Abstract: A fan module, including a housing for receiving a fan, a connector configured to mate with a connector housing, and a vibration pad configured to isolate vibrations of the fan from transferring through the fan module, wherein the fan module is configured to receive an alignment attachment standoff.

Abstract: A fan module, including a housing for receiving a fan, a connector configured to mate with a connector housing, and a vibration pad configured to isolate vibrations of the fan from transferring through the fan module, wherein the fan module is configured to receive an alignment attachment standoff.

Abstract: A device for coupling a printed circuit board assembly to a computer chassis is described. The device may include a base. The device may include at least two posts. The posts may be located on opposite sides of the base. The posts may couple the device to the computer chassis. The device may include at least one prong. The prong may extend upward from the base. The prong may couple the device to the printed circuit board assembly.

Abstract: A computer component cooling apparatus is described. The cooling apparatus may include a fan assembly. The fan assembly may be coupled to a computer chassis. A duct may be slidably coupled to the fan assembly. The duct may be positioned in at least two positions on the fan assembly without being uncoupled from the fan assembly. In a first position, the duct may direct a flow of air over one or more computer components. In a second position, the duct may allow access to the one or more of the computer components.

Abstract: A computer component cooling apparatus is described. The cooling apparatus may include a fan assembly. The fan assembly may be coupled to a computer chassis. A duct may be slidably coupled to the fan assembly. The duct may be positioned in at least two positions on the fan assembly without being uncoupled from the fan assembly. In a first position, the duct may direct a flow of air over one or more computer components. In a second position, the duct may allow access to the one or more of the computer components.

Abstract: A device for coupling a printed circuit board assembly to a computer chassis is described. The device may include a base. The device may include at least two posts. The posts may be located on opposite sides of the base. The posts may couple the device to the computer chassis. The device may include at least one prong. The prong may extend upward from the base. The prong may couple the device to the printed circuit board assembly.

Abstract: According to one embodiment, a circuit board is disclosed. The circuit board includes a grounding ring, an integrated circuit, a heat spreader mounted on the integrated circuit and an electromagnetic shield. The electromagnetic shield is mounted on the grounding ring around the integrated circuit to electrically ground the heat spreader to the circuit board in order to trap electromagnetic interference generated by the integrated circuit.

Abstract: An EMI-shielding riser card for reducing electromagnetic radiation from a computer enclosure is disclosed. The EMI-shielding riser card is a six-layer riser card having a connector adjacent its lower edge, such as a connector for an NLX system board. A cable connection socket is on the riser card a first distance away from the connector, and a plurality of traces in a signal layer of the riser card run between the cable connection socket and the connector. A first ground layer in the riser card is interposed between the signal layer and a first surface of the riser card. A second ground layer in the riser card is interposed between the signal layer and a second surface of the riser card. The first and second ground layers are configured to attach to a ground connection for a system board for which the riser card is adapted.