Patents by Inventor Rutvik Acharya

Rutvik Acharya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240107228
    Abstract: Example embodiments relate to vehicle sensor modules with external audio receivers. An example sensor module may include sensors and can be coupled to a vehicle's roof with a first microphone positioned proximate to the front of the sensor module. The sensor module can also include a second microphone extending into a first side of the sensor module such that the second microphone is configured to detect audio originating from an environment located relative to a first side of the vehicle and a third microphone extending into a second side of the sensor module such that the third microphone is configured to detect audio originating from the environment located relative to a second side of the vehicle, wherein the second side is opposite of the first side.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Inventors: Cheng-Han Wu, Choon Ping Chng, Jun Hou, Miklos Szentkiralyi, Rutvik Acharya
  • Patent number: 11889278
    Abstract: Example embodiments relate to vehicle sensor modules with external audio receivers. An example sensor module may include sensors and can be coupled to a vehicle's roof with a first microphone positioned proximate to the front of the sensor module. The sensor module can also include a second microphone extending into a first side of the sensor module such that the second microphone is configured to detect audio originating from an environment located relative to a first side of the vehicle and a third microphone extending into a second side of the sensor module such that the third microphone is configured to detect audio originating from the environment located relative to a second side of the vehicle, wherein the second side is opposite of the first side.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: January 30, 2024
    Assignee: Waymo LLC
    Inventors: Cheng-Han Wu, Choon Ping Chng, Jun Hou, Miklos Szentkiralyi, Rutvik Acharya
  • Patent number: 11781549
    Abstract: Example embodiments relate to an air cooling system for an electronic spinning assembly. An example embodiment includes a plurality of vanes coupled to a static base. A vane cover is rotatably coupled to the static base. The vane cover at least partially encloses the plurality of vanes. Additionally, the vane cover is coupled to an electronic spinning assembly and configured to rotate with the spinning assembly. The vane cover further includes at least one air inlet configured to act as an air intake for an airflow, at least one air duct extending from the vane cover and configured to direct the airflow, and at least one choke point disposed in the cover. The at least one choke point is configured to increase a pressure of the airflow.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: October 10, 2023
    Assignee: Waymo LLC
    Inventors: Rutvik Acharya, Simon Ellgas, Benjamin Chen
  • Publication number: 20230266440
    Abstract: Example embodiments relate to a sensor unit with rotating housing and spoiler for enhanced airflow. An example device includes one or more sensors configured to sense one or more aspects of an environment surrounding the device. The device also includes a housing that at least partially surrounds the one or more sensors. The housing and the one or more sensors are configured to rotate about a shared axis. The housing includes an inlet configured to act as an air intake for an airflow through the housing. The airflow is configured to cool the one or more sensors while the one or more sensors are operating. Further, the device includes a spoiler positioned on or near the inlet. The spoiler is configured to increase an air pressure near the inlet or promote laminar flow near the inlet in order to promote the airflow through the housing.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 24, 2023
    Inventors: Rutvik Acharya, Simon Ellgas, Justin Andrade, Jun Hou, Andreas Bauer, Zhaokun Wang