Patents by Inventor Rupinder S. Mand

Rupinder S. Mand has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High temperature-low leakage probe apparatus and method of manufacturing same
    Patent number: 8854072
    Abstract: In one embodiment, the present invention includes an apparatus for contacting a plurality of contact locations of a semiconductor device. The apparatus includes a housing, a support member, a plurality of probe members, and an adhesive substance. The housing has a plurality of apertures that provides a low leakage pathway for high frequency signals to reach the semiconductor device through the plurality of probe members. The plurality of probe members are aligned on the support member and the adhesive substance secures the plurality of probe members to the supporting member. The housing, supporting member, and adhesive substance match in thermal expansion to reduce the error in alignment between the plurality of contact locations and the plurality of probe members over a temperature variance.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: October 7, 2014
    Inventors: Hai Dau, Rupinder S. Mand, Jaspreet Singh, John Williamson
  • High Temperature- Low Leakage Probe Apparatus and Method of Manufacturing Same
    Publication number: 20120306524
    Abstract: In one embodiment, the present invention includes an apparatus for contacting a plurality of contact locations of a semiconductor device. The apparatus includes a housing, a support member, a plurality of probe members, and an adhesive substance. The housing has a plurality of apertures that provides a low leakage pathway for high frequency signals to reach the semiconductor device through the plurality of probe members. The plurality of probe members are aligned on the support member and the adhesive substance secures the plurality of probe members to the supporting member. The housing, supporting member, and adhesive substance match in thermal expansion to reduce the error in alignment between the plurality of contact locations and the plurality of probe members over a temperature variance.
    Type: Application
    Filed: June 3, 2011
    Publication date: December 6, 2012
    Applicant: Spire Manufacturing, Inc.
    Inventors: Hai Dau, Rupinder S. Mand, Jaspreet Singh, John Williamson