Abstract: A thermal conditioning assembly includes a casing having a first casing portion, a second casing portion and a partition intermediate the casing portions, peripheries of each of the casing portions and the partition united so as to delimit hermetically sealed first and second casing chambers. The first chamber is characterized by the first casing portion and a first surface of the partition and includes a phase change media and wicking structure, heat spreading from a heat source adjacent thereto thusly effectuated. The second chamber, characterized by the second casing portion and a second surface of the partition, dissipates heat from the first chamber. Segments of the second casing portion and the partition are selectively united so as to form one or more baffles which delimit coolant channels. The second chamber includes first and second coolant connectors for coolant ingress and egress in furtherance of circulating coolant through the second chamber via said coolant channels.

Abstract: A thermal energy storage assembly characterized by a housing having first and second chambers characterized by first and second phase-change media, respectively, is generally provided. The housing includes first and second housing portions and a partition structure, the housing portions and the partition structure united about their peripheries via an ultrasonic weldment so as to delimit the housing chambers. The second housing chamber includes condenser and evaporator chamber portions or segments. The partition structure and the second housing portion are selectively united via ultrasonic weldment in furtherance of forming tensioning elements within same. A wicking structure and spacing element reside within the second housing chamber to aid phase-change of the second phase change media.

Abstract: A thermal ground plane includes a casing having a first casing portion and a second casing portion, the first casing portion united with the second case portion via an ultrasonic weldment so as to delimit a hermetically sealed casing chamber. A phase-change media, a wicking structure and a spacing element are further characteristic of the device, each of which resides within the casing member. The wicking structure is adjacent the first casing portion of the casing, with the spacing element intermediate the wicking structure and the second casing portion.

Abstract: A thermal ground plane is provided. The device includes a casing characterized by a first casing portion and a second casing portion, the first casing portion united with the second case portion via an ultrasonic weldment so as to delimit a hermetically sealed casing chamber. A phase-change media, a wicking structure and a spacing element are further characteristic of the device, each of which residing within the casing member. The wicking structure is adjacent the first casing portion of the casing, with the spacing element intermediate the wicking structure and the second casing portion.

Abstract: A fail safe heating assembly for operative union with a heat sink and/or work piece is provided. The assembly generally includes a heater characterized by a resistive heating element and a dielectric substrate, and a resistive sensor, substantially coextensive with the resistive heating element of the heater and united therewith so as to define a composite heating assembly. The resistive heating element is supported upon the dielectric substrate, with the heater including leads for operative union with a current source. The resistive sensor is characterized by a first resistive sensor portion having a resistive material delimiting a first resistive pattern, and a second resistive sensor portion having a resistive material delimiting a second resistive pattern.

Abstract: A fail safe heating assembly for operative union with a heat sink and/or work piece is provided. The assembly generally includes a heater characterized by a resistive heating element and a dielectric substrate, and a resistive sensor, substantially coextensive with the resistive heating element of the heater and united therewith so as to define a composite heating assembly. The resistive heating element is supported upon the dielectric substrate, with the heater including leads for operative union with a current source. The resistive sensor is characterized by a first resistive sensor portion having a resistive material delimiting a first resistive pattern, and a second resistive sensor portion having a resistive material delimiting a second resistive pattern.