Abstract: A capacitive proximity measurement system may include a sensor electrode configured to be positioned proximate to a conductive measurement area on a test surface of a sample, a plate connector configured to provide an electrical connection between a system ground and a conductive plate parallel to the test surface, and a controller. A measurement circuit may be formed between the sensor electrode and the conductive plate, where the test surface is electrically floating with respect to the sensor electrode and the conductive plate. The controller may further adjust a voltage of the sensor electrode with respect to the conductive plate, determine a capacitance associated with the measurement circuit, and determine a distance between the electrode and the measurement area based on the capacitance associated with the measurement circuit.

Abstract: A capacitive proximity measurement system may include a sensor electrode configured to be positioned proximate to a conductive measurement area on a test surface of a sample, a plate connector configured to provide an electrical connection between a system ground and a conductive plate parallel to the test surface, and a controller. A measurement circuit may be formed between the sensor electrode and the conductive plate, where the test surface is electrically floating with respect to the sensor electrode and the conductive plate. The controller may further adjust a voltage of the sensor electrode with respect to the conductive plate, determine a capacitance associated with the measurement circuit, and determine a distance between the electrode and the measurement area based on the capacitance associated with the measurement circuit.

Abstract: Embodiments of the invention generally provide a substrate support assembly. In one embodiment, a substrate support assembly includes a substrate support plate, a thermal regulating plate coupled in a spaced-apart relation to the substrate support plate and a main actuator coupled in a spaced-apart relation to the thermal regulating plate. The main actuator is adapted to move the substrate support plate laterally. The substrate support assembly is configured to limit the thermal influence of the main actuator on a substrate positioned on the substrate support plate.

Abstract: Embodiments of the invention generally provide a substrate support assembly. In one embodiment, a substrate support assembly includes a substrate support plate, a thermal regulating plate coupled in a spaced-apart relation to the substrate support plate and a main actuator coupled in a spaced-apart relation to the thermal regulating plate. The main actuator is adapted to move the substrate support plate laterally. The substrate support assembly is configured to limit the thermal influence of the main actuator on a substrate positioned on the substrate support plate.

Abstract: Methods and apparatus enable thermal conditioning of a substrate in a vacuum chamber that is evacuated to a high vacuum pressure. The substrate rests on a thermally controlled support that defines a cavity area between an underside of the substrate and a recessed section of the support. A fence of the support bounds the recessed section and limits flow of a gas injected into the cavity area into an interior region of the vacuum chamber where the support and substrate are disposed. Accordingly, a pressure differential exists between the cavity area and the interior region of the vacuum chamber. This relatively higher pressure in the cavity area enables heat transfer between the support and substrate via the gas in the cavity area in order to adjust the temperature of the substrate.