Abstract: Techniques for optical analysis of fluid samples using sensors and water enhancing agents for in-line measurements with a continuous flow of the fluid samples are provided. In one aspect, a device includes: at least one reagent dispenser located at an introduction point along a conduit, the conduit being configured to contain a flow of a fluid sample; at least one first detector located at a first detection point along the conduit downstream from the introduction point; and at least one second detector located at a second detection point along the conduit downstream from the first detection point, wherein the at least one first detector and the at least one second detector are configured to make optical measurements of the fluid sample. A method employing the device is also provided.

Abstract: In one example, a method for backing up data includes downloading configuration information that includes one or more policies that specify one or more aspects of a backup process. Next, a notification is received concerning a “start” command, receipt of the notification is acknowledged, and the “start” command is performed to create a backup job in a job queue. A signal is then sent indicating that the “start” command is finished, and a backup start event is created. The backup process is then performed, and a report generated indicating that success or failure of the backup process.

Abstract: Techniques for optical analysis of fluid samples using sensors and water enhancing agents for in-line measurements with a continuous flow of the fluid samples are provided. In one aspect, a device includes: at least one reagent dispenser located at an introduction point along a conduit, the conduit being configured to contain a flow of a fluid sample; at least one first detector located at a first detection point along the conduit downstream from the introduction point; and at least one second detector located at a second detection point along the conduit downstream from the first detection point, wherein the at least one first detector and the at least one second detector are configured to make optical measurements of the fluid sample. A method employing the device is also provided.

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.

Abstract: A photonic waveguide structure may include a tapered photonic waveguide structure within a photonic substrate, such that the tapered photonic waveguide structure has a tapered region that progressively tapers in width along a longitudinal length of the tapered photonic waveguide structure. The photonic waveguide structure also includes an optical fiber waveguide having a core region and a cladding region, whereby a portion of the core region is partially exposed by removing a portion of the cladding region. An outer surface of the portion of the core region that is partially exposed is substantially coupled to the tapered photonic waveguide structure. An optical signal propagating along the tapered photonic waveguide structure is coupled from the tapered region of the tapered photonic waveguide structure to the core region of the optical fiber waveguide via the core region that is partially exposed.

Abstract: Techniques for optical analysis of fluid samples using sensors and water enhancing agents for in-line measurements with a continuous flow of the fluid samples are provided. In one aspect, a device includes: at least one reagent dispenser located at an introduction point along a conduit, the conduit being configured to contain a flow of a fluid sample; at least one first detector located at a first detection point along the conduit downstream from the introduction point; and at least one second detector located at a second detection point along the conduit downstream from the first detection point, wherein the at least one first detector and the at least one second detector are configured to make optical measurements of the fluid sample. A method employing the device is also provided.

Abstract: An apparatus having a spectrometer and techniques for use thereof for efficient and effective point-of-care diagnostics are provided. In one aspect, a device is provided. The device includes: an intake port; fluidic channels connecting the intake port to a detecting chamber(s), wherein the detecting chamber(s) is configured to permit optical measurements of a fluid sample; a vent leading away from the detecting chamber(s); and a liquid blocker between the detecting chamber(s) and an opening of the vent, wherein the liquid blocker permits air to pass therethrough while at the same time restricting liquid flow. A method for analyzing a fluid sample is also provided. The method includes: introducing the fluid sample to the device; contacting the fluid sample with a reagent(s) prior to the fluid sample entering the detecting chamber(s); and making optical measurements of the fluid sample in the detecting chamber(s).

Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.

Abstract: A submersible sensor device configured as a small pellet for testing biological and other liquid samples is provided. In one aspect, a sensing device includes: a housing; and one or more sensors contained within the housing, wherein the housing hermetically seals the sensors such that the sensing device is fully submersible in a liquid analyte. A method and system for analysis of a liquid sample using the present sensing device are also provided.

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

Abstract: Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure.

Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

Abstract: A method for aligning a scan laser beam on a wafer include scanning a scan laser beam across a laser beam sensor along a scan line, picking up a scan laser beam, at a first position, using a first optical slit of the laser beam sensor to generate a first electrical pulse, picking up the scan laser beam, at a second position, using a second optical slit of the laser beam sensor to generate a second electrical pulse, picking up the scan laser beam, at a third position, using a third optical slit of the laser beam sensor to generate a third electrical pulse, and determining a spot size and a position of the laser beam based on the first to third electrical pulses.

Abstract: An optoelectronic device includes an integrated circuit including electronic devices formed on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the semiconductor substrate. A photonics layer is formed on the barrier layer. The photonics layer includes a core for transmission of light and a cladding layer encapsulating the core and including a different index of refraction than the core. The core is configured to couple light generated from a component of the optoelectronic device.

Abstract: A method and system for aligning a scan laser beam on a wafer include scanning a scan laser beam across a laser beam sensor along a scan line, picking up a scan laser beam, at a first position, using a first optical slit of the laser beam sensor to generate a first electrical pulse, picking up the scan laser beam, at a second position, using a second optical slit of the laser beam sensor to generate a second electrical pulse, picking up the scan laser beam, at a third position, using a third optical slit of the laser beam sensor to generate a third electrical pulse, and determining a spot size and a position of the laser beam based on the first to third electrical pulses.

Abstract: Package structures and methods are provided to integrate optoelectronic and CMOS devices using SOI semiconductor substrates for photonics applications. For example, a package structure includes an integrated circuit (IC) chip, and an optoelectronics device and interposer mounted to the IC chip. The IC chip includes a SOI substrate having a buried oxide layer, an active silicon layer disposed adjacent to the buried oxide layer, and a BEOL structure formed over the active silicon layer. An optical waveguide structure is patterned from the active silicon layer of the IC chip. The optoelectronics device is mounted on the buried oxide layer in alignment with a portion of the optical waveguide structure to enable direct or adiabatic coupling between the optoelectronics device and the optical waveguide structure. The interposer is bonded to the BEOL structure, and includes at least one substrate having conductive vias and wiring to provide electrical connections to the BEOL structure.

Abstract: A system comprises a first optical component comprising a component body; at least a first waveguide formed in the component body, wherein the first waveguide is substantially mirror-symmetrical in shape relative to a line at or near the center of the first waveguide; and a self-alignment feature configured to assist in optically-coupling the first waveguide with a second waveguide located outside of the component body.