Abstract: Apparatus and methods for multi-layer foam structures are disclosed. In one embodiment, a method includes filling a first portion of a receptacle with a removable filler. A second portion of the receptacle is filled with a first foam forming a first foam layer. The removeable filler is removed, and at least part of the first portion of the receptacle is filled with a second foam, forming a second foam layer. The first foam may include a polyimide foam, and the second foam may include a polyurethane foam. Other aspects of the invention include a skin attached to the receptacle and the first foam. In other embodiments, hexagonal honeycomb matrix may be used as a receptacle for the first foam and the second foam.