Abstract: A thin film structure is fabricated using photolithographic techniques and includes a plurality of substrates defining a resistor film, a conductor film and a passivation layer. The resistor film is etched to provide a plurality of individual heaters. The conductor film is etched to provide a plurality of conductive traces. At least one passivation layer covers the conductor film. A plurality of electrical contact pads are also formed that extend through etched holes in the passivation layer so that the electrical contact pads make electrical contact with the conductive traces. A nozzle plate is attached to the thin film structure. The nozzle plate has a plurality of individual nozzle orifices and also defines a plurality of corresponding ejection cavities for receiving ink from an ink reservoir via capillary action.

Abstract: A thin film structure is fabricated using photolithographic techniques and includes a plurality of substrates defining a resistor film, a conductor film and a passivation layer. The resistor film is etched to provide a plurality of individual heaters. The conductor film is etched to provide a plurality of conductive traces. At least one passivation layer covers the conductor film. A plurality of electrical contact pads are also formed that extend through etched holes in the passivation layer so that the electrical contact pads make electrical contact with the conductive traces. A nozzle plate is attached to the thin film structure. The nozzle plate has a plurality of individual nozzle orifices and also defines a plurality of corresponding ejection cavities for receiving ink from an ink reservoir via capillary action. The ejection cavities are each aligned with a corresponding one of the heaters for thermally ejecting ink through the orifices onto an adjacent print medium.