Abstract: A holding tool for fixing an electronic component (2) during a manufacturing process, the electronic component (2) comprising a winding assembly (20) and an electronic circuit (24), wherein the holding tool (1) includes a holding tool body (10), first and second jaws (12, 14) disposed at the holding tool body (10) relatively movable to each other in a first direction (A), and first and second wire guide means (3, 4) characterized in that the first and second wire guide means (3, 4) are disposed at the holding tool body (10) remote from the jaws (12, 14).

Abstract: A method of manufacturing an electronic component comprising an integrated circuit and a core, includes the steps of providing the integrated circuit having at least two accessible contacts, providing the core, assembling the integrated circuit and the core together by means of an adhesive substance, winding a wire on the core in order to produce a winding, bonding or soldering a first end of the wire to a first one of said contacts and bonding or soldering a second end of the wire to a second one of said contacts.

Abstract: A holding tool for fixing an electronic component (2) during a manufacturing process, said electronic component (2), comprising a winding assembly (20) and an electronic circuit (24), the holding tool (1) comprising a holding tool body (10), first an second jaws (12, 14) disposed at the holding tool body (10) relatively movable to each other in a first direction (A) and first and second wire guide means (3, 4) is characterized in that said first an second wire guide means (3, 4) are disposed at the holding tool body (10) remote from the jaws (12, 14).