Abstract: A method for producing a cross-linked siloxane network comprises the steps of: (a) providing a first part comprising (i) a first siloxane compound comprising at least one cyclic siloxane moiety and (ii) a second siloxane compound comprising a plurality of siloxane moieties, (b) providing a second part, the second part comprising a hydroxide salt, (c) combining the first part and the second part to produce a reaction mixture, (d) heating the reaction mixture to a temperature sufficient for the hydroxide salt to open the ring of the cyclic siloxane moiety, and (e) maintaining the reaction mixture at an elevated temperature so that at least a portion of the opened cyclic siloxane moieties react to produce a cross-linked siloxane network.

Abstract: A method for producing a cross-linked siloxane network comprises the steps of: (a) providing a first part comprising (i) a first siloxane compound comprising at least one cyclic siloxane moiety, (ii) an inorganic particulate material, and (iii) an aminosilane compound, (b) providing a second part, the second part comprising a hydroxide salt, (c) combining the first part and the second part to produce a reaction mixture, (d) heating the reaction mixture to a temperature sufficient for the hydroxide salt to open the ring of the cyclic siloxane moiety, and (e) maintaining the reaction mixture at an elevated temperature so that at least a portion of the opened cyclic siloxane moieties react to produce a cross-linked siloxane network.

Abstract: A composition comprises a first siloxane compound comprising at least one cyclic siloxane moiety and a first salt, the first salt comprising a conjugate base of a volatile organic acid. A method for producing a cross-linked siloxane network comprises the steps of providing a first siloxane compound comprising at least one cyclic siloxane moiety, providing a first salt comprising a conjugate base of a volatile organic acid, combining the first siloxane compound and the first salt to produce a reaction mixture, heating the reaction mixture to a temperature sufficient for the first salt to open the ring of the cyclic siloxane moiety, and maintaining the reaction mixture at an elevated temperature so that at least a portion of the opened cyclic siloxane moieties react with each other to produce a cross-linked siloxane network.

Abstract: A method for producing a cross-linked siloxane network comprises the steps of: (a) providing a first part comprising (i) a first siloxane compound comprising at least one cyclic siloxane moiety and (ii) a second siloxane compound comprising a plurality of siloxane moieties, (b) providing a second part, the second part comprising a hydroxide salt, (c) combining the first part and the second part to produce a reaction mixture, (d) heating the reaction mixture to a temperature sufficient for the hydroxide salt to open the ring of the cyclic siloxane moiety, and (e) maintaining the reaction mixture at an elevated temperature so that at least a portion of the opened cyclic siloxane moieties react to produce a cross-linked siloxane network.

Abstract: A method for producing a cross-linked siloxane network comprises the steps of: (a) providing a first part comprising (i) a first siloxane compound comprising at least one cyclic siloxane moiety, (ii) an inorganic particulate material, and (iii) an aminosilane compound, (b) providing a second part, the second part comprising a hydroxide salt, (c) combining the first part and the second part to produce a reaction mixture, (d) heating the reaction mixture to a temperature sufficient for the hydroxide salt to open the ring of the cyclic siloxane moiety, and (e) maintaining the reaction mixture at an elevated temperature so that at least a portion of the opened cyclic siloxane moieties react to produce a cross-linked siloxane network.

Abstract: A composition comprises a first siloxane compound comprising at least one cyclic siloxane moiety and a first salt, the first salt comprising a conjugate base of a volatile organic acid. A method for producing a cross-linked siloxane network comprises the steps of providing a first siloxane compound comprising at least one cyclic siloxane moiety, providing a first salt comprising a conjugate base of a volatile organic acid, combining the first siloxane compound and the first salt to produce a reaction mixture, heating the reaction mixture to a temperature sufficient for the first salt to open the ring of the cyclic siloxane moiety, and maintaining the reaction mixture at an elevated temperature so that at least a portion of the opened cyclic siloxane moieties react with each other to produce a cross-linked siloxane network.

Abstract: A method for producing a cross-linked siloxane network comprises the steps of: (a) providing a first part comprising a first siloxane compound and a cure inhibitor, (b) providing a second part, the second part comprising a hydroxide salt, (c) combining the first part and the second part to produce a reaction mixture, (d) heating the reaction mixture to a temperature sufficient for the hydroxide salt to open the ring of the cyclic siloxane moiety, and (e) maintaining the reaction mixture at an elevated temperature so that at least a portion of the opened cyclic siloxane moieties react with each other to produce a cross-linked siloxane network.

Abstract: A siloxane compound comprises a plurality of siloxane repeating units and at least a portion of the siloxane repeating units are cyclosiloxane repeating units conforming to a specified structure. A process for producing such siloxane compounds is also provided. A process and kit for producing a cross-linked silicone polymer using the described siloxane compounds is also provided. A light emitting diode (LED) comprises an encapsulant, and the encapsulant comprises a cross-linked silicone polymer produced from the described siloxane compounds.

Abstract: A siloxane compound comprises a plurality of siloxane repeating units and at least a portion of the siloxane repeating units are cyclosiloxane repeating units conforming to a specified structure. A process for producing such siloxane compounds is also provided. A process and kit for producing a cross-linked silicone polymer using the described siloxane compounds is also provided. A light emitting diode (LED) comprises an encapsulant, and the encapsulant comprises a cross-linked silicone polymer produced from the described siloxane compounds.

