Abstract: A disclosed device cooling system includes a first coolant loop that circulates a first cooling media through a device; a second coolant loop that circulates a second cooling media through the device; a thermoelectric cooler (TEC) positioned between the first coolant loop and the second coolant loop; and control electronics configured to selectively drive the TEC to transfer heat between the first coolant loop and the second coolant loop.

Abstract: An energy storage system comprises at least one cryogen storage device that includes a subcooling loop and that is configurable to store a cryogen with or without boil-off losses. The system also comprises a cryoplant configured to interact with a power source and with the subcooling loop of the at least one cryogen storage device. The system also includes a control system configured to control the interaction of the cryoplant with the power source and the at least one cryogen storage device. The control system is configured to control interaction of the cryoplant with the power source and the at least one cryogen storage device according to a plurality of operational modes, including: a cooling mode, a passive storage mode, a fuel cell backup mode, and a liquefaction mode.

Abstract: A device may include a thermal interface configured to receive heat from a heat-generating electronic component. A device may include an electrically conductive working fluid in contact with the thermal interface to receive heat from the thermal interface. A device may include a magnetic pump configured to apply a magnetic field and an electrical current to the electrically conductive working fluid. A device may include a heat exchanger in thermal communication with the electrically conductive working fluid to exhaust heat from the electrically conductive working fluid.

Abstract: Techniques for dynamically changing a pressure within a pressurized cooling system to thereby allow different cooling rates to be used to cool electronic equipment are disclosed. A pressurized cooling system cools electronic heat generating components using dielectric heat transfer fluid disposed within a two-phase immersion cooling container. This container is operable to maintain different pressure levels. The pressurized cooling system includes a pressure system structured to modify a pressure within the container. The system operates in a first state when the pressure is above a threshold pressure. The system operates in a second state when the pressure is at the threshold pressure. The system operates in either one of the first state or the second state based on an operating state of the heat generating component.

Abstract: A device cooling system includes a first flow adjuster positioned in-line with a first channel and a second flow adjuster positioned in-line with a second channel. The first flow adjuster is configurable to selectively adjust a first flow impedance within the first channel and the second flow adjuster is configurable to selectively adjust a second flow impedance within the second channel. The first flow impedance is independently adjustable relative to the second flow impedance.

Abstract: A device for harvesting ambient fluid includes a cool area and a hot area. The device includes an absorption material configured to absorb ambient fluid. The device includes a means for moving the absorption material between the hot area and the cool area based on a weight differential of the absorption material.

Abstract: The discussion relates to thermal management. One example can include a circuit board including inner, intermediate, and outer generally concentric zones and a cryogenically cooled chip located in the inner zone as well as non-cryogenic electronic components positioned in the outer zone. In this example, the intermediate zone can have a skeletonized configuration that slows thermal energy movement from the outer zone to the inner zone.

Abstract: An energy storage system comprises at least one cryogen storage device that includes a subcooling loop and that is configurable to store a cryogen with or without boil-off losses. The system also comprises a cryoplant configured to interact with a power source and with the subcooling loop of the at least one cryogen storage device. The system also includes a control system configured to control the interaction of the cryoplant with the power source and the at least one cryogen storage device. The control system is configured to control interaction of the cryoplant with the power source and the at least one cryogen storage device according to a plurality of operational modes, including: a cooling mode, a passive storage mode, a fuel cell backup mode, and a liquefaction mode.

Abstract: A thermal management device includes a microfluidic volume having a first peripheral side and a second peripheral side and including at least one thermal element, a first port to the microfluidic volume, a second port from the microfluidic volume, an inlet valve at the first port to the microfluidic volume, an outlet valve at the second port, and a valve piezoelectric element in mechanical communication with a portion of at least one of the inlet valve and the outlet valve to move at least the portion of the at least one of the inlet valve and the outlet valve and selectively allow fluid flow through the microfluidic volume.

Abstract: Examples described in this disclosure relate to waste cold recuperation in fuel cell based power generation systems for datacenters. An example waste cold recuperation system includes a liquefied gas storage for supplying liquefied gas as a coolant to cool a first set of compute resources configurable to operate in a first cryogenic environment. The system is configurable to supply at least some of the vapor phase of the liquefied gas as a coolant to cool a second set of compute resources configurable to operate in a second cryogenic environment, resulting in the at least some of the vapor phase of the liquefied gas becoming a super-heated vapor phase of the liquefied gas. The system is configurable to supply the super-heated vapor phase of the liquefied gas as fuel to fuel cells for providing electrical power to a datacenter load including compute resources configurable to operate in a non-cryogenic environment.

Abstract: A thermal management device includes a microfluidic volume having a first peripheral side and a second peripheral side and including at least one thermal element, a pumping membrane located adjacent to the microfluidic volume between the first peripheral side and the second peripheral side and the at least one thermal element, and a pumping piezoelectric element in mechanical communication with the pumping membrane to move at least a portion of the pumping membrane and alter a volume of the microfluidic volume. The thermal management device further includes a first port to the microfluidic volume and a second port from the microfluidic volume.

