Abstract: A method is used for forming sliders for use in a disc drive actuation system. The method comprises providing a wafer formed of a substrate having a base coat and an overcoat. Wafer-level notch lanes having a first width extend across the wafer in a first direction. The overcoat is removed from the wafer-level notch lanes. The wafer is sliced along a portion of the wafer-level lanes through the base coat to form a channel. The wafer is mechanically sliced through the substrate along slice lanes that extend across the wafer in the first direction to differentiate the wafer into bars. The bars are cut in a second direction substantially perpendicular to the first direction to form the sliders.