Patents by Inventor Rusli Othman

Rusli Othman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lid with variable solder layer for sealing semiconductor package, package having the lid and method for producing the lid
    Patent number: 5821455
    Abstract: A lid for sealing a semiconductor package containing a semiconductor chip, a semiconductor package making use of the lid, and a method for producing the lid. The lid has a solder layer along the peripheral side of a ceramic plate. The solder layer has a portion of an increased solder thickness and a portion of a reduced solder thickness extending along the peripheral direction. When sealing the semiconductor package, a gas confined within the inside of the semiconductor chip mounting site of the package substrate may be discharged from the semiconductor package for realizing hermetic sealing.
    Type: Grant
    Filed: January 29, 1997
    Date of Patent: October 13, 1998
    Assignees: Sumitomo Metal (SMI) Electronics Devices, Inc., Intel Corporation
    Inventors: Tetsuya Yamamoto, Hideyuki Yoshino, Akihiro Hidaka, Roy Bell, Rusli Othman