Abstract: Various embodiments of the teachings herein include a method for stencil printing a layer on or onto a printing surface with a stencil comprising applying a stencil with a first part and a second part to the printing surface and applying a layer of material to the printing surface through the stencil. The first part and the second part cover a non-continuous region of the printing surface.

Abstract: An electronic component module comprising at least one ceramic circuit carrier (2, 3) and a cooling device with at least one heat sink (4), a bonding region arranged between the ceramic circuit carrier (2, 3) and the cooling device adapted for bonding the circuit carrier (2, 3) to the cooling device (4). The bonding region (5, 7; 6, 8) comprises a bonding layer comprised of metal and a eutectic region (7, 8).

Abstract: A method for manufacturing an inductive component which is formed from a plurality of layers, wherein the method comprises the steps of a) arrangement of an electrically conductive material as a winding of the component on a first non-magnetic, dielectric ceramic layer; b) formation of at least one cutout which passes all the way through in the non-magnetic, dielectric ceramic layer; c) arrangement of a first magnetic ceramic layer on an upper face and a second magnetic ceramic layer on a lower face of the non-magnetic, dielectric ceramic layer; and d) carrying out a process step in which at least one of the magnetic ceramic layers is plastically deformed such that contact is made with the two magnetic ceramic layers in the area of the cutout, and the two magnetic ceramic layers form a magnetic core of the component.

Abstract: An electronic component module comprising: at least one multilayer ceramic circuit carrier (2, 3); at least one cooling device comprising at least one heat sink; a composite layer (5, 6) arranged at least in regions between the ceramic circuit carrier (2, 3) and the cooling device (4), said composite layer being formed for reactive connection to the ceramic circuit carrier (2, 3) during a primary process and for connection to the cooling device (4).

Abstract: An electronic component module comprising at least one ceramic circuit carrier (2, 3) and a cooling device with at least one heat sink (4), a bonding region arranged between the ceramic circuit carrier (2, 3) and the cooling device adapted for bonding the circuit carrier (2, 3) to the cooling device (4). The bonding region (5, 7; 6, 8) comprises a bonding layer comprised of metal and a eutectic region (7, 8).

Abstract: A clothes dryer includes at least one clothes drum for receiving textiles and at least one ultrasound atomizer disposed in the dryer for generating an aerosol from a liquid. The invention further relates to a method for introducing an aerosol into the clothes drum of the clothes dryer. A liquid is conducted from a reservoir to an ultrasound atomizer disposed in the clothes dryer, atomized there, and conducted into the clothes drum. The invention relates to further applications for an ultrasound atomizer, such as a washing machine, dishwasher, and/or motor vehicle.

Abstract: A ceramic mass includes one ceramic material and at least a second different ceramic material. Glass material is arranged between the ceramic materials. The glass material reduces the sintering temperature of the ceramic mass and prevents the various ceramic materials from forming a mixed crystal when the ceramic mass is sintered. The ceramic mass is suitable for use in LTCC technology for the production of capacitors whose permittivity is dependent upon a specific temperature range.

Abstract: The invention is directed to an extremely low-capacitance device for shaping an electron beam. The device is based on a ceramic body having a monolithic multi-layer structure. The manufacture of the ceramic body ensues with the assistance of LTCC technology, whereby this method is designationally modified. The body is constructed of pre-sintered ceramic layers whose lateral shrinkage is suppressed. The through apertures of the electrodes for the electron beam are thus arranged exactly coaxially, and the tolerances of the electrode dimensions are decoupled from the shrinkage during sintering. The electron beam of an electron gun is focused and the intensity thereof is modulated with the assistance of such a device.