Abstract: An optical measurement device for determining at least two parameters of a measurement location of a surface of at least one workpiece positioned in a known coordinate system is described. The device comprises a first light source providing a first measurement beam. The first measurement beam is directed at a first surface of a workpiece. The device also comprises a second light source providing a second measurement beam. The second measurement beam is directed at a second surface of a workpiece facing opposite the first surface. Further, the device comprises a first system of receiving optics. The first system of receiving optics detects the incoming position of the first measurement beam. The first system of receiving optics is positioned on an opposite side of a workpiece from the first light source. Further still, the device comprises a second imaging system. The second system of receiving optics detects the incoming position of the second measurement beam.

Abstract: An optical measurement device for determining at least two parameters of a measurement location of a surface of at least one workpiece positioned in a known coordinate system is described. The device comprises a first light source providing a first measurement beam. The first measurement beam is directed at a first surface of a workpiece. The device also comprises a second light source providing a second measurement beam. The second measurement beam is directed at a second surface of a workpiece facing opposite the first surface. Further, the device comprises a first system of receiving optics. The first system of receiving optics detects the incoming position of the first measurement beam. The first system of receiving optics is positioned on an opposite side of a workpiece from the first light source. Further still, the device comprises a second imaging system. The second system of receiving optics detects the incoming position of the second measurement beam.

Abstract: The present invention provides a tray for holding components having first and second sides, wherein the first side has at least one first component receptacle for engaging said component; and the second side has at least one component engaging member, and further wherein the first component receptacle and the component engaging member are aligned such that when multiples of the tray are stacked upon each other the first component receptacle and the component engaging member will cooperate to restrain the motion of the component relative to the tray. In such an embodiment the component will have first and second engagement surfaces and the first component receptacle will engage the first component engagement surface and the component engaging member will engage the second component engagement surface.

Abstract: The present invention provides a method for assembling a head gimbal assembly useful in a hard disk drive and for testing such an assembly. In a method in accord with the present invention a head/slider is mounted to a circuited gimbal in an automated assembly machine. Following this step the head/slider circuited gimbal assembly will be subjected a dynamic electrical test with those head/slider circuited gimbal assemblies not passing being sorted from the lot. Following this step the head/slider circuited assembly will be attached to a suspension.

Abstract: An apparatus and method for determining and adjusting the static attitude of a head suspension or a head suspension assembly for use in a dynamic storage device. An apparatus in accordance with the present invention includes a workpiece support and an adjust device, operatively positioned with respect to the workpiece support, for adjusting the head suspension. The adjust device includes first and second clamp portions for restraining a gimbal arm and an adjust body for deforming the restrained gimbal arm while the gimbal arm is restrained by the first and second clamp portions.

Abstract: An interconnect for an electrical component. Generally, interconnects of the invention include a substrate, a pair of leads supported on the substrate, and a shunt extending between the leads. In one aspect of the present invention, the shunt comprises an eroded carbonized area of a surface of a carbonizable material.

Abstract: A method of measuring and adjusting at least one of a plurality of head suspension assemblies in a head stack assembly is provided, each head suspension assembly having a pivot axis, comprising the steps of stacking a plurality of head suspension assemblies with the pivot axis of each head suspension assembly aligned with the pivot axis of at least one adjacent head suspension assembly, wherein at least one of the head suspension assemblies is rotated about its pivot axis relative to at least one adjacent head suspension assembly so that all of the plurality of head suspension assemblies are not in vertical alignment, measuring at least one parameter of at least one head suspension assembly, then rotating each of the plurality of head suspension assemblies that are not in vertical alignment with the other head suspension assemblies about its pivot axis until the plurality of head suspension assemblies are vertically aligned.

Abstract: The present invention provides an assembly apparatus employing at least a robotic or automated assembly apparatus to manipulate the components to be assembled and at least a first vision alignment system to align the components prior to their assembly. An adhesive dispense system is provided to connect, attach or otherwise adhere the components together. In a method in accord with the present invention for assembling components, a source of the components is provided is located relative to a global reference system. The components held by the source are then located relative to the global reference system based upon the determined location of the source. An adhesive is dispensed onto a first of the components and a second component is manipulated into an initial attachment position relative to the first component.

Abstract: The present invention provides a method for the creation and removal of shunts for the prevention of ESD/EOS damage to electrical components. In one embodiment of the present invention, the conductive pathway is provided and removed by exposing the interconnect's carbonizable and ablatable substrate to a radiant energy source such as a laser beam. The present invention also provides for interconnects that include at least two conductive wires or leads engaged on at least one surface by a carbonizable and ablatable material. The conductive wires may each include a branched dead end lead portion interleaved with the branched dead end lead portion of the other. Alternatively, the conductive wires may extend in close proximity to each other in a curved or sinuous or serpentine or backtracking pattern.

Abstract: A trace interconnect assembly designed for transmitting electrical signals to and from a head assembly in a hard disk drive is disclosed. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.

