Abstract: A mounting substrate includes a peripheral portion and a central portion. Solid state light emitting elements are provided on the mounting substrate. A housing is configured to thermally couple to the peripheral portion of the mounting substrate, so as to provide a first thermal conduction path for at least some heat generated by the solid state light emitting elements. A thermal conduction member is configured to thermally couple the central portion of the mounting substrate to the housing, so as to provide a second thermal conduction path that is different from the first thermal conduction path, for at least some heat generated by the solid state light emitting elements. Related assembling methods are also described.

Abstract: Lighting packages are described for light emitting diode (LED) lighting solutions having a wide variety of applications which seek to balance criteria such as heat dissipation, brightness, and color uniformity. The present approach includes a backing of thermally conductive material and two or more arrays of LEDs attached to a printed circuit board (PCB). The PCB is attached to the top surface of the backing and the two or more arrays of LEDs are separated by a selected distance to balance heat dissipation and color uniformity of the LEDs.