Patents by Inventor Russell N. Ohnemus

Russell N. Ohnemus has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230157779
    Abstract: Disclosed is a brain implant placement apparatus, which includes a base member contoured to rest against a cranium of a patient. The brain implant apparatus including a pivot arm hingedly coupled to the base member and configured to rotate from a first configuration to a second configuration. The brain implant placement apparatus including an implant attachment member coupled to the pivot arm via a rotating attachment mechanism and further comprising a receiving portion configured to removably couple with a brain implant and rotate the brain implant. In the first configuration, the pivot arm is positioned such that the receiving portion of the implant attachment member is facing upward. In the second configuration, the pivot arm is positioned such that the receiving portion of the implant attachment member is facing substantially downwards.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 25, 2023
    Applicant: Neuralink Corp.
    Inventors: Russell N. Ohnemus, Robin E. Young
  • Publication number: 20230154809
    Abstract: An implantable device and method of manufacture include a substantially hermetic polychlorotrifluoroethylene (PCTFE) enclosure with closely-spaced wires extending out of the enclosure. The implantable device includes a PCTFE first portion of an enclosure and a PCTFE second portion of the enclosure. The first and second portions are configured to mate with each other to form the enclosure. A plurality of insulated wires extend between the first and second portions of the enclosure. Each of the insulated wires are parallel to each other and separated by less than 150 micrometers (?m) from a neighboring wire. A thermal weld seam of PCTFE is disposed between the first portion of the enclosure and the second portion of the enclosure and conformally adheres around insulation of each wire such that the enclosure is sealed.
    Type: Application
    Filed: November 17, 2021
    Publication date: May 18, 2023
    Applicant: Neuralink Corp.
    Inventors: John W.F. To, Ik Soo Kwon, Donjin Seo, Yu Niu ("Peter") Huang, Jiahao Guo, Robin E. Young, Joshua Scott Hess, Zachary M. Tedoff, Russell N. Ohnemus, Dominic A. Herincx