Abstract: Disclosed are a magnetic coupling-based inter-chip wireless communication interface structure and method for three-dimensional stacked chips. The interface structure includes a master chip and at least one slave chip, wherein the master chip and all the slave chips are vertically stacked; the slave chip includes a clock receiving module, a data transmitting module, and a data receiving module; the master chip includes a clock transmitting module, a data transmitting module, and a data receiving module. The solution herein makes use of the magnetic coupling relationship between on-chip spiral inductors of different chips in a vertical direction to simultaneously transmit data and clock signals. The communication method herein modulates each bit of digital signal into a differential bi-directional non-return-to-zero pulse train and performs decision and data parsing at the receiving end by a high-speed dynamic comparator.

Abstract: Disclosed is an inductive coupling system and method for adaptive control of power transfer for a wireless three-dimensional stacked chip package. The system includes a slave chip and a master chip connected via inductive coupling; the system for adaptive control of power transfer herein shifts a load feedback voltage received by the slave chip into a feedback voltage data codeword through a level decision circuit, and the system can load the feedback voltage data codeword onto a data link of the system and feedback same to the master chip. In the present disclosure, the master chip includes a DPID control circuit controls a voltage-controlled oscillator and a frequency divider to adjust the frequency of an input clock in an energy transfer system so as to achieve adaptive control of the transmitting power of a transmitting chip.