Abstract: Devices, apparatuses, and systems for thermal management in networking and computing systems are provided. An example in-rack thermal management system includes a cooling distribution unit (CDU) that includes a housing that defines a fluid inlet and a fluid outlet, thermal management components supported by the housing, and direct mechanical connections coupled with the fluid inlet and the fluid outlet. The in-rack thermal management system includes a fluid distribution system that includes a primary fluid channel directly coupled with the direct mechanical connection of the fluid inlet, and a secondary fluid channel directly coupled with the direct mechanical connection of the fluid outlet. In operation, the thermal management components dissipate heat of a fluid received by the CDU via the fluid inlet. The direct mechanical connections directly interface with the fluid distribution system to provide fluid communication between the CDU and the fluid distribution system to maximize dimensions of the housing.

Abstract: A secure electronic component assembly is described herein for ensuring the physical integrity of an integrated circuit (IC). The secure electronic component assembly may comprise a printed circuit board (PCB), an integrated circuit (IC) mounted on the PCB, and an underfill material disposed between the IC and the PCB. The underfill material comprises a detection agent that is configured to change a state of the IC in response to exposure to an external environment, wherein the change in the state of the IC is indicative of a tamper condition.

Abstract: Methods are described herein for manufacturing multi-component objects using artificial intelligence. The present invention may be directed to a method that includes determining an actual value of a first attribute of a first component of an object and determining, using a machine learning model and based on the actual value of the first attribute, an optimized value for a second attribute of a second component that is functionally interrelated to the first component in the object. The method may include selecting, from a plurality of second components each having a value for the second attribute within a tolerance range, a second component having the optimized value for the second attribute. The method may further include manufacturing the object using the first component and the selected second component.

Abstract: Apparatuses, systems, and methods for verifying fingerprints associated with components to be installed on printed circuit boards (PCBs). In at least one embodiment, one or more processors determine whether a component fingerprint associated with a component to be installed on the PCB corresponds to an expected fingerprint, the component fingerprint based, at least in part, on a firmware version associated with the component.

Abstract: Systems, computer program products, and methods are described herein for intelligent intelligently designing and reconfiguring data centers. For example, a system may be an artificial-intelligence-based system for designing and reconfiguring data centers based on user inquiries. The system may receive inquiries from users requesting a design for a data center having particular performance characteristics (e.g., selected performance characteristics), changes to an existing design of a data center, information about a data center, and/or the like. The inquiries may be text-based or audio and in the form of natural language questions or commands. The system may use two machine learning models, namely a knowledge base model and a ranking model. The system may use the knowledge base model to determine solutions to user inquiries and then use the ranking model to determine rankings for the solutions.

Abstract: Thermal management systems and associated methods are provided with acoustic isolation. An example system includes a computing device that defines a first housing supporting one or more processing units and a thermal management system. The thermal management system includes a pressure generation mechanism and one or more cooling conduits operably coupled with the pressure generation mechanism, and the one or more cooling conduits provide fluid communication between the computing device and the pressure generation mechanism. The pressure generation mechanism causes circulation of cooling fluid to the computing device via the one or more cooling conduits so as to dissipate heat generated by the one or more processing units, and the pressure generation mechanism is acoustically isolated from the computing device.

Abstract: Systems, methods, and computer program products are provided for asset identification and visualization. An example method includes receiving a request for asset visualization that is associated with a plurality of distributed datacenter computing components associated with disparate physical datacenter installations and determining location data for the distributed datacenter computing components. The method further includes generating the asset visualization for presentation to a user associated with the request. The asset visualization is a digital representation of the disparate physical datacenter installations including a visual representation of a presence of the distributed datacenter computing components associated with each disparate physical datacenter installation. The method may render the asset visualization in a virtual reality (VR) environment and/or as an augmented reality (AR) overlay via a user device associated with the user.

Abstract: Some embodiments described herein provide intelligent movable racks for a data center and a central system for monitoring and directing the positioning of such racks within the data center. For example, a rack may include computing equipment as well as a power system, a cooling system, and a cabling system (e.g., for data communication). The rack may include a controller in communication with the computing equipment, the power system, the cooling system, and the cabling system. The rack may also include a rack interface for physically supporting the rack and operatively connecting the systems of the rack to power, cooling, and cabling infrastructure of the data center. The rack interface may receive an autonomous robot for moving the rack within the data center. The controller may control the power system and the cooling system based in part on the autonomous movement of the rack.

Abstract: Devices and methods for physical chip security are disclosed. In at least one embodiment, a security module is secured to a board to restrict physical access to an integrated circuit mounted on the security module and provides one or more contacts enabling data access to the integrated circuit.

Abstract: Devices and methods to update semiconductor components are disclosed. In at least one embodiment, a device updates semiconductor components independent of a semiconductor component operational state.

Abstract: Configurations for interface panels are disclosed. In at least one embodiment, an interface panel includes removable receptacles to provide communication to rack components.

Abstract: Configurations for communication interfaces are disclosed. In at least one embodiment, a processor includes one or more circuits to determine a firmware configuration for one or more server components and to transmit the firmware configuration at startup.

Abstract: Apparatuses, systems, and methods to move end connectors. In at least one embodiment, a linkage system to move an end connector between at least a first position and a second position is driven by an actuator in a first direction to drive movement of the end connector in a second direction, perpendicular to the first direction.

Abstract: Systems and methods integrate different portions of a design review, such as files from a variety of different sources, into an interaction environment for review and interaction by a number of reviewing parties. The reviewing parties interact through an interface that is different from a native software of the files. An automated design review may be performed to evaluate a common rendering, formed from the files, for one or more conflicts, including interferences or version errors.

Abstract: Configurations for rack connection systems are disclosed. In at least one embodiment, installation locations for one or more cables are determined and one or more indicators corresponding to installation locations are activated.

Abstract: While one type of input, either a mouse input or a joystick input, may be preferred for one type of a game, it may not be preferred, or even compatible, for another type of a game. Introduced herein is a game controller that employs a dedicated input, which is capable of the absolute accuracy of a mouse input or trackball input, but is also capable of measuring how far off center the input is (e.g., how far off center it has moved), and can also return to center when released, as is present in a joystick input. The introduced game controller integrates a touch sensing trackball to enjoy the benefits of both the mouse type input and joystick type input, in a single dedicated input, providing a user freedom to play any type of game without worrying about the compatibility of their game controllers.

Abstract: Configurations for data center component monitoring are disclosed. In at least one embodiment, movement of a server component is determined based on sensor data and the movement is used to diagnose a root cause for a server component failure.

Abstract: Apparatuses, systems, and methods to perform diagnostic evaluation of data center data. In at least one embodiment, one or more processors determine one or more diagnostic results based, at least in part, on a trained application model to receive homomorphically encrypted log data and to execute the model with the homomorphically encrypted log data.

Abstract: Apparatuses, systems, and methods for verifying fingerprints associated with components to be installed on printed circuit boards (PCBs). In at least one embodiment, one or more processors determine whether a component fingerprint associated with a component to be installed on the PCB corresponds to an expected fingerprint, the component fingerprint based, at least in part, on a firmware version associated with the component.