Abstract: A secure electronic component assembly is described herein for ensuring the physical integrity of an integrated circuit (IC). The secure electronic component assembly may comprise a printed circuit board (PCB), an integrated circuit (IC) mounted on the PCB, and an underfill material disposed between the IC and the PCB. The underfill material comprises a detection agent that is configured to change a state of the IC in response to exposure to an external environment, wherein the change in the state of the IC is indicative of a tamper condition.

Abstract: Approaches presented herein provide for the dynamic and intelligent management of issues, such as memory or link errors, identified during execution of large processing jobs performed using a number of computing resources. A number of processing units can be logically interconnected to function as a single large processing unit, with a unified memory address space and interface structure as part of a coherent fabric. When an error is detected in an individual processing unit or link, for example, a determination can be made as to the scope of the error, and an attempt can be made to contain the error to allow performance of the job to continue uninterrupted using the remaining resources of the fabric. This may include determining a resource or section of memory to be masked off from further usage, then automatically remapping the address space or otherwise updating information for the coherent fabric to allow for continued operation.

Abstract: Persistent displays such as E-ink persistent displays can convey information related to hardware components such as servers, GPUs, and network switches, regardless of the operational status or power state of those displays. The displays can store data, including error codes, status information, and configuration details from connected hardware. Additionally, the persistent display systems allow for dynamic updates by users or administrators.

Abstract: A system for manufacturing an object includes a non-transitory storage device and a processor coupled to the non-transitory storage device. The processor is configured to determine a value of an attribute of a first component of the object; determine, using a machine learning model and based on the value, a manufacturing parameter for performing a manufacturing operation with respect to a second component that is functionally interrelated with the first component; and provide instructions for manufacturing the object by performing the manufacturing operation according to the manufacturing parameter to generate the second component.

Abstract: Systems and methods disclosed herein are for a connector having a ground cage receptacle which may be around at least a barrel section of the connector. The barrel section may include a pin and a spring to transmit a data signal. The ground cage receptacle may couple to a receiving cage receptacle of a circuit board to provide a ground reference for the data signal. The pin may extend from or retract into the barrel section based in part at least one stop feature associated with a receiving cage receptacle. The stop feature may hold the ground cage receptacle at a predetermined position with respect to the receiving cage receptacle. The stop feature may allow the pin to contact a signal surface contact pad on the circuit board for transmission of the data signal to the circuit board.

Abstract: Systems and methods disclosed herein are for a connector having a lead section and a barrel section. The barrel section may be formed from a portion of the lead section and may include a pin and a spring. The pin may extend from or retract into the barrel section based in part on an interface with the spring. The pin may contact a surface contact pad on a circuit board to pass signals from the circuit board through the connector.

Abstract: Systems and methods disclosed herein are for a protected connector having protruding pins and a compliant mechanical trigger. The compliant mechanical trigger may include a fixed section and a compliant section which is around the fixed section. The compliant section may protect the pins. The compliant mechanical trigger may align with and couple to a receiving element of a circuit board. The compliant section may be moved relative to the fixed section by at least the receiving element. The movement may expose and allow the pins to couple to a protected receiving connector having the receiving element and to a surface contact pad of the circuit board.

Abstract: A server tray is provided that includes a sensing element and a controller circuit. The sensing element is configured to detect initiation of a power supply removal. The controller circuit is configured to initiate a controlled power down sequence for the server tray responsive to a defined eject state being detected by the sensing element.

Abstract: A high-efficiency cooling system for a compute system comprises a compute tray cooling system and a switch tray cooling system. The compute tray cooling system comprises a plurality of fans and a T-shaped heat sink bank secured to a substrate of the compute tray. The switch tray cooling system comprises an external fan bank to direct air flow through a plurality of switch trays. The compute tray cooling system and the switch tray cooling system operate in tandem to provide optimal cooling for the compute system, which may selectively active the switch tray cooling system depending on whether compute resources within the switch tray are active.

