Abstract: A removal tool for removing a bonded surface mount component from a printed wiring board. The removal tool comprises a printed wiring board holder for securing the printed wiring board. A base plate is provided and first and second end blocks are fastened to the base plate. The holder is slidable between the first and second end blocks. Two transverse guide shafts extend between the first and second end blocks. A main slide block is slidably attached to two transverse guide shafts, and is slidable along the shafts in response to rotation of the threaded rod. A torque application member is coupled to the surface mount component and to the main slide block for applying a downward force to the surface mount component during removal thereof. A threaded rod is rotatably disposed through the second end block and the torque application means that is rotatable to shear the bond between the surface mount component and the printed wiring board.