Patents by Inventor Rurng-Chien Chang

Rurng-Chien Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Magnetic filtration for slurry used in chemical mechanical polishing of semiconductor wafers
    Patent number: 6238279
    Abstract: A method and apparatus for filtering a slurry used in a chemical mechanical polishing apparatus is disclosed. Magnets are provided along the piping network between a slurry reservoir and the CMP apparatus. A magnet may also be placed adjacent to the slurry reservoir to prevent iron oxide particles from traveling with the slurry to the CMP apparatus. The magnets attract iron oxide particles from the slurry and remove those particles from the slurry prior to polishing. This reduces the amount of defects caused by the iron oxide particles in the slurry.
    Type: Grant
    Filed: June 3, 1999
    Date of Patent: May 29, 2001
    Assignees: ProMOS Technologies, Inc., Mosel Vitelic, Inc., Infineon Technologies AG
    Inventors: Feng-Yeu Shau, Rurng-Chien Chang, Champion Yi
  • Two-slurry CMP polishing with different particle size abrasives
    Patent number: 6227949
    Abstract: A method for chemical mechanical polishing (CMP) of a wafer having a top layer to be polished is disclosed. The method comprises the steps of: using a CMP apparatus to polish the top layer using a first slurry having abrasive particles of a first size; and using the CMP apparatus to polish the top layer using a second slurry having abrasive particles of a second size, the second size being smaller than the first size.
    Type: Grant
    Filed: June 3, 1999
    Date of Patent: May 8, 2001
    Assignee: ProMOS Technologies, Inc.
    Inventors: Champion Yi, Rurng-Chien Chang, Jiun-Fang Wang