Abstract: A siloxane compound comprises a plurality of siloxane repeating units and at least a portion of the siloxane repeating units are cyclosiloxane repeating units conforming to a specified structure. A process for producing such siloxane compounds is also provided. A process and kit for producing a cross-linked silicone polymer using the described siloxane compounds is also provided. A light emitting diode (LED) comprises an encapsulant, and the encapsulant comprises a cross-linked silicone polymer produced from the described siloxane compounds.

Abstract: A siloxane compound comprises a plurality of siloxane repeating units and at least a portion of the siloxane repeating units are cyclosiloxane repeating units conforming to a specified structure. A process for producing such siloxane compounds is also provided. A process and kit for producing a cross-linked silicone polymer using the described siloxane compounds is also provided. A light emitting diode (LED) comprises an encapsulant, and the encapsulant comprises a cross-linked silicone polymer produced from the described siloxane compounds.

Abstract: In a first aspect of the present invention, a method for manufacturing a flip chip package is provided comprising the steps of a) providing a chip having electrically conductive pads on an active surface thereof, b) coating at least a portion the chip with a protectant composition comprising a polymerizable component comprising a thermosetting epoxy resin, at least 50 weight percent of a substantially transparent filler having a coefficient of thermal expansion of less than 10 ppm/° C., a photoinitator, and a solvent carrier, wherein the protectant composition comprises a thixotropic index of less than 1.

Abstract: The present invention generally relates to a new method of polymerizing ethylene. In one embodiment, the present invention relates to compounds utilized in the polymerization of ethylene and to a synthesis/polymerization method that uses same. In another embodiment, branched polyethylene is synthesized from an ethylene monomer using, in this embodiment, at least one nickel iminophosphonamide (PN2) complex. In still another embodiment, the reaction of (phenyl)(triphenylphosphine)(diphenyl-bis(trimethylsilylimino)phosphorato)-nickel, with Rh(acac) (C2H4)2 and ethylene yield a branched polyethylene. In an alternative of this embodiment, the reaction of (phenyl)(triphenylphosphine)(methyl-cis(trimethylsilyl)amino-bis(trimethylsilylimino)phosphorato)-nickel and ethylene, with or without Ni(COD)2, yields a branched polyethylene.

Abstract: A siloxane compound comprises a plurality of siloxane repeating units and at least a portion of the siloxane repeating units are cyclosiloxane repeating units conforming to a specified structure. A process for producing such siloxane compounds is also provided. A process and kit for producing a cross-linked silicone polymer using the described siloxane compounds is also provided. A light emitting diode (LED) comprises an encapsulant, and the encapsulant comprises a cross-linked silicone polymer produced from the described siloxane compounds.

Abstract: A siloxane compound comprises a plurality of siloxane repeating units and at least a portion of the siloxane repeating units are cyclosiloxane repeating units conforming to a specified structure. A process for producing such siloxane compounds is also provided. A process and kit for producing a cross-linked silicone polymer using the described siloxane compounds is also provided. A light emitting diode (LED) comprises an encapsulant, and the encapsulant comprises a cross-linked silicone polymer produced from the described siloxane compounds.

Abstract: In a first aspect of the present invention, a method for manufacturing a flip chip package is provided comprising the steps of a) providing a chip having electrically conductive pads on an active surface thereof, b) coating at least a portion the chip with a protectant composition comprising a polymerizable component comprising a thermosetting epoxy resin, at least 50 weight percent of a substantially transparent filler having a coefficient of thermal expansion of less than 10 ppm/° C., a photoinitator, and a solvent carrier, wherein the protectant composition comprises a thixotropic index of less than 1.

Abstract: In a first aspect of the present invention, a method for manufacturing a flip chip package is provided comprising the steps of a) providing a chip having electrically conductive pads on an active surface thereof, b) coating at least a portion the chip with a protectant composition comprising a polymerizable component comprising a thermosetting epoxy resin, at least 50 weight percent of a substantially transparent filler having a coefficient of thermal expansion of less than 10 ppm/° C., a photoinitator, and a solvent carrier, wherein the protectant composition comprises a thixotropic index of less than 1.

Abstract: Latent thermal initiators and protectant compositions that remain shelf stable at elevated temperatures, yet readily cure during a solder bump reflow process or other high temperature processing. The thermal initiators comprise thermally labile cation-anion pairs where the blocked cation prevents cure at low temperatures, and the unblocked cation initiates cure at high temperatures. Also provided is a method of making a preferred initiator comprising the cation [N-(4-methylbenzyl)-N,N-dimethylanalinium] and the anion [N(SO2CF3)2].

Abstract: Latent thermal initiators and protectant compositions that remain shelf stable at elevated temperatures, yet readily cure during a solder bump reflow process or other high temperature processing. The thermal initiators comprise thermally labile cation-anion pairs where the blocked cation prevents cure at low temperatures, and the unblocked cation initiates cure at high temperatures. Also provided is a method of making a preferred initiator comprising the cation [N-(4-methylbenzyl)-N,N-dimethylanalinium] and the anion [N(SO2CF3)2].

Abstract: A method for assembling a microelectronic device is provided comprising the step of adhering a die to a substrate using a convex die attachment process. The convex die attachment process generally comprises a) providing a die having an underfill material thereon, b) picking up and inverting the die, c) heating the underfill until it liquefies at least slightly and forms a convex surface, and d) placing the die on a substrate.