Abstract: A structural connector system for providing an electrical connection between electronic componentry is disclosed. The structural connector system includes a structural member, including an electrically insulating matrix, an electrically conducting path, a first end surface, a second end surface, and a first component engaging surface. The first component engaging surface includes a first mechanical coupler configured to mechanically couple a first electronic component or a first chassis component to the structural member and a first electrical coupler configured to electrically couple the first electronic component or the first chassis component to a first end of the electrically conducting path.

Abstract: A system is disclosed that includes an electronic package. The electronic package includes a package base couplable to a host substrate, and a package lid mechanically coupled to the package base that includes one or more transparent lid areas, configured to permit transmission of light. The electronic package further includes a thermal spreader bonded on a first side to a first side of the package lid. The thermal spreader includes one or more transparent spreader areas that are configured to allow transmission of light through the thermal spreader. The electronic package further includes one or more integrated circuits bonded to a second side of the thermal spreader that communicatively coupled to the host substrate. The electronic package further includes one or more optical paths that include at least one of the one or more transparent spreader areas configured adjacent to at least one of the transparent lid areas.

Abstract: A semiconductor package system is disclosed. The system includes a first interposer and a first integrated circuit die electrically coupled and thermally coupled to a first side of the first interposer. The system further includes a second integrated circuit die electrically coupled and thermally coupled to a second side of the first interposer. The system further includes a ring carrier electrically coupled and thermally coupled to the first interposer. The ring carrier is configured to transmit an input to the first interposer. In some embodiments, the system further includes at least one thermal spreader thermally coupled to the ring carrier and at least one of the first integrated circuit, the second integrated circuit, or the first interposer.

Abstract: A system is disclosed that includes an electronic package. The electronic package includes a package base couplable to a host substrate, and a package lid mechanically coupled to the package base that includes one or more transparent lid areas, configured to permit transmission of light. The electronic package further includes a thermal spreader bonded on a first side to a first side of the package lid. The thermal spreader includes one or more transparent spreader areas that are configured to allow transmission of light through the thermal spreader. The electronic package further includes one or more integrated circuits bonded to a second side of the thermal spreader that communicatively coupled to the host substrate. The electronic package further includes one or more optical paths that include at least one of the one or more transparent spreader areas configured adjacent to at least one of the transparent lid areas.

Abstract: A structural connector system for providing an electrical connection between electronic componentry is disclosed. The structural connector system includes a structural member, including an electrically insulating matrix, an electrically conducting path, a first end surface, a second end surface, and a first component engaging surface. The first component engaging surface includes a first mechanical coupler configured to mechanically couple a first electronic component or a first chassis component to the structural member and a first electrical coupler configured to electrically couple the first electronic component or the first chassis component to a first end of the electrically conducting path.

Abstract: A semiconductor package system is disclosed. The system includes a first interposer and a first integrated circuit die electrically coupled and thermally coupled to a first side of the first interposer. The system further includes a second integrated circuit die electrically coupled and thermally coupled to a second side of the first interposer. The system further includes a ring carrier electrically coupled and thermally coupled to the first interposer. The ring carrier is configured to transmit an input to the first interposer. In some embodiments, the system further includes at least one thermal spreader thermally coupled to the ring carrier and at least one of the first integrated circuit, the second integrated circuit, or the first interposer.

Abstract: An antenna array and a method of making can use solder connections. The antenna system includes a back plane circuit board having a top surface, first radio frequency circuit boards arranged in rows on the back plane circuit board and perpendicular to the top surface, and second radio frequency circuit boards arranged in columns on the back plane circuit board and perpendicular to the top surface. Each of the first radio frequency circuit boards include at least one first antenna element, and each of the second radio frequency circuit boards include at least one second antenna. The first radio frequency circuit boards and second radio frequency circuit boards are connected to the back plane circuit board by solder connections.

Abstract: A GPS receiver device can include at least one radio frequency (RF) chip implementing at least three RF modules configured to process RF signals received over at least three RF channels. Each RF module can be associated with a respective RF channel. Each RF module can include (1) a frequency demultiplexer and (2) at least two parallel circuits coupled to the frequency demultiplexer. Each of the parallel circuits can include (i) a RF amplifier connected to a respective output port of the frequency demultiplexer and (ii) an analog bandpass filter connected in series to the RF amplifier. The GPS receiver device can include a circuit board on which the at least one RF chip is mounted. The circuit board can have a breadth (e.g., length, width, or diameter) less than or equal to 1.65 inch.

Abstract: An interconnect assembly includes a spacer assembly including a top surface and a bottom surface; and a flexible circuit member including a first surface and a second surface opposite the first surface. The flexible circuit member curves about at least a portion of the spacer assembly such that a first portion of the first surface of the flexible circuit member is coupled to the top surface of the spacer assembly and a second portion of the first surface of the flexible circuit member is coupled to the bottom surface of the spacer assembly. The interconnect assembly further includes at least one top electrical interface element coupled to a first portion of the second surface of the flexible circuit member; and at least one bottom electrical interface element coupled to a second portion of the second surface of the flexible circuit member. The first portion of the second surface of the flexible circuit member is spaced apart from the second portion of the second surface of the flexible circuit member.