Abstract: In many DRAM (Dynamic Random Access Memory) architectures, a sense amplifier detects and amplifies a small voltage differential between complementary bitline pairs to read from/write to a DRAM memory cell. The access speed of the DRAM is dependent on the speed of the transition, due to this amplification, of the bitline pairs from an equalized, pre-charged voltage level to final (within a given sensing cycle) high and low levels. The transition speed of the bitline pairs can be increased by providing a higher overdrive voltage to the sense amplifier. As DRAM technologies are scaled successively smaller, the overdrive voltage must be controlled to avoid compromising the reliability of the DRAM. Accordingly, the present invention relates to a DRAM circuit which provides a transiently higher overdrive voltage only during sensing. The overdrive is provided by a pre-charged capacitive source utilizing the circuit's natural capacitance.

Abstract: A low-voltage, low-power DC voltage generator system is provided having two negative voltage pump circuits for generating voltages for operating negative wordline and substrate bias charge pump circuits, a reference generator for generating a reference voltage, and a two-stage cascaded positive pump system having a first stage pump circuit and a second stage pump circuit. The first stage converts a supply voltage to a higher voltage level, e.g., one volt to 1.5 volts, to be used for I/O drivers, and the second stage converts the output voltage from the first stage to a higher voltage level, e.g., from 1.5 volts to about 2.5 volts, for operating a boost wordline charge pump circuit. The DC voltage generator system further includes a micro pump circuit for providing a voltage level which is greater than one-volt to be used as reference voltages, even when an operating voltage of the DC voltage generator system is at or near one-volt.

Abstract: A Defect Leakage Screen Test apparatus and method is introduced to eliminate or reduce steps in the failure analysis process of memory devices, such as DRAM cells, or to eliminate the necessity for the application of a physical failure analysis on the memory device. Special single bit failures due to leakage current, junction current, or threshold leakage current, are characterized by varying the p-well voltage of the memory device during the read operation of the test. The p-well voltage is varied with a test code Initial Program Load (IPL). Additional logic is provided on the memory IC to decode the IPL logic signals. In order to perform the p-well varying test, the memory device is provided with the following: IPL decoding logic; a reference voltage generator; an IPL voltage reference multiplexor; a p-well voltage feed-back circuit; and a differential amplifier circuit.

Abstract: A semiconductor circuit for providing decoupling capacitance to an integrated circuit voltage supply that includes a decoupling capacitance comprised of an array of memory cells connected in series at a node and a source of biasing voltage connected to the array of memory cells at the node for maintaining the voltage level at the node lower than the voltage level of the voltage supply.

Abstract: A differential receiver has a switching point accurately set according to a reference voltage, which switching point is dynamically modified, that is, dc hysteresis is provided, by a circuit internal to the differential receiver. Positioning of the resultant hysteresis characteristic about the reference signal is adjusted by establishing a backgate voltage differential between an input transistor and a reference transistor of the differential receiver. A switching circuit is also provided for controlling switching of a hysteresis circuit at the reference signal plus or minus a desired offset. The switching circuit is gated by an output signal of the input transistor.

Abstract: A semiconductor circuit for providing decoupling capacitance to an integrated circuit voltage supply that includes a decoupling capacitance comprised of an array of memory cells connected in series at a node and a source of biasing voltage connected to the array of memory cells at the node for maintaining the voltage level at the node lower than the voltage level of the voltage supply.

Abstract: An electronic semiconductor module, either memory or logic, having a driver circuit which includes a multiplicity of driver transistors, together with circuitry for simultaneously applying a first positive bias to a first select number of driver transistors to activate them to an operational state, a second positive bias to a second select number of driver transistors to place them in readiness for activation, and a negative bias to the remaining driver transistors to place them in a fully inactive state thereby reducing noise in the driver circuit. The first positive bias is greater than the transistor threshold voltage, preferably greater than two volts, the second positive bias is less than the threshold voltage, preferably less than one volt, and the negative bias is in the order of minus 0.3 volt.

Abstract: A system and method for reducing impedance loading of semiconductor integrated circuit devices implementing protective device structures that contributes to impedance loading at an I/O pad connection. The method comprises providing a fuse device between the I/O pad connection and the protective device; connecting a current source device associated with each fuse device in the integrated circuit, the current source device connected to one end of the fuse device; providing fuse selection circuit for activating current flow through a selected fuse device between the current source and the I/O connection, the current flow being of an amount sufficient for blowing the fuse and disconnecting the protective device from the circuit structure, thereby reducing impedance loading at the I/O connection.

Abstract: A differential receiver for sensing small input voltage swings by using a built in reference voltage obtained by a difference in threshold voltage between a differential pair of closely spaced transistors. The difference in threshold voltage can be produced by different values of ion implantation of the gates of the transistor pair with the same material, or by dosages using different materials. The difference in threshold voltage can also be obtained by using different transistor channel lengths. The threshold voltages can also be modulated by the control of the transistor substrate voltages using a voltage control substrate means.

Abstract: A differential receiver for sensing small input voltage swings by using a built in reference voltage obtained by a difference in threshold voltage between a differential pair of closely spaced transistors. The difference in threshold voltage can be produced by different values of ion implantation of the gates of the transistor pair with the same material, or by dosages using different materials. The difference in threshold voltage can also be obtained by using different transistor channel lengths. The threshold voltages can also be modulated by the control of the transistor substrate voltages using a voltage control substrate means.

Abstract: A semiconductor circuit for providing decoupling capacitance to an integrated circuit voltage supply that includes a decoupling capacitance comprised of an array of memory cells connected in series at a node and a source of biasing voltage connected to the array of memory cells at the node for maintaining the voltage level at the node lower than the voltage level of the voltage supply.