Abstract: A thermal management system includes a high-pressure (HP) container, a low-pressure (LP) container in fluid communication with the HP container and having a fluid pressure less than the HP container, and a two-phase working fluid partially in the HP container and partially in the LP container. The two-phase working fluid has a vapor phase and a liquid phase. A pump is configured to move the working fluid through the system, and a condenser is configured to condense the vapor phase of the working fluid into the liquid phase.

Abstract: A motherboard assembly comprises a motherboard, a first computing component attached to the motherboard, and a coolant container attached to the motherboard. An air-cooled heat sink is attached to the coolant container. The coolant container, the heat sink, and the motherboard form a hermetically sealed enclosure that encompasses the first computing component and that is configured to retain dielectric working fluid covering the first computing component. The heat sink is positioned to condense vapors formed from boiling of the dielectric working fluid and to cause condensed dielectric working fluid to return to a pool of the dielectric working fluid that comprises the first computing component. The motherboard assembly additionally comprises a second computing component attached to the motherboard and positioned outside of the hermetically sealed enclosure.

Abstract: Techniques for dynamically changing a pressure within a pressurized cooling system to thereby allow different cooling rates to be used to cool electronic equipment are disclosed. A pressurized cooling system cools electronic heat generating components using dielectric heat transfer fluid disposed within a two-phase immersion cooling container. This container is operable to maintain different pressure levels. The pressurized cooling system includes a pressure system structured to modify a pressure within the container. The system operates in a first state when the pressure is above a threshold pressure. The system operates in a second state when the pressure is at the threshold pressure. The system operates in either one of the first state or the second state based on an operating state of the heat generating component.

Abstract: An energy storage system comprises at least one cryogen storage device that includes a subcooling loop and that is configurable to store a cryogen with or without boil-off losses. The system also comprises a cryoplant configured to interact with a power source and with the subcooling loop of the at least one cryogen storage device. The system also includes a control system configured to control the interaction of the cryoplant with the power source and the at least one cryogen storage device. The control system is configured to control interaction of the cryoplant with the power source and the at least one cryogen storage device according to a plurality of operational modes, including: a cooling mode, a passive storage mode, a fuel cell backup mode, and a liquefaction mode.

Abstract: Cryogenic removal of carbon dioxide from the atmosphere, or CryoDAC (Cryogenic Direct Air Capture), uses extremely low temperatures to convert atmospheric CO2 into a frozen solid while other components of air such as oxygen and nitrogen remain as gases. Air from the atmosphere is passed through a recuperative heat exchanger to cool the air to a temperature slightly above the deposition point of CO2. The cooled air is then passed over a deposition surface chilled to a temperature below the deposition point of CO2. Carbon dioxide in the air transitions from gas to solid form upon contact with the deposition surface. The frozen CO2 is collected and stored. The cold air with CO2 removed is passed back through the recuperative heat exchanger to cool incoming air and is then returned to the atmosphere. The deposition surface may be cooled by a cryogenic refrigerator.

Abstract: Integrated energy storage system including a thermal energy storage coupled with a liquid metal battery storage and a cryogenic energy storage and related methods are described. An example integrated energy storage system includes a liquid metal battery storage, a cryogenic energy storage configured to store energy using a liquefied cryogen, a thermal energy storage, and a control system. The control system is configured to cause selective transfer of heat from the thermal energy storage to at least one battery unit associated with the liquid metal battery storage. The control system is configured to during a first mode associated with the cryogenic energy storage, cause selective transfer of heat from the cryogenic energy storage to the thermal energy storage. The control system is configured to during a second mode associated with the cryogenic energy storage, cause selective transfer of heat from the thermal energy storage to the cryogenic energy storage.

Abstract: A motherboard assembly comprises a motherboard, a first computing component attached to the motherboard, and a coolant container attached to the motherboard. An air-cooled heat sink is attached to the coolant container. The coolant container, the heat sink, and the motherboard form a hermetically sealed enclosure that encompasses the first computing component and that is configured to retain dielectric working fluid covering the first computing component. The heat sink is positioned to condense vapors formed from boiling of the dielectric working fluid and to cause condensed dielectric working fluid to return to a pool of the dielectric working fluid that comprises the first computing component. The motherboard assembly additionally comprises a second computing component attached to the motherboard and positioned outside of the hermetically sealed enclosure.

Abstract: Integrated energy storage system including a thermal energy storage coupled with a liquid metal battery storage and a cryogenic energy storage and related methods are described. An example integrated energy storage system includes a liquid metal battery storage, a cryogenic energy storage configured to store energy using a liquefied cryogen, a thermal energy storage, and a control system. The control system is configured to cause selective transfer of heat from the thermal energy storage to at least one battery unit associated with the liquid metal battery storage. The control system is configured to during a first mode associated with the cryogenic energy storage, cause selective transfer of heat from the cryogenic energy storage to the thermal energy storage. The control system is configured to during a second mode associated with the cryogenic energy storage, cause selective transfer of heat from the thermal energy storage to the cryogenic energy storage.