Patents by Inventor Russell A. Detterich

Russell A. Detterich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • No coat backside wafer grinding process
    Patent number: 5632667
    Abstract: A silicon wafer grinding apparatus for grinding a backside surface of a semiconductor wafer that includes integrated circuit chips patterned on a frontside surface of the wafer. The apparatus includes a plurality of chuck tables that secure a plurality of wafers to be ground. Each chuck table includes a cushioned rubber pad secured to the table and an interface with the frontside surface of the wafer. An organic acid cooling fluid is utilized during the grinding procedure to prevent silicon particles and residue from being adhered to the metal bond pads of the integrated circuit chips.
    Type: Grant
    Filed: June 29, 1995
    Date of Patent: May 27, 1997
    Assignee: Delco Electronics Corporation
    Inventors: Michael R. Earl, Russell A. Detterich, Robert A. Yancey