Abstract: A server rack includes an optical patch panel and a plurality of processing units. The optical patch panel includes a plurality of L1 connections, a plurality of L2 connections, and a removable connectivity cartridge optically connecting the plurality of L1 connections and the plurality of L2 connections. The plurality of processing units is connected to an L2 domain of a datacenter through the removable connectivity cartridge of the optical patch panel.

Abstract: Embodiments provide for monitoring one or more datacenter performance metrics of a datacenter during a plurality of maintenance events, determining one or more actions using an artificial intelligence model to improve at least one datacenter performance metric, and initiating the one or more actions using a robotic mechanism at a defined location within the datacenter.

Abstract: According to an aspect of the present disclosure, a power management module configured for powering a server tray is provided. In an example embodiment, the power management module includes a housing; a busbar connector extending from a first side of the housing; power management circuitry; and a tray connector accessible via a second side of the housing. The power management circuitry includes at least one fuse component, and is in electrical communication with the busbar connector. The tray connector is configured to provide electrical power to the server tray.

Abstract: A server rack is provided that includes a plurality of tray support structures each configured to support a tray. Each support structure accommodates a selected one of air cooling or liquid cooling of the tray supported by the support structure.

Abstract: According to an aspect of the present disclosure, a tray is provided that includes a plurality of groups of processing units. Each group of processing units includes one or more processing units in communication with one another. In certain embodiments, communication between pairs of groups of processing units is enabled by an on-tray communication bridge. Each of the one or more processing units are one of a CPU, GPU, DPU, QPU, PPU and/or the like.

Abstract: Thermal management systems and associated methods are provided with acoustic isolation. An example system includes a computing device that defines a first housing supporting one or more processing units and a thermal management system. The thermal management system includes a pressure generation mechanism and one or more cooling conduits operably coupled with the pressure generation mechanism, and the one or more cooling conduits provide fluid communication between the computing device and the pressure generation mechanism. The pressure generation mechanism causes circulation of cooling fluid to the computing device via the one or more cooling conduits so as to dissipate heat generated by the one or more processing units, and the pressure generation mechanism is acoustically isolated from the computing device.

Abstract: Approaches presented herein provide for automated management of operational systems, such as cooling and power systems, for a computing environment such as a data center. A secondary coolant distribution unit (CDU) can be connected to a cooling loop to allow for cutover from coolant flow from a primary CDU, which can allow for tasks such as coolant cleaning or replacement without having to power down the electronic components being cooled by the coolant flow. The cooling system can also be used to cure thermal interface materials (TIMs) by heating the flow of liquid through the cooling system to at least one target temperature over a period of time according to a curing profile.

Abstract: Approaches presented herein provide for automated management of operational systems, such as cooling and power systems, for a computing environment such as a data center. A secondary coolant distribution unit (CDU) can be connected to a cooling loop to allow for cutover from coolant flow from a primary CDU, which can allow for tasks such as coolant cleaning or replacement without having to power down the electronic components being cooled by the coolant flow. The cooling system can also be used to cure thermal interface materials (TIMs) by heating the flow of liquid through the cooling system to at least one target temperature over a period of time according to a curing profile.

Abstract: Approaches presented herein provide for automated management of operational systems, such as cooling and power systems, for a computing environment such as a data center. A secondary coolant distribution unit (CDU) can be connected to a cooling loop to allow for cutover from coolant flow from a primary CDU, which can allow for tasks such as coolant cleaning or replacement without having to power down the electronic components being cooled by the coolant flow. The cooling system can also be used to cure thermal interface materials (TIMs) by heating the flow of liquid through the cooling system to at least one target temperature over a period of time according to a curing profile.

Abstract: Systems and methods are directed a leak detection system that incorporates one or more chemical sensors to detect small quantities of leaks. The leak detection system may localized chemical sensors to detect leakage within a specific sub-volume of an enclosure. The one or more chemical sensors may be configured to detect an additive incorporated into cooling fluid.

Abstract: Systems and methods disclosed herein can be used to determine an architecture of a data center based on one or more criteria. A system generates a digital representation of a data center, simulates how the digitally represented data center would perform under a certain workflow, and determines which of the simulated data centers satisfies the one or more criteria.