Abstract: A burn-in board for burn-in and electrical testing of a plurality of integrated circuit devices that are disposed in one or more processing trays may include a substrate having an interface surface and a plurality of electrical contacts disposed on the interface surface for establishing, through engagement with the one or more processing trays, electrical communication between the leads of the integrated circuit devices and a tester. One or more ports may be defined in the substrate so as to extend between the interface surface and another surface of the substrate wherein the port or ports are sized and configured to enable application of a negative pressure between the substrate and the one or more processing trays upon engagement of the substrate therewith and upon application of a vacuum through the one or more ports.

Abstract: A burn-in board for burn-in and electrical testing of a plurality of integrated circuit devices that are disposed in one or more processing trays may include a substrate having an interface surface and a plurality of electrical contacts disposed on the interface surface for establishing, through engagement with the one or more processing trays, electrical communication between the leads of the integrated circuit devices and a tester. One or more ports may be defined in the substrate so as to extend between the interface surface and another surface of the substrate wherein the port or ports are sized and configured to enable application of a negative pressure between the substrate and the one or more processing trays upon engagement of the substrate therewith and upon application of a vacuum through the one or more ports.

Abstract: A stack processing tray for use with tray-based integrated circuit device handling systems. The stack processing tray has a plurality of cells, each cell being configured to receive at least two integrated circuit devices in a vertically superimposed, stacked relationship. Increased efficiency in the handling and processing of integrated circuit devices is realized as the tray-based integrated circuit device handling system performs fewer tray movements, and therefore less work, to handle a given number of integrated circuit devices.

Abstract: A burn-in board for burn-in and electrical testing of a plurality of integrated circuit devices that are disposed in one or more processing trays may include a substrate having an interface surface and a plurality of electrical contacts disposed on the interface surface for establishing, through engagement with the one or more processing trays, electrical communication between the leads of the integrated circuit devices and a tester. One or more ports may be defined in the substrate so as to extend between the interface surface and another surface of the substrate wherein the port or ports are sized and configured to enable application of a negative pressure between the substrate and the one or more processing trays upon engagement of the substrate therewith and upon application of a vacuum through the one or more ports.

Abstract: An in-tray burn-in board for burn-in and electrical testing of a plurality of integrated circuit devices disposed in one or more processing trays. The in-tray burn-in board includes a plurality of electrical contacts disposed on an interface surface for establishing, through engagement with one or more processing trays, electrical communication between the leads of the integrated circuit devices and a tester. One or more in-tray burn-in boards may each be coupled with at least one processing tray, such that a plurality of integrated circuit devices may be subjected to burn-in and other electrical testing without removing the integrated circuit devices from the processing trays, thereby reducing the time and cost associated with handling integrated circuit devices during manufacturing.