˜0.9. The phase-change accumulator is filled with a phase-change material.

Abstract: Various embodiments disclosed herein provide for an improved method for sensing the temperature at an individual sensor location that is both small in size, and the temperature can be determined independent of the temperature of the Temperature Management Controller (TMC). The method includes determining the temperature at the temperature sensing element or circuit based on a function of two voltages measured at the temperature sensing element. In a first embodiment, the two voltages are measured at two transistors that are each being supplied with the same current.

Abstract: The present application discloses a temperature control plate and a Measurement method for the temperature control plate for cold-chain transportation. The temperature control plate for cold-chain transportation comprises a phase-change gel, a vacuum-sealing bag, a sealed plastic box, and an RFID passive temperature sensor tag. The phase-change gel is filled in the vacuum-sealing bag, and a supporting frame is embedded in the phase-change gel. The RFID passive temperature sensor tag is embedded in the phase-change gel. The vacuum-sealing bag is packed in the sealed plastic box, and the sealed plastic box is externally labeled with a tag identifier. The vacuum-sealing bag is a PET vacuum-sealing bag, and the sealed plastic box is a PET sealed plastic box.

Abstract: A temperature control cup includes a cup body and a cup cover, and the cup cover is covered on the cup body. The cup body is provided with a cup outer shell, a cup middle shell, and a cup inner wall in order from the outside to the inside. A vacuum heat insulation layer is provided between the cup shell and the cup middle shell. A gas getter is provided in the vacuum heat insulation layer at the bottom of the cup body. A phase change material layer is provided between the middle shell and the inner wall of the cup body. The bottom center of the cup shell is recessed inward with a small through-hole, and the through-hole is sealed with glass after melting at high temperatures.