Abstract: A method and structure for decoding n input signals and their complements to one of m output signals is provided. A capacitive network is provided having m output nodes. The output nodes are precharged to a given voltage value. N input signals and their complements are provided each having either a high value or a low value. At least one but less than all of the output nodes are discharged to a value less than the given voltage but greater than ground in output patterns responsive to given input patterns of the true and complement values of the input signals. The output patterns of the discharged nodes is such as to provide one and only one discharged or one and only one undischarged node for any given pattern of input signals. Preferably the capacitive network includes NMOS inversion capacitors.

Abstract: A processor with a memory send/received control circuit including a bus drive circuit and a detector circuit connected via control bus line to the control input of the memory. A data input line, or output line, or data input/output line is connected between the processor and the memory. A transmission line stub having a length that is incrementally variable is connected to the memory control input side of the control line 14. The impedance Z0 of the transmission line stub is equal to that of the control line and is open circuited at the end which results in voltage doubling to achieve high speed synchronization between control signals and data signals and to ensure valid data at high clock rates.

Abstract: An off-chip driver circuit with compensated current source including a reference current amplifier and an output driver with a pull-up section. The reference current amplifier includes an input voltage Vcmn from an on chip current reference source. A reference current is established in the reference current amplifier by choosing the Beta of transistor in a current path. A feature of the circuit is that an output current is produced in the output lead of the driver circuit that is proportional to the current in the reference current amplifier, but with adjustments made for the supply voltage level and effective transistor channel length, Leff. Another feature of the circuit is that a reference current-voltage is established on the output lead of the reference current amplifier that is primarily determined by a multiple of the reference current but is reduced by a function of the supply voltage. In the circuit the output current of the driver is reduced linearly and predictably with the supply voltage.

Abstract: A system and method for reducing impedance loading of semiconductor integrated circuit devices implementing protective device structures that contributes to impedance loading at an I/O pad connection. The method comprises providing a fuse device between the I/O pad connection and the protective device; connecting a current source device associated with each fuse device in the integrated circuit, the current source device connected to one end of the fuse device; providing fuse selection circuit for activating current flow through a selected fuse device between the current source and the I/O connection, the current flow being of an amount sufficient for blowing the fuse and disconnecting the protective device from the circuit structure, thereby reducing impedance loading at the I/O connection.

Abstract: A shallow trench capacitor is disclosed that is fabricated by forming a shallow trench in a substrate extending below a surface of the substrate. A dielectric layer having a preselected thickness is grown in the shallow trench, and a polysilicon layer is deposited over the dielectric layer. The polysilicon layer is then planarized down to the nitride or pad layer forming a capacitor. By utilizing a non-critical mask to open up selected regions, isolation structures may then be formed through shallow trench technology.

Abstract: A very low power logic circuit family which advantageously provides 1) retained high performance, 2) significantly reduced power dissipation, and 3) enhanced noise immunity. In a first set of embodiments, dual rail complementary logic signals are utilized to improve circuit immunity to external noise and to reduce noise generated by the logic circuit itself. A receiver portion of the present invention comprises two input FETs having cross coupling of the two gates to the two sources. In one preferred embodiment, both receiver and driver portions are connected in a repeater with all N channel drivers. A second set of embodiments have a single sided input in an unbalanced receiver comprising cross coupled source to gate N channel and cross coupled drain to gate P channel output transistors.

Abstract: A method and circuit for producing an output current is provided. The method and circuit adds two currents with opposing temperature coefficients to produce such output current. A first one of the two currents, I.sub.1, is a scaled copy of current produced in a temperature compensated bandgap reference circuit. A second one of the two currents, I.sub.2, is derived from a temperature stable voltage produced by the bandgap circuit divided by a positive temperature coefficient resistance. The added currents, I.sub.1 +I.sub.2, provide the output current. The circuit includes a first circuit for producing: (i) a reference current having a positive temperature coefficient; and (ii) an output voltage at an output node substantially insensitive to variations in supply voltage and temperature over a predetermined range. The current source includes a second circuit connected to the output node for producing a first current derived from the bandgap reference current.

Abstract: A voltage regulator for DRAM chips having known short duration high current load events started by a trigger signal includes a regulating transistor operating in the weak inversion mode and a boost driver circuit. The trigger signal that starts the load event also triggers the boost driver circuit to produce a shaped boost signal at the correct time. The boost signal is applied to the gate of the regulating transistor to counteract the expected voltage drop at the output of the regulating transistor. The expected voltage drop is due to the known characteristics of the regulating transistor which include a change in threshold voltage of the regulating transistor during the high current flow of the load event. A switch device disconnects a preregulator during the load event and reconnects the preregulator thereafter. The boost signal is preferably applied to the regulating transistor through a capacitive divider.

Abstract: A nondestructive read, three device BICMOS gain cell for a DRAM memory having two FETs and one bipolar device. The gain cell has an improved access time (less latency), can operate for longer periods of time before a refresh operation is required, requires a smaller storage capacitance than a traditional DRAM cell, and can be produced commercially at lower costs than are presently available. In a preferred embodiment, the gain cell comprises an n channel metal oxide semiconductor field effect write transistor having its gate connected to a write word line WLw. Its drain is connected to a storage node Vs having a storage capacitance Cs associated therewith, and its source is connected to a write bit line BLw. An n channel metal oxide semiconductor field effect read transistor has its gate connected to the storage node Vs and its source connected to a read word line WLr. A PNP transistor has its base connected to the drain of the read transistor and its emitter connected to a read bit line BLr.