Abstract: The present disclosure relates to an apparatus and a method for cooling electronic components. An apparatus of the presently claimed invention includes a connector and an electronic component that plugs into the connector. The electronic component contacts a heat sink, where the heat sink moves in an upward direction as the electronic component is plugged into the connector. Soft thermal pads located between the heat sink and liquid cooling tubes/pipes compress as the heat sink moves upward. When compressed, the thermal pads contact the heat sink and the liquid cooling tubes/pipes. Heat is then transferred from the electronic component through the heat sink, through the thermal pads, through the coolant tubes, and into liquid contained within the liquid coolant tubes.

Abstract: The present disclosure relates to an apparatus and a method for cooling electronic components. An apparatus of the presently claimed invention includes a connector and an electronic component that plugs into the connector. The electronic component contacts a heat sink, where the heat sink moves in an upward direction as the electronic component is plugged into the connector. Soft thermal pads located between the heat sink and liquid cooling tubes/pipes compress as the heat sink moves upward. When compressed, the thermal pads contact the heat sink and the liquid cooling tubes/pipes. Heat is then transferred from the electronic component through the heat sink, through the thermal pads, through the coolant tubes, and into liquid contained within the liquid coolant tubes.

Abstract: A coupler engagement mechanism includes a female member that detachably couples to a corresponding male member. The female member may include a central axis opening and a telescopically slidable outer sleeve. The outer sleeve may be spring-biased in a forward direction towards the central axis opening. A pull member may be coupled to the outer sleeve and may extend from the outer sleeve in a direction other than parallel to the radius of the outer sleeve.