Patents by Inventor Russell Alan Malek

Russell Alan Malek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11619376
    Abstract: An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may be fabricated in three-dimensional form factors.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: April 4, 2023
    Assignee: Innotec, Corp.
    Inventors: Thomas J. Veenstra, Russell Alan Malek
  • Publication number: 20220170622
    Abstract: An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may be fabricated in three-dimensional form factors.
    Type: Application
    Filed: February 11, 2022
    Publication date: June 2, 2022
    Inventors: Thomas J. Veenstra, Russell Alan Malek
  • Publication number: 20170356640
    Abstract: An illumination assembly includes a polymeric substrate, an electrical circuit including two conductors supported by the polymeric substrate, an LED electrically coupled to the two conductors, and a heat spreader thermally coupled to the LED. The two conductors can be printed on the polymeric substrate, embedded within the polymeric substrate, or lie atop the polymeric substrate. The illumination assembly may be fabricated in three-dimensional form factors.
    Type: Application
    Filed: June 10, 2016
    Publication date: December 14, 2017
    Inventors: Thomas J. Veenstra, Russell Alan Malek