Abstract: An apparatus and method for determining and adjusting the static attitude of a head suspension or a head suspension assembly for use in a dynamic storage device. An apparatus in accordance with the present invention includes a workpiece support and an adjust device, operatively positioned with respect to the workpiece support, for adjusting the head suspension. The adjust device includes first and second clamp portions for restraining a gimbal arm and an adjust body for deforming the restrained gimbal arm while the gimbal arm is restrained by the first and second clamp portions.

Abstract: The present invention provides apparatus for measurement of suspension assembly component position and static attitude and for adjustment thereof. An apparatus in accord with the present invention includes modules for the measurment and adjustment of the gimbal portion of suspensions, FSAs, and HGAs.

Abstract: The present invention provides an interconnect useful for the prevention of ESD/EOS damage to electrical components. The present invention provides for interconnects that include at least two conductive wires or leads engaged on at least one surface by a carbonizable and ablatable material. The conductive wires may each include a branched dead end lead portion interleaved with the branched dead end lead portion of the other. Alternatively, the conductive wires may extend in close proximity to each other in a curved or sinuous or serpentine or backtracking pattern. An interconnect in accord with the present invention may include a substrate substantially supporting the conductive wires except at predetermined locations or proposed stint sites wherein there is at least one through hole in the substrate.

Abstract: The present invention provides a tray for holding components having first and second sides, wherein the first side has at least one first component receptacle for engaging said component; and the second side has at least one component engaging member, and further wherein the first component receptacle and the component engaging member are aligned such that when multiples of the tray are stacked upon each other the first component receptacle and the component engaging member will cooperate to restrain the motion of the component relative to the tray. In such an embodiment the component will have first and second engagement surfaces and the first component receptacle will engage the first component engagement surface and the component engaging member will engage the second component engagement surface.

Abstract: The present invention provides a method for assembling a head gimbal assembly useful in a hard disk drive and for testing such an assembly. In a method in accord with the present invention a head/slider is mounted to a circuited gimbal in an automated assembly machine. Following this step the head/slider circuited gimbal assembly will be subjected a dynamic electrical test with those head/slider circuited gimbal assemblies not passing being sorted from the lot. Following this step the head/slider circuited assembly will be attached to a suspension.

Abstract: A head suspension including a one-piece load beam and flexure structure wherein the flexure structure includes partially etched connecting bars. The load beam and flexure structure is fabricated from a single piece of spring steel, and the structure comprises a rigid region, a mounting region on a proximal end of the rigid region, and a flexure region. The flexure region has a planar support region and an integral flexure, and the integral flexure includes a slider-receiving region and connecting bars that connect the slider-receiving region to the support region of the integral flexure. A head slider is mounted to the slider-receiving region. The connecting bars of the integral flexure are thinned by partial etching in order to reduce the stiffness of the connecting bars, and thereby allow the head slider to gimbal in response to aerodynamic forces.

Abstract: The present invention provides an assembly system employing at least a robotic or automated assembly apparatus to manipulate the components to be assembled and at least a first vision alignment system to align the components prior to their assembly. An adhesive dispense system is provided to connect, attach or otherwise adhere the components together. In a method in accord with the present invention for assembling components, a source of the components is provided is located relative to a global reference system. The components held by the source are then located relative to the global reference system based upon the determined location of the source. An adhesive is dispensed onto a first of the components and a second component is manipulated into an initial attachment position relative to the first component.

Abstract: The present invention provides an assembly system employing at least a robotic or automated assembly apparatus to manipulate the components to be assembled and at least a first vision alignment system to align the components prior to their assembly. An adhesive dispense system is provided to connect, attach or otherwise adhere the components together. In a method in accord with the present invention for assembling components, a source of the components is provided is located relative to a global reference system. The components held by the source are then located relative to the global reference system based upon the determined location of the source. An adhesive is dispensed onto a first of the components and a second component is manipulated into an initial attachment position relative to the first component.

Abstract: The present invention provides a method for the creation and removal of shunts for the prevention of ESD/EOS damage to electrical components. In one embodiment of the present invention, the conductive pathway is provided and removed by exposing the interconnect's carbonizable and ablatable substrate to a radiant energy source such as a laser beam. The present invention also provides for interconnects that include at least two conductive wires or leads engaged on at least one surface by a carbonizable and ablatable material. The conductive wires may each include a branched dead end lead portion interleaved with the branched dead end lead portion of the other. Alternatively, the conductive wires may extend in close proximity to each other in a curved or sinuous or serpentine or backtracking pattern.

Abstract: A trace interconnect assembly is designed for transmitting electrical signals to and from a head assembly in a hard disk drive. The interconnect assembly includes one or more single-layer thin, elongated, and generally flat substrate-free trace interconnects. The trace interconnects are new conductors etched out of a planar length of preferably a high tensile and high yield strength metal such as beryllium copper. They are shaped to match the surface topology of the suspension assembly. Trace interconnects have a rigid region and flexible regions that match a rigid region and flexible regions in the suspension assembly. Different additional elements include support braces, standoffs, trace tangs, bond pads, and stacked interconnects. Coupling a head assembly to the interconnect assembly creates a head interconnect harness. Methods of manufacture for the trace interconnect assembly, a multi-conductor stacked version, a head suspension assembly, and the head interconnect harness are disclosed.