Abstract: Apparatuses and methods related to a point-of-care portable assay device and the use thereof with a test card are described herein. In a general embodiment, a device for monitoring a polymerase chain reaction in a fluid sample includes a vacuum source configured to pull the fluid sample through a microchannel, a current source configured to cause the polymerase chain reaction while the fluid sample is located within the microchannel, a light source configured to illuminate the polymerase chain reaction while the current source causes the polymerase chain reaction, a camera imaging device configured to record an image of the polymerase chain reaction while the light source illuminates the polymerase chain reaction, and a controller configured to analyze the image of the polymerase chain reaction and output a resulting analysis of the polymerase chain reaction.

Abstract: Apparatuses and for causing a point-of-care polymerase chain reaction and analyzing the polymerase chain reaction at the point-of-care, particularly when unwanted bubbles are present during the polymerase chain reaction, are described herein. In a general embodiment, a device for analysing a polymerase chain reaction in a fluid sample includes a current source configured to cause the polymerase chain reaction by heating the fluid sample within a target zone, a camera imaging device configured to record a plurality of images of the fluid sample in the target zone while the current source causes the polymerase chain reaction, and a controller configured to (i) distinguish wanted objects in the plurality of images from an unwanted object in the plurality of images, and (ii) determine whether the fluid sample tests positive or negative for a bacteria or virus based on the wanted objects.

Abstract: The screening of edge-emitting laser diode bars in a production line is permitted by fabricating the source electrodes of each diode in the bar in two parts spaced apart to form a window aligned with the lasing cavity of the diode. Such windows have been made in failed devices to determine the cause of failure. Here, the windows are formed in a wafer stage of fabrication for later separation into laser bars or individual laser diodes. All wafers, all laser bars and all laser diodes are fabricated with windows thus permitting automatic screening during fabrication rather than opening a window to examine only failed devices as is the case in the prior art.

Abstract: A laser diode structure includes a metallic gasket which is sandwiched between the laser diode submount and the backside electrode in the absence of solder interfaces. The gasket has mirror image, shallow recesses in the surfaces thereof with each surface having the general shape of a wing. The recesses are formed into sealed coolant conduits when the several layers are bonded together into an integrated structure. The narrow end of each recess communicates with an aperture through the adjacent layer to provide inlet and outlet ports for the coolant. The gasket has an aperture therethrough at the wide ends of the recesses for the coolant to circulate. The gasket can be formed from a single layer or from two layers each with a single recess.

Abstract: An assembly of simple, like laser diode submounts or laser diode bars lend themselves to volume manufacturing techniques. Individual diodes, or diode bars are supported on electrically-insulating submounts which have electrically-isolated metallizations applied thereto for mounting on a single insulating plate and to one another in a stack and for mounting to a common heat sink.

Abstract: A reduced, lateral mode laser diode is fabricated using a self-aligning process which produces a well controlled weakly index-guided waveguide with strong current confinement. The structure includes ion implants for controlling current injection into the active region from the top of the ridge. The number of modes may be reduced to unity, resulting in a single lateral mode laser. A laser diode array is fabricated in the same way.

Abstract: An optically isolated laser diode array is formed by growing a quantum well layer on a substrate after a plurality of strips are placed on the substrate. As the lattice of the quantum well of layer grows over the strips, it deforms the lattice structure of such layer causing it to be optically lossy in the regions above the strips. An insulative layer may then be deposited on the quantum well layer and patterned so that electrical contact may be made to the quantum well layer active regions which are disposed between each of the strips. In these active regions, the quantum well layer lattice structure is well formed to provide high quality active regions for laser